The World According to FRAM

TI’s FRAM MCUs and ADI’s X-fest Demos

by Amelia Dalton

In this week’s Fish Fry, we take a fast tour of the world, with interesting stops in FRAM, high-speed ADCs, and remote RF transceivers. Don’t know what FRAM is? Fear not. Will Cooper from Texas Instruments tells us all about this amazing not-so-new non-volatile memory technology, which is really cool - even if I don’t quite agree with his basketball loyalties. Then we’re off to analog land with Robin Getz from Analog Devices where we chat about remote RF transceivers, high-speed ADCs, motor control demos, and a whole lot more. Check it out!  Read More


latest news

August 29, 2014

Triple Output 28VIN Step-Down µModule Regulator with Integrated Heatsink delivers 70W in 4.5cm²

VadaTech Announces Rugged MicroTCA.1 Subrack Chassis and Modules

August 28, 2014

Renesas Electronics New R-Car V2H Device Offers High-Resolution Image Recognition for Safer Driver Assistance Systems in Conventional and Emerging Self-Driving Vehicles

Leading European communications companies and research organizations have launched an EU project developing the future 5th Generation cellular mobile networks

Green Hills Software Announces Renesas Electronics’ R-Car Automotive Platform

Allegro Microsystems, LLC Introduces New Galvanically Isolated Current Sensor IC

Texas Instruments expands world’s lowest power microcontroller portfolio to take your metering, health and fitness and wearables designs to the next level

August 27, 2014

24V Triple Output Synchronous Step-Down Controller Features -55°C to 150°C Operating Junction Temperature Range

Renesas Electronics Introduces an IEC 61508 TÜV-Certified RX631, 63N Safety Package to Accelerate Implementation of Safety Systems for Industrial Equipment

TI brings 16-bit ADC precision performance to industrial control applications with new single-core C2000™ Delfino™ F2837xS microcontrollers

Full Compliance with Military Temperature Specification Planned for Altera 20nm FPGA and SoC Devices

August 26, 2014

TI introduces first fully integrated mono, Class-D audio amplifier for eCall, instrument cluster and telematics

Microchip’s New 2.4 GHz RF High-Power Amplifier Offers Low EVM and Current for 256-QAM and 802.11b/g/n; Extends Range of Ultra-High Data Rate WLANs

Dongbu HiTek Streamlines Touch Control for Smart Phones

August 22, 2014

Brainboxes introduces Ethernet module with independently configurable analogue inputs for remote monitoring applications

Embedded News Archive

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ASICs for the Rest of Us

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The Internet of Things is Going to Need a Lot of Juice

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Model-based Design and Physics-based Acceleration

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The Price of Ignorance

Let’s Get Rich Selling Overpriced Electronics!

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A Look at Key DDS Characteristics

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Editors' Blog

A New IoT Protocol

posted by Bryon Moyer

The Thread Group is trying to combine the best of WiFi, Bluetooth LE, and Zigbee. (14-Aug)

A PIC for the IoT

posted by Bryon Moyer

Microchip has announced a new microcontroller targeted at Things. (And a BLE module.) (13-Aug)

First Formal DDS Security

posted by Bryon Moyer

RTI Implements nascent OMG security standard. (11-Aug)

K is for Kit Kat

posted by Bryon Moyer

PNI Sensors updates SENtral for Android devices. (5-Aug)

A New IoT Platform: RuBAN

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Davra Networks focuses on far-away things that move. (3-Jul)

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forum

Cheap Chips

Posted on 09/02/14 at 3:12 AM by Dick Selwood

Dick Selwood
carlwh- I agree. But designers do generalise which is why ASIC is often not even thrown into the mix because of the perception of difficulty, time and cost.

Optimization Moves Up a Level

Posted on 09/01/14 at 12:57 PM by bmoyer

bmoyer
What do you think about Mentor's RTL-level optimization?

Cheap Chips

Posted on 08/29/14 at 8:25 AM by carlwh28

It’s an age old question, what to select for your design? ASIC, FPGA, standard parts, ASSP etc. Each will have its merits for a particular design and market requirements, that's why these solutions still exist, there is no one panacea.

What is importan…

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