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Actel’s CEO John East to Deliver Keynote Address at ESC Boston 2010

MOUNTAIN VIEW, Calif., September 20, 2010 — Actel Corporation (NASDAQ: ACTL) today announced that its CEO, John East, will deliver a keynote address at the 2010 Embedded Systems Conference (ESC) Boston on September 22nd. East’s keynote address, CONVERGENCE: The Prequel, will highlight the trend towards smaller and smarter designs in the electronics industry. Tapping into nearly 40 years of experience, East will share some of the lessons he learned and wisdom to be passed on by those who participated him in the creation of the electronics industry as we know it.

< … Read More → "Actel’s CEO John East to Deliver Keynote Address at ESC Boston 2010"

Visit Actel at RADECS 2010

WHAT:  Actel Corporation (Nasdaq: ACTL) will participate in the 11th European Conference on Radiation and its Effects on Components and Systems (RADECS). The conference features a technical program dedicated to the latest developments and experimental observations related to radiation effects on electronic and photonic components as well as on devices and systems. During the industrial exhibition, Actel will showcase its recently qualified FPGAs for space applications , RTAX-DSP and RT ProASIC®3 .

Technical Program Participation

Session F:  Single Event Effects–Devices and Integrated Circuits

Wednesday, September 22, 2010

< … Read More → "Visit Actel at RADECS 2010"

NXP’s 150 MHz LPC1800 MCU Delivers Industry’s Highest ARM Cortex-M3 Performance

EINDHOVEN, NETHERLANDS and SAN JOSE, CA–(Marketwire – September 20, 2010) – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of the industry’s highest performance ARM® Cortex™-M3 microcontroller. The LPC1800 is optimized for low power operation at very low frequencies all the way through to 150MHz maximum performance from either Flash or RAM. This performance provides maximum connectivity and bandwidth options for a wide range of demanding applications. The flexible dual-bank 256-bit wide Flash memories can be used for concurrent write/read operations, allowing “ … Read More → "NXP’s 150 MHz LPC1800 MCU Delivers Industry’s Highest ARM Cortex-M3 Performance"

Leading SBC Provider Launches First Commercial System Based on New Generation Texas Instruments Processors at ESC Boston

Boston, MA (Sept 21, 2010) – InHand Electronics, a leading provider of low-power embedded systems and designs for OEMs of mobile devices, today launches their new line of standard single board computers (SBC) based on Texas Instruments’(TI) DaVinci™ DM3730 video processor and Sitara™ AM3703 ARM® microprocessors (MPUs). At 2.5 inches squared, their smallest standard system to date, the Apeiron line will offer the InHand Fury, based on TI’s DaVinci DM3730 video processor, and Siren, based on TI’s Sitara AM3703 MPU. Fury and Siren are the first production quality systems available, based on the … Read More → "Leading SBC Provider Launches First Commercial System Based on New Generation Texas Instruments Processors at ESC Boston"

Adeneo Embedded expands its reach in the Tablet design HMI panel market

Bellevue, USA, September 20th, 2010 – Adeneo Embedded, the Microsoft Windows Embedded Gold Partner awarded “Windows Embedded Training Partner of the Year” and “Windows Embedded Systems Integrator of the Year” for both 2008 and 2009 in North America and Europe, announced the immediate availability of the Board Support Packages (BSP) with fully integrated Wireless stack for the PTI FlashBoard on Microsoft Windows Embedded Compact. 

The PTI FlashBoard is a new low cost development board providing extensive multimedia and wireless communication capabilities … Read More → "Adeneo Embedded expands its reach in the Tablet design HMI panel market"

New Synopsys HSPICE Precision Parallel Technology Delivers Up to 7X Speed-up for Analog/Mixed-Signal Designs

MOUNTAIN VIEW, Calif.Sept. 20 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today unveiled new HSPICE® Precision Parallel (HPP) multi-threading technology that delivers up to 7X simulation speed-up for complex analog and mixed-signal designs. In addition to the new HPP technology, the HSPICE 2010 solution includes enhanced convergence algorithms, advanced analog analysis features and foundry-qualified support for process design kits (PDKs) that extend HSPICE gold-standard accuracy to the verification of complex circuits such as phase-locked loops, SERDES, data converters, … Read More → "New Synopsys HSPICE Precision Parallel Technology Delivers Up to 7X Speed-up for Analog/Mixed-Signal Designs"

Actel Invites You to Design Fearlessly at ESC Boston 2010

MOUNTAIN VIEW, Calif., Sept. 16 /PRNewswire/ — WHAT: Actel Corporation (NASDAQ:ACTL) will show attendees how to design fearlessly with SmartFusion™ intelligent mixed signal FPGAs, at the 2010 Embedded Systems Conference (ESC) Boston.

By participating in demonstrations and workshops, guests will learn how integrating an FPGA, embedded processor and programmable analog gives designers the freedom and flexibility to continually push their designs further.

Booth Demonstrations:

TRENDnet Launches Two New Power Saving Gigabit GREENnetT Switches

TORRANCE, Calif. -September 16, 2010 – TRENDnet, a best-in-class wired and wireless networking hardware brand, today announces the availability of the 16-Port Gigabit GREENnet Switch, model TEG-S16Dg, and the 24-Port Gigabit GREENnet Switch, model TEG-S24Dg, which feature TRENDnet’s embedded power saving GREENnetT technology.

GREENnetT is a TRENDnet switch-based technology that determines and supplies the appropriate amount of electrical power to each hardwired switching port as required by the connected device, by the port, or by the length of the connected Ethernet cable. GREENnetT technology … Read More → "TRENDnet Launches Two New Power Saving Gigabit GREENnetT Switches"

VIA Kick-Starts the USB 3.0 Revolution, Brings Next Generation Super-Speed to USB Flash Drives

TAIPEI, TAIWAN, September 16, 2010 -VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its latest USB 3.0 product, the VIA Labs VL750 Super-Speed USB to NAND flash controller, a revolutionary single-chip solution for the next generation of USB flash drives. The VIA Labs VL750 is the first of its kind in the world, featuring a 4-channel memory controller with interleaving support to offer consumers blisteringly fast data transfer speeds of 100MB/s or more, depending on configuration. 

The VIA Labs VL750’s four channel design dramatically improves data throughput over dual or single … Read More → "VIA Kick-Starts the USB 3.0 Revolution, Brings Next Generation Super-Speed to USB Flash Drives"

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