editor's blog
Subscribe Now

On the Scene: Project Ara

The race hasn’t yet begun. In fact, we’re not even on the starting block, but the rule book for this race – the race to the next major innovative mobile platform (smartphone) has been drafted and teams are starting to assemble. Google’s Project Ara, the world’s first completely modular smartphone is coming, and the modules will be designed by… YOU! On your mark. Get set. Design!

 

Leave a Reply

featured blogs
Mar 18, 2024
Innovation in the AI and supercomputing domains is proceeding at a rapid pace, with each new advancement heralding a future more tightly interwoven with the threads of intelligence and computation. Cadence, with the release of its Millennium Platform, co-optimized with NVIDIA...
Mar 18, 2024
Cloud-based EDA tools are critical to accelerating AI chip design and verification; see how NeuReality leveraged cloud-based chip emulation for their 7NR1 NAPU.The post NeuReality Accelerates 7nm AI Chip Tape-Out with Cloud-Based Emulation appeared first on Chip Design....
Mar 5, 2024
Those clever chaps and chapesses at SiTime recently posted a blog: "Decoding Time: Why Leap Years Are Essential for Precision"...

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

Enabling the Evolution of E-mobility for Your Applications
The next generation of electric vehicles, including trucks, buses, construction and recreational vehicles will need connectivity solutions that are modular, scalable, high performance, and can operate in harsh environments. In this episode of Chalk Talk, Amelia Dalton and Daniel Domke from TE Connectivity examine design considerations for next generation e-mobility applications and the benefits that TE Connectivity’s PowerTube HVP-HD Connector Series bring to these designs.
Feb 28, 2024
2,727 views