fish fry
Subscribe Now

Making Waves (and Dust)

Have you ever had a project that you wanted to take out in the back 40 and smash to smithereens? No matter what you try, what route you take, what deadline you extend, it just ain’t working out right. Sometimes smashing your design to pieces is a good thing and makes you see that, in fact, something remarkable was sitting there the whole time and you just couldn’t see it the right way. In this week’s Fish Fry we’re checking out how a research team at Rice University smashed their silicon film design and, in the process, may have discovered a huge battery technology breakthrough. We’re also checking out the newest Raspberry Pi camera module released by RS Components and chatting with Mark Winters (Senior Director of the Qualcomm Tricorder X PRIZE and Nokia Sensing X CHALLENGE) about the trends in MEMS in medical and consumer devices, and what the Qualcomm Tricorder X PRIZE and the Nokia Sensing X CHALLENGE are all about.

Also this week, I announce my plans for December 8th and give away one more (this is your last chance!) Spartan-6 LX9 Microboards courtesy of Xilinx.

Listen to this episode
Download this episode (right click and save)

Fish Fry Links – November 16, 2012

More Information about “Lord of the Rings” Marathon Across the U.S. on December 8th

RS Components unveils world’s first demonstration of the Raspberry Pi camera module at Electronica 2012

Rice University team boosts silicon-based batteries

More Information about the Qualcomm Tricorder X Prize

More Information about The Nokia Sensing X Challenge

More Information about the Spartan-6 LX9 MicroBoard

Instagram Photo of Amelia with this week’s Nerdy Giveaway

Leave a Reply

featured blogs
Mar 9, 2026
What happens to our digital history when the world's biggest archive of retro video games disappears?...

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

The Han® Connector
Sponsored by Mouser Electronics and HARTING
In this episode of Chalk Talk, Emily Kenny from HARTING and Amelia Dalton investigate the details of the HARTING Han® connector family. They also explore the trends in connector solutions today, the variety of options within this connector family and how you can get started using a HARTING Han® connector for your next design!
Feb 18, 2026
23,960 views