SAN JOSE, Calif., July 26, 2010 — Magma® Design Automation (Nasdaq: LAVA), a provider of chip design software, today announced that Telairity, a supplier of innovative video compression solutions, has adopted the FineSim™ SPICE circuit simulator. Telairity is using FineSim SPICE to design innovative real-time video compression integrated circuits (ICs) and selected it because FineSim delivers SPICE-accurate results significantly faster than competitive products. 

“Telairity provides a range of video compression solutions to meet the varied requirements of our customer base,” said Richard Dickson, president of Telairity. “FineSim SPICE provides the fastest and most accurate circuit simulation, which improves the efficiency of our design flow and enables us to get our next generation of MPEG-4 (H.264/AVC) encoders to market more quickly.” 

“FineSim defines a new paradigm in circuit simulation,” said Anirudh Devgan, general manager of Magma’s Custom Design Business Unit. “Leveraging an improved architecture, better numerical solvers and a single CPU, FineSim SPICE delivers 3 to 10 times better performance than existing commercial SPICE simulators. FineSim SPICE’s multi-CPU simulation can deliver 30 times better performance than other single-CPU SPICE products.” 

FineSim SPICE: Fast and Accurate Simulation

FineSim SPICE is a SPICE-level simulation analysis tool that incorporates transistor-level simulation analysis capabilities for mixed-signal and analog designs. FineSim SPICE is a full SPICE simulation engine with distributed processing that enables customers to simulate large-scale mixed-signal system chips at the transistor level. By providing increased speed and capacity while maintaining full SPICE accuracy, FineSim SPICE enables designers to simulate advanced circuits – such as PLLs, ADCs (analog-to-digital converters), DACs (digital-to-analog converters) and gigahertz SERDES (SERializer/DESerializer) – that they previously would not even attempt using slower traditional SPICE simulators. 

About Magma

Magma’s electronic design automation (EDA) software provides the “Fastest Path to Silicon”™ and enables the world’s top chip companies to create high-performance integrated circuits (ICs) for cellular telephones, electronic games, WiFi, MP3 players, digital video, networking and other electronic applications. Magma products are used in IC implementation, analog/mixed-signal design, analysis, physical verification, circuit simulation and characterization. The company maintains headquarters in San Jose, Calif., and offices throughout North America, Europe, Japan, Asia and India. Magma’s stock trades on Nasdaq under the ticker symbol LAVA. Follow Magma on Twitter at www.Twitter.com/MagmaEDA and on Facebook at www.Facebook.com/Magma. Visit Magma Design Automation on the Web at www.magma-da.com

COLORADO SPRINGS, CO – July 26, 2010 – Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of ferroelectric-based low-power memory and integrated semiconductor products, today announced the availability of commercial samples of its F-RAM enabled MaxArias™ wireless memory devices.  Ramtron’s MaxArias wireless memory products combine the low power, high speed, and high endurance features of nonvolatile F-RAM memory technology with industry standard wireless access to enable innovative mobile data collection capabilities. MaxArias is ideal for a wide range of applications such as high-value asset tracking, manufacturing and maintenance history collection, and smart utility metering, among others.

“We have been very pleased with the enthusiastic response that Ramtron’s MaxArias products have generated since their unveiling earlier this year,” said Dan Secrest, Ramtron’s marketing manager for MaxArias products. “The first devices in the MaxArias family offer on-chip, wireless high memory data storage and retrieval at far greater range with lower power than ever before. We believe this new capability will enhance productivity, lower costs, and improve supply chain efficiencies for a host of applications that have not been possible until now.”

Ramtron’s first family of MaxArias wireless memories combines up to 16-Kilobits of high-performance, nonvolatile F-RAM memory with the EPCglobal Class-1 Generation-2 UHF Air Interface Protocol Standard. When combined with an optimized antenna design, the MaxArias device powers up with energy harvested directly from the RF field.  Mainstream RFID tags offer only a few kilobits of memory and exhibit inherently slow performance.  Ramtron’s introductory MaxArias wireless memory offers up to 1,000 16-bit words of data on the IC. End users can benefit from the high-performance, high-capacity MaxArias device by storing and retrieving their valuable information such as manufacturing data, production number and date, configuration status, malfunctioning history, repair history, and even firmware revisions at a distance of up to 10 meters at very low power (-13dBm/-13dBm read/write sensitivity).

Ramtron’s MaxArias WM710xx family is ideal for applications spanning many industries including utilities, aircraft/industrial manufacturing, inventory control, maintenance tracking, building security, electronic toll collection, pharmaceutical tracking, and product authentication, among others. For more information about MaxArias wireless memory, a white paper and datasheets are available at http://www.ramtron.com/go/maxarias. For a 300-dpi product photo, visit www.ramtron.com/press-center/image-bank.aspx (see MaxArias Wireless Memory).

About Ramtron

Ramtron International Corporation, headquartered in Colorado Springs, Colorado, is a fabless semiconductor company that designs, develops and markets specialized semiconductor memory and integrated semiconductor solutions used in a wide range of product applications and markets worldwide. For more information, visit www.ramtron.com.