Articles – Page 242

February 20, 2012

Semiconductor technology just gets curiouser and curiouser as feature sizes shrink. In real life, that means that EDA tools have to work harder and harder to figure out what’s going on and help engineers implement enormously complex designs. As usual, the problem can be boiled down to things that didn’t use to matter becoming a problem.

Of course, at the extremely tiny level anticipated by technologies like carbon nanotubes, things change completely. But that’s still research. Leading-edge designs today are still … Read More → "Real-World Issues at 28 nm"

Lattice Features New Products And Technologies For Embedded Design Applications

by Bryon Moyer

February 15, 2012

HILLSBORO, OR – FEBRUARY 15, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced its plans for Embedded World 2012, which will take place Feb 28^th – March 1^stin Nuremberg, Germany. Lattice will be exhibiting in Hall 5, Stand 142, and will be featuring among other things its recently announced LatticeECP4^TMfamily of devices.

On the stand there will be demonstrations of Lattice solutions for PCI Express and various camera solutions that are ideal for embedded, automotive and industrial applications.

PCIe Demonstrations</ … Read More → "Lattice Features New Products And Technologies For Embedded Design Applications"

A Platform for Reducing Verification Time and Improving Reliability of Embedded System Hardware

by Jim Turley

February 15, 2012

In this whitepaper the author reviews how leveraging in-system diagnostics during the prototype phase can assist engineers in overcoming the challenges design complexity exerts on product development, manufacturing, and overall time-to-market. Readers will gain insight into how they can replace today’s ad-hoc board level verification approaches with an ordered methodology that will enable designers to automatically validate their own hardware designs, optimize system performance, and simplify the process of integrating new hardware with new software. The paper concludes with a review of case studies that will provide valuable insight to … Read More → "A Platform for Reducing Verification Time and Improving Reliability of Embedded System Hardware"

austriamicrosystems releases new version of its best-in-class process design kit for 0.35 µm specialty processes

by Bryon Moyer

February 15, 2012

Unterpremstaetten, Austria (February 15, 2012) – austriamicrosystems (SIX: AMS) Full Service Foundry business unit today announced the availability of a new analog/mixed signal high performance process design kit (“HIT-Kit”) for its 0.35 µm CMOS, High-Voltage CMOS and SiGe-BiCMOS specialty technologies.

Based on Cadence® Virtuoso® Custom IC technology, the new HIT-Kit significantly improves the time to market for highly competitive products in the analog intensive mixed signal arena. Supporting designers in creating their first-time-right mixed signal designs, even for complex designs, this comprehensive design environment with its highly accurate simulation models and flexible SKILL-based PCells provides … Read More → "austriamicrosystems releases new version of its best-in-class process design kit for 0.35 µm specialty processes"

Mercury’s New Small Form Factor Mixed Signal Modules Deliver Unmatched Capabilities for EW and SIGINT Applications

by Bryon Moyer

February 15, 2012

CHELMSFORD, Mass. — February 14, 2012 — Mercury Computer Systems, Inc. (NASDAQ: MRCY, www.mc.com), a trusted provider of commercially developed, application-ready ISR and EW subsystems for defense prime contractors, announced two new small form factor-based solutions with outstanding SWaP characteristics for demanding RF applications: the Echotek® Series RFM-251-XMC Tuner and the Wideband DCM-V6-XMC Digital Transceiver. These new mixed-signal modules detect, locate and capture signals in real-time across an extremely wide range of frequencies, significantly improving the ability to anticipate threats and protect warfighters.</ … Read More → "Mercury’s New Small Form Factor Mixed Signal Modules Deliver Unmatched Capabilities for EW and SIGINT Applications"

The Three Laws of Robotics

Embedded Developers Could Learn a Lot from Asimov

by Jim Turley

February 15, 2012

In Isaac Asimov’s wonderful books, he creates the Three Laws of Robotics. (He later added a zeroth law, but we’ll skip over that for now.) You probably already know them by heart, but the first law for all robots was, “never injure a human or, through inaction, allow a human to come to harm.” It was the cybernetic equivalent of the Hippocratic Oath: “First, do no harm.”

The Second Law was, “always obey orders, unless it conflicts with the First Law.” Okay, pretty straightforward, that one. Do … Read More → "The Three Laws of Robotics"

They Want Your Brains

EDA is Not Quite Dead After All

by Kevin Morris

February 14, 2012

When companies become zombies, it’s not quite as obvious as with humans. Sure, the symptoms are similar – being dead but walking around as if still alive, no capacity for rational thought, pursuit of a single-minded hunger – all while the inside is rapidly decomposing. Oh, and then there’s the smell.

The Moore’s Law apocalypse is taking place in the world of custom chip design right now, and by all rights EDA companies should be among the walking dead – mindlessly scouring the engineering countryside for leftover morsels of brains. Electronic system design should … Read More → "They Want Your Brains"

Renesas Electronics Introduces New V850 Microcontroller (MCU) Series with Very Low Power Consumption and High Functionality for Body Applications in the Automotive Segment

by Bryon Moyer

February 14, 2012

Dusseldorf, February 14, 2012 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced the development of the V850E2/Fx4-L series with 19 new 32-bit microcontrollers (MCUs). Designed for the automotive comfort and body segment, the low-power MCUs offer scalability and compatibility combined with sophisticated peripheral functions to provide premium automotive body solutions for applications such as roof or window lifters, door-, seat- and light modules, HVAC (heating, ventilation, and air conditioning) and body control modules.

The new V850-based MCU series enables very … Read More → "Renesas Electronics Introduces New V850 Microcontroller (MCU) Series with Very Low Power Consumption and High Functionality for Body Applications in the Automotive Segment"

Someone to Take the Lead

by Bryon Moyer

February 13, 2012

We live in an environment that celebrates innovation and new products. The idea-makes-millionaire story can prove itself out (although more in the breach, quietly, than the noisy observance), and that – as well as the sheer thrill of seeing a vision through to fruition, with money as gravy – powers the numerous technology teams around the world.

But if you’re doing something new, a lot of stars need to align in order for you to achieve success.

You must correctly identify a problem.
That problem must cause enough pain to … Read More → "Someone to Take the Lead"

Renesas Electronics Europe Announces New High-Speed Optocouplers Offering Extended Operating Temperature Range Combined with High Isolation and Shielding Features

by Bryon Moyer

February 9, 2012

Dusseldorf, February 9, 2012 – Renesas Electronics Europe , a premier supplier of advanced semiconductor solutions, today announced the availability of two new high-performance optocouplers, the PS9324 and the PS9123, for industrial and motor control applications. The new high-speed optocouplers are designed for 10 megabits per second (Mbps) high-speed operation over an extended temperature range: between -40°C and 100°C for the PS9123 series and up to 110°C for the PS9324 series. The new devices comply with international safety standards such as UL, CSA … Read More → "Renesas Electronics Europe Announces New High-Speed Optocouplers Offering Extended Operating Temperature Range Combined with High Isolation and Shielding Features"

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