industry news
Subscribe Now

Applied Materials Introduces High-Performance ALD Technology for the 3D Era

  • Innovative Olympia(TM) system positions Applied at the forefront of ALD* technology
  • Unique architecture expands portfolio of high-quality ALD films, enables critical low-temperature processes without compromising productivity
  • Systems installed at leading chipmakers for multiple logic and memory device applications

SANTA CLARA, Calif., July 13, 2015 – Applied Materials, Inc. today unveiled the Applied Olympia(TM) ALD system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips. The 3D device inflection is driving growth in ALD with demand for new patterning films, new conformal materials and lower thermal budgets. The Olympia system is well positioned to fulfill these requirements with uncompromising ALD performance, addressing industry needs with the process flexibility to precisely engineer and efficiently deposit a variety of low-temperature, high-quality films for multiple applications.

“Our Olympia system is a major technology innovation for the 3D device inflection,” said Dr. Mukund Srinivasan, vice president and general manager of Applied’s Dielectric Systems and Modules group. “The Olympia system overcomes fundamental limitations chipmakers are experiencing with conventional ALD technologies, such as reduced chemistry control of single-wafer solutions and long cycle times of furnaces. Because of this, we’re seeing strong market response with Olympia systems installed at multiple customers to support their move to 10nm and beyond.” 

The Olympia system’s adaptable modular architecture enables a uniquely flexible and rapid process sequence vital for controlling the more complex chemistries needed to develop the next generation of ALD films. Further, the modular design creates complete separation of chemistries, eliminating the pump/purge steps of conventional ALD technologies for improved productivity. The combined advantages of the Olympia system offer a superior solution to conventional ALD systems and position the tool for widespread adoption.  

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at www.appliedmaterials.com.

Leave a Reply

featured blogs
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Portenta C33
Sponsored by Mouser Electronics and Arduino and Renesas
In this episode of Chalk Talk, Marta Barbero from Arduino, Robert Nolf from Renesas, and Amelia Dalton explore how the Portenta C33 module can help you develop cost-effective, real-time applications. They also examine how the Arduino ecosystem supports innovation throughout the development lifecycle and the benefits that the RA6M5 microcontroller from Renesas brings to this solution.  
Nov 8, 2023
23,263 views