editor's blog
Subscribe Now

2 Spicey?

Tanner just announced the integration of Berkeley Design Automation’s (BDA’s) FastSPICE into their flow. You may remember Tanner as a company that does things their own way, offering a full suite of tools for custom design. Including their own T-SPICE.

And their own T-SPICE doesn’t seem to be going away; it’s not being replaced by FastSPICE. I got a chance to talk about that with Vice President of Marketing and Business Strategy John Zuk to understand better what the strategy is for maintaining both. And, actually, it doesn’t hinge on anything technical or esoteric; it’s really much simpler than that: price/performance.

It’s hard to do SPICE (or any tool) to sign-off accuracy. It’s harder yet to get people to believe you have the accuracy for sign off. And it’s horrendously hard to keep up with the most aggressive nodes underway. (Yeah, much analog stays far back from those nodes, but custom digital chips like FPGAs tend to push as far as they can go.)

So it’s easy to imagine looking down the path of your own home-grown SPICE and think, “Wow, this isn’t gonna be easy.” Meanwhile, as they mulled their options, their customers even suggested collaboration with BDA. So they got in touch, aligned their release schedules, and worked out an integration.

At which point, you might easily think, OK, end of the road for T-SPICE. Except for one thing: Mr. Zuk says that they have plenty of customers that are happy with T-SPICE – and, in particular, its price, since it sells more modestly than does FastSPICE.

So they’re keeping them both. While they won’t be delving into the deepest dimensions with T-SPICE, they will still continue developing models and improving performance, so he says that it’s not a dead-end product. But for customers needing more accuracy and technology reach, they can get it with FastSPICE.

You can find more information on the announcement in their release

Leave a Reply

featured blogs
Sep 21, 2020
Technology is changing the strategies we use to do things - oh so fast that 2010 seems like a distant past- within many spaces -- including the way we do our current topic of interest - Timing... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Sep 21, 2020
Semicon, the world’s largest semiconductor conference and exhibition, is September 23-25 in Taiwan. Like most shows of its size and caliber, Semicon boasts a long and illustrious list of exhibitors (500+), and countless forums, symposiums, and workshops. Of course Semic...
Sep 18, 2020
[From the last episode: We put the various pieces of a memory together to show the whole thing.] Before we finally turn our memory discussion into an AI discussion, let'€™s take on one annoying little detail that I'€™ve referred to a few times, but have kept putting off. ...
Sep 16, 2020
In addition to the Great Highland (Scottish) bagpipes, the Uilleann (Irish) bagpipes, and the Northumbrian (English) bagpipes, there are myriad other offerings spanning the globe....

Featured Video

Four Ways to Improve Verification Performance and Throughput

Sponsored by Cadence Design Systems

Learn how to address your growing verification needs. Hear how Cadence Xcelium™ Logic Simulation improves your design’s performance and throughput: improving single-core engine performance, leveraging multi-core simulation, new features, and machine learning-optimized regression technology for up to 5X faster regressions.

Click here for more information about Xcelium Logic Simulation

Featured Paper

Designing highly efficient, powerful and fast EV charging stations

Sponsored by Texas Instruments

Scaling the necessary power for fast EV charging stations can be challenging. One solution is to use modular power converters stacked in parallel.

Learn More in our technical article

Featured Chalk Talk

Automotive MOSFET for the Transportation Market

Sponsored by Mouser Electronics and Infineon

MOSFETS are critical in automotive applications, where long-term reliability is paramount. But, do we really understand the failure rates and mechanisms in the devices we design in? In this episode of Chalk Talk, Amelia Dalton sits down with Jeff Darrow of Infineon to discuss the role of MOSFETS in transportation, solder inspection, qualification.

Click here for more information about Infineon Technologies OptiMOS™ 5 Power MOSFETs