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Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality.


Cadence Blog – Latest Posts

Virtuoso Video Diary: Usability of the Graph Summary Label in Virtuoso Visualization and Analysis XL Levels Up
We live in a world where the idea of usability is to make products easy to use, make things easily accessible, and visually appealing. It's our constant endeavor to improve the usability of our...
Nov 30, 2021
Last Week in CFD
Because of last week's Thanksgiving holiday here in the U.S. and the company's generosity in giving us not 2 but 3 days of rest and relaxation, last week's CFD news is shared today. And...
Nov 29, 2021
How to Generate a Quarter Million CFD Meshes Without Trying
Let's face it. Generating meshes for CFD is a necessary evil. Meshing is a means to an end and yet is said to require 75% of an engineer's time. NASA's CFD Vision 2030 Study called most...
Nov 29, 2021
Webinar: Signoff Billion Gates Designs in the Cloud with Cadence, TSMC, and Microsoft
Cadence, TSMC, and Microsoft are presenting a joint webinar on December 2 (in a couple of days' time). The title is Beat Your Signoff Schedule! How to Sign Off a 10 Billion+ Transistor Design in...
Nov 29, 2021
Introduction to Flashpoint Automatic Volume Meshing in Pointwise
The need for automatic mesh generation has never been clearer. The CFD Vision 2030 Study called most applied CFD “onerous” and cited meshing’s inability to generate complex meshes on the first...
Nov 24, 2021
(P)SpiceITUp: How to Use Measurements to Optimize Your Design
Your products must perform well in terms of their requirements. For a product to perform well, you must ensure that the design parameters are tuned for the best performance possible. For example, you...
Nov 23, 2021
μWaveRiders: Cadence AWR Design Environment Schematic/System Diagram Tips & Tricks
The Team RF "μWaveRiders" blog series is a showcase for Cadence AWR RF products. Monthly topics will vary between Cadence AWR Design Environment release highlights, feature videos, Cadence...
Nov 23, 2021
Sunday Brunch Video for 21st November 2021 Made in Sam's Chowder House, HMB (camera Ziyue Zhang) Monday: Cadence and Intel Demonstrate CXL 1.1/2.0 Interoperability Tuesday: KT Moore on More than Moore at iMAPS...
Nov 21, 2021


Chalk Talks Featuring Cadence

Machine-Learning Optimized Chip Design -- Cadence Design Systems
New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.
Oct 14, 2021
Cloud Computing for Electronic Design (Are We There Yet?)
When your project is at crunch time, a shortage of server capacity can bring your schedule to a crawl. But, the rest of the year, having a bunch of extra servers sitting around idle can be extremely expensive. Cloud-based EDA lets you have exactly the compute resources you need, when you need them. In this episode of Chalk Talk, Amelia Dalton chats with Craig Johnson of Cadence Design Systems about Cadence’s cloud-based EDA solutions.
May 8, 2020
TensorFlow to RTL with High-Level Synthesis
Bridging the gap from the AI and data science world to the RTL and hardware design world can be challenging. High-level synthesis (HLS) can provide a mechanism to get from AI frameworks like TensorFlow into synthesizable RTL, enabling the development of high-performance inference architectures. In this episode of Chalk Talk, Amelia Dalton chats with Dave Apte of Cadence Design Systems about doing AI design with HLS.
Apr 17, 2020
Cadence Celsius Thermal Solver
Electrical-thermal co-simulation can dramatically improve the system design process, allowing thermal design adaptation to be done much earlier. The Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. In this episode of Chalk Talk, Amelia Dalton chats with CT Kao of Cadence Design Systems about how the Celsius Thermal Solver can help detect and mitigate thermal issues early in the design process.
Apr 13, 2020


Featured Content from Cadence

featured video
Emulation and Prototyping to Accelerate Your Product Development Process
Validate your most sophisticated SoC designs before silicon and stay on schedule. Full system verification and early software development is possible with Cadence Palladium and Protium Dynamic Duo for IP/SoC verification, hardware and software regressions, full system verification, and early software development.
Nov 15, 2021
featured video
Design Low-Energy Audio/Voice Capability for Hearables, Wearables & Always-On Devices
Designing an always-on system that needs to conserve battery life? Need to also include hands-free voice control for your users? Watch this video to learn how you can reduce the energy consumption of devices with small batteries and provide a solution for a greener world with the Cadence® Tensilica® HiFi 1 DSP family.
Nov 10, 2021
featured video
Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform
3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.
Nov 5, 2021
featured paper
3D-IC Design Challenges and Requirements
3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing. While there’s interest in 3D-ICs, it’s still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this white paper to learn about 3D integration and packaging of multiple stacked dies, design challenges, ecosystem requirements, and needed solutions.
Nov 4, 2021