March 8, 2012
Carbon and Arteris Partner to Deliver Interconnect Models to SoC Designers
Joint Solution Enables Easy Creation, Import of Accurate Arteris FlexNoC Interconnect Models for Carbon SoCDesigner Plus
ACTON, MASS. –– March 8, 2011 –– Carbon Design Systems and Arteris, Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect intellectual property (IP) solutions, announced today they have implemented a partnership agreement that enables accurate models of Arteris NoC interconnect IP to be generated, managed and distributed using the Carbon IP Exchange web portal.
The joint Carbon/Arteris solution offers design teams a way to easily create and import accurate Arteris FlexNoC interconnect models for Carbon SoCDesigner Plus.
“We see strong demand for models of Arteris’ NoC interconnect IP,” states Bill Neifert, chief technology officer at Carbon Design Systems®, the leading supplier of virtual platform and secure model solutions. “ARM’s Cortex-A15 and Cortex-A9 microprocessor designers are pushing for better price, performance and area tradeoffs andthe SoC interconnect plays a vital role in serving this need. Our partnership with Arteris enables engineers to make architectural decisions and design tradeoffs based upon a 100%-accurate virtual representation.”
The new Carbon/Arteris flow allows Carbon’s SoCDesigner Plus users to use Arteris FlexNoC to configure their NoC interconnect fabric IP and then upload the configuration to Carbon IP Exchange. The web portal then creates a 100% accurate virtual model of the configuration and makes it available for download and use in SoCDesigner Plus.
“Simulation with virtual models of our NoC interconnect IP are the best way to make system-on-chip architectural optimizations and tradeoffs,” comments Kurt Shuler,Arteris’ vice president of marketing. “By partnering with Carbon to make 100% accurate models of our IP available on Carbon IP Exchange, we are empowering design teamsto utilize virtual models earlier in the design process.”
Carbon’s 100% accurate models of Arteris FlexNoC interconnect IP are available now from the Carbon IP Exchange web portal.
About Carbon Design Systems
Carbon Design Systems offers the industry’s only unified virtual platform solution along with the leading solution for accurate IP model creation. Carbon virtual platforms can execute at 100s of MIPS and with 100% accuracy to enable application software development, detailed architectural analysis and secure IP model distribution. Carbon’s solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, CASI, CADI and CAPI. Carbon’s customers are systems, semiconductor and IP companies that focus on wireless, networking, and consumer electronics. Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720. Telephone: (978) 264-7300. Facsimile: (978) 264-9990. Email: email@example.com. Website: www.carbondesignsystems.com.
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs. Founded by networking experts, Arteris operates globally with headquarters in Sunnyvale, Calif., and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.