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Excelfore adds Time Aware Shaper to Ethernet TSN protocol stack for in-vehicle networks

Fremont, California – February 6, 2019 Excelfore, an enabler of smart mobility networks, announces a working Time Aware Shaper (TAS) for Ethernet TSN networks.

As in-vehicle networking continues to grow in importance, Ethernet is becoming an increasingly popular platform providing secure, high-speed, inexpensive solutions. To meet automotive requirements for deterministic network behavior, new protocols must be added onto Ethernet stacks to provide Audio/Video Bridging (AVB) and Time Sensitive Networking (TSN) These new protocols enable Ethernet to meet the demands of in-vehicle infotainment, control and … Read More → "Excelfore adds Time Aware Shaper to Ethernet TSN protocol stack for in-vehicle networks"

Marvin Test Solutions Expands GENASYS Platform Offerings

Irvine, CA. February 5, 2019 – Marvin Test Solutions, Inc., a trusted provider of globally-deployed innovative test solutions for military, aerospace, and manufacturing organizations, announced the release of the new GX6188 High Density … Read More → "Marvin Test Solutions Expands GENASYS Platform Offerings"

Arduino unveils the Arduino IoT Cloud

Chiasso, Switzerland, February 6, 2019 – Arduino, the world’s leading open-source hardware and software platform, today announced the introduction of an IoT Cloud as part of its professional IoT strategy. Targeted at developers, system integrators and maker hobbyists, the Arduino IoT Cloud is an easy-to-use Internet of Things application platform that enables users to develop and manage IoT applications that solve real-life problems in a business environment or in everyday life. The introduction of this new platform builds on Arduino’s mission of making complex technology simple enough for anyone to use.

Read More → "Arduino unveils the Arduino IoT Cloud"

C3D Toolkit Powers 3D Modeling in Altium Designer 19 and Altium NEXUS

Moscow, Russia and San Diego, CA USA: February 06, 2019 — Altium LLC, a leading provider of software for the design of printed circuit boards (PCB), has launched Altium Designer 19 with brand new 3D modeling features based on C3D Toolkit components from C3D Labs. As one of the most widely used electronic design automation (EDA) systems, Altium Designer 19 benefits from fast, accurate geometric modeling powered by the C3D Modeler geometric kernel, the C3D Solver constraint solver, and the C3D Converter data exchange module.

Altium was the first to … Read More → "C3D Toolkit Powers 3D Modeling in Altium Designer 19 and Altium NEXUS"

New Research from Newark element14 Shows Growing Role of Hardware in Design Process for Internet of Things Solutions

Chicago, February 6, 2019: Newark element14, the Development Distributor, has published new research on the Internet of Things which confirms that hardware platforms have become an essential part of the early stage design process, enabling engineers to test their designs quickly and cost-effectively and rapidly deliver proof of concept.

Survey results show design engineers use a range of hardware platforms to accelerate development pace and shorten time … Read More → "New Research from Newark element14 Shows Growing Role of Hardware in Design Process for Internet of Things Solutions"

MWC 2019: Rohde & Schwarz presents its leading wireless mobile testing solutions for today and tomorrow

Committed to providing the mobile communications industry with the solutions needed to optimize present technologies and to drive the development of future technologies, Rohde & Schwarz will highlight a variety of its latest wireless mobile testing solutions at this year’s Mobile World Congress in Barcelona. The company’s portfolio covers the entire mobile lifecycle from design, R&D, conformance testing and manufacturing to deployment and operation, including network and mobile endpoint security.

Munich, February 06, 2019 — Rohde & Schwarz will welcome its visitors at Mobile World Congress in Barcelona from February 25 to 28, 2019 in hall 6. Focus topics at … Read More → "MWC 2019: Rohde & Schwarz presents its leading wireless mobile testing solutions for today and tomorrow"

Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System Completes Certification of Conformance to the FACE Technical Standard v3.0

SANTA BARBARA, CA — February 6, 2019 — Green Hills Software, the worldwide leader in high-assurance operating systems, today announced that it has achieved certification of conformance of itsRead More → "Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System Completes Certification of Conformance to the FACE Technical Standard v3.0"

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies

By Heidi Hoffman, senior director, technology community marketing, SEMI

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards. The more technically focused of SEMI’s annual MEMS events, MSTC returns to Monterey, California, in conjunction with FLEX</ … Read More → "MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies"

GDCA Inc. and Abaco Systems Strike Deal to Avoid Embedded EOL for Customers

LIVERMORE, Calif. — Feb. 6, 2019 GDCA Inc., a California-based company that specializes in manufacturing obsolete embedded computer equipment, announced this week that it has joined forces with Abaco Systems, a leader in the electronics systems industry.

Together, the companies have completed the transfer of 13 VME I/O product lines from Abaco to GDCA. This means customers of the transferred product families now have a path to product availability for as long as needed. As a result, customers who have particularly long life cycles or who need … Read More → "GDCA Inc. and Abaco Systems Strike Deal to Avoid Embedded EOL for Customers"

Breakthrough Scalability for Automotive Device Test: New Diamondx VI1x Instrument Enables High Multi-Site Automotive and Industrial Device Testing

Milpitas, CA (USA), February 2019: Automotive power electronics ICs are complex and have stringent test requirements. Typically this limits how many IC’s can be tested in parallel, and thus inhibits the cost-effectiveness of modern highly parallel manufacturing test strategies. The Diamondx platform, with a range of power and automotive instrumentation featuring SmartMux, breaks this barrier and enables maximum efficiency.  VI1x is the latest member of this family of instruments, and it offers the right balance between uncompromising measurement quality and highest parallel test efficiency.

Leveraging a proven fully discrete channel design, the VI1 … Read More → "Breakthrough Scalability for Automotive Device Test: New Diamondx VI1x Instrument Enables High Multi-Site Automotive and Industrial Device Testing"

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