San Jose, Calif, January 12, 2010 – ADLINK Technology, Inc., a global provider of trusted embedded products, presented the Express-CB, the newest and most powerful member of the ADLINK Computer-on-Module (COM) family. The Express-CB is a COM Express™ Type 2 module supporting the 64-bit Intel® Core™ i7 / i5 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM57 Express chipset, the Express-CB is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.

Outstanding Integrated Graphics Capability

Integrated graphics support includes features such as OpenGL 2.1, DirectX10, and Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0). Graphics outputs include CRT, LVDS and Embedded DisplayPort. The Express-CB is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. Target applications include: Medical Diagnostic Equipment and Medical Imaging, Portable Medical Devices, Instrumentation, Industrial Automation, Transportation, Data Storage, Infotainment, Gaming, Video Preprocessing, POS and Kiosk.

Enhanced Overall Performance

Featuring the Intel® Core™ i7 / i5 processor supporting  Intel® Hyper-threading Technology (2 cores, 4 threads) and up to 8GB of DDR3 dual-channel memory at 1066 MHz, the Express-CB leads the ADLINK COM lineup in overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel® QM57 Express chipset.

“The Express-CB delivers faster multi-core processor technology that embedded applications require. With integrated high-definition graphics support on the Intel® processor, the Express-CB provides an enhanced graphics core and the required interface support for the embedded market,” explained Henk van Bremen, Product Director for ADLINK Embedded Product Center. “For customers who are searching for a fast time-to-market solution, the Express-CB offers them accelerated development process with high performance and long product life.” concluded van Bremen.

“The new Intel® Core i7 / i5 processor and Mobile Intel® QM57 Express chipset is an integrated two-chip solution that provides the necessary performance-boosting technologies, advanced power management capabilities, improved graphics performance, and enhanced I/O interface functionality needed to power ADLINK’s next-generation embedded solutions,” said Ryan Parker, director of marketing, Embedded and Communications Division, Intel® .

Express-CB Feature Set

The Express-CB has dual stacked SODIMM sockets for up to 8 GB DDR3 memory. The Intel® Mobile QM57 Express chipset integrates CRT and single/dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express® Graphics x16 (PEG x16) bus is available for discrete graphics expansion, Embedded DisplayPort, or general purpose x8, x4 or x1 PCI Express® connectivity.

The Express-CB features a single onboard Gigabit Ethernet port, up to eight USB 2.0 ports and four SATA 3 Gb/s ports with optional support for RAID 0/1/5/10. Additional storage interfaces include an optional SATA based Solid State Disk (8/16/32 GB), and a single IDE (PATA) channel. Legacy support is also provided for 32-bit PCI, LPC, SMBus and I2C. The module is equipped with an AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Availability

Samples of the Express-CB will be available to early access customers in limited quantities at the end of February 2010. Production quantities are expected to start shipping in Q2 2010.

ADLINK’s Full Computer-on-Module Product Line

ADLINK’s complete Computer-on-Module product family includes ETX® modules for PCI/ISA oriented designs and COM Express modules for PCI Express / PCI designs with optional legacy support through LPC. To evaluate or test our modules, prototype boards in ATX form factor are available.

Carrier Board Design and Manufacturing Support

ADLINK provides Schematics, mechanical files, design guides, R&D support, product review service and BIOS customization for companies that are doing their own carrier board design. ADLINK also offers full development and production services for those who wish to outsource their carrier board’s design and/or manufacturing.

Note: Intel and Intel Core are registered trademarks of the Intel Corporation in the U.S. and other countries.

About ADLINK

ADLINK Technology (www.adlinktech.com) provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded and Communications Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

Ottawa, Canada and Bristol, UK – January 13, 2010 – Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) IP cores, and Audium Semiconductor, a developer of highly efficient audio power amplifier integrated circuits, have announced the use of Sidense’s ultra-low-power SLP one-time programmable (OTP) memory in Audium’s recently announced high efficiency AS1001 audio power amplifier chip.  The Sidense OTP macro is used to predefine register defaults after a chip reset. 

While traditional Class D amplifiers only achieve optimum efficiency at or near full output power, the AS1001 amplifies an audio signal over the entire operating output power range and includes techniques to minimize both fixed losses and output-dependant variable losses.  At normal listening levels, the AS1001 is 20 times more efficient than a traditional Class D power amplifier. Operating from a nominal 1.5V power supply and delivering 100W peak power output,  the AS1001 is so efficient that battery-powered amplified loudspeakers, playing for three hours per day, can run for up to 10 months on a set of four ‘C’ batteries.  This high efficiency means a “greener” amplifier, since Audium technology greatly reduces carbon dioxide from power generation and pollution from battery production. 

“A highly efficient audio power amplifier such as the AS1001 will find use in many consumer products, so minimum power and low cost are essential attributes,” said Tom Schild, Vice President of Worldwide Sales for Sidense.  “The ultra-low power requirements and very small size of Sidense SLP macros are an ideal fit for Audium’s audio power amplifier OTP requirements.” 

“Optimizing the very high efficiency of our power amplifier ICs requires that every component used on the chips exhibit very low power dissipation,” said Huw Davies, Chief Commercial Officer for Audium.  “Sidense’s OTP macros combine very low power, a small footprint and ease of programming, which helped Audium develop the most efficient audio power amplifier over normal listening levels in the industry.” 

About Sidense

Sidense Corp. provides secure, very dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required and no impact on product yield.  The Company’s innovative one-transistor 1T-Fuse™ architecture provides the industry’s smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (NVM) IP solution.  With over 40 patents granted or pending, Sidense OTP provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications. 

Sidense OTP memory, embedded in over 80 customer designs, is available from 180nm down to 55nm and is scalable to 28nm and below.  The IP is offered at and has been adopted by all top-tier semiconductor foundries and selected IDMs.  Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic.  For more information, please visit www.sidense.com. 

About Audium Semiconductor

Audium designs, develops and markets audio power amplifier integrated circuits that are 20 times more power efficient than competing technologies at normal listening levels.

Utilizing our devices in consumer audio applications reduces power consumption, extends battery life, enables smaller form factors, cuts cost-of-ownership, reduces waste, and contributes towards a more sustainable environment, all without compromising system performance.  For more information, please visit www.audiumsemi.com.