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AI Innovators Join Forces in Consortium for Development and Commercialization of Best-in-Class AI Computing Platform

Crossbar, Gyrfalcon, mtes Neural Networks and Robosensing merge hardware, software and memory IP for Edge-Based Self Learning and Event Detection
February 22, 2019

Santa Clara, CA, Feb 19, 2019 – Crossbar Inc., Gyrfalcon Technology Inc., mtes Neural Networks Corporation (mNN) and Robosensing Inc. today announced an AI consortium that will deliver a vastly accelerated, power-saving AI platform and standard that enables new AI-rich capability for edge computing, gateways, cloud and data centers.

The new group, called SCAiLE (SCalable AI for Learning at the Edge), is already working with Japanese authorities to review opportunities for the 2020 Olympics, including video-based event detection and response capability.

The organization will combine advanced acceleration hardware, resistive memory (ReRAM), optimized neural … Read More → "AI Innovators Join Forces in Consortium for Development and Commercialization of Best-in-Class AI Computing Platform"

Tech Innovators Speak at Design for Reliability Conference in Baltimore

Aerospace, Automotive, Computers, Semiconductors, Telecom, and Manufacturing Represented
February 22, 2019

Beltsville, MD – February 19, 2019 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, will be joined by experts from Fortune 500 companies to discuss technology innovation through design excellence at the 2019 Design for Reliability Conference. The conference takes place on March 25-27, 2019 at the Hyatt Regency Baltimore Inner Harbor hotel in Maryland.

The 3-day conference … Read More → "Tech Innovators Speak at Design for Reliability Conference in Baltimore"

New Artesyn 50-Watt, High Current Density, Non-isolated Digital DC-DC Modules are Ideal for 5G Nodes and Height-sensitive Applications

February 22, 2019

Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and configurable 25 amp, 50 watt outputs, which can also be combined to a single configurable 50 amp, 100 watt output. Design engineers … Read More → "New Artesyn 50-Watt, High Current Density, Non-isolated Digital DC-DC Modules are Ideal for 5G Nodes and Height-sensitive Applications"

Green Hills Software to Showcase Its Innovative Security and Safety-critical Solutions at embedded world

Hall 4, Stand 325 - Nuremberg, Germany, 26 - 28 February 2019
February 22, 2019

SANTA BARBARA, CA — February 19, 2019 —Green Hills Software, the worldwide leader in embedded safety and security, and INTEGRITY Security Services (ISS), a Green Hills Software company, will showcase their industry-leading Read More → "Green Hills Software to Showcase Its Innovative Security and Safety-critical Solutions at embedded world"

OmniVision Announces Its First 0.8 Micron, 32 Megapixel Image Sensor

February 22, 2019

SANTA CLARA, Calif. – Feb. 20, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV32A, its first 0.8 micron pixel image sensor with 32 megapixel (MP) resolution, built on OmniVision’s PureCel® Plus stacked die technology. This new sensor offers leading-edge performance for high-end smartphones.

“The demand for high-performance smartphone cameras is very strong, with consumers clamoring for ever-higher resolution in high-end mobile phones—including selfie cameras,” said Arun Jayaseelan, senior marketing manager at OmniVision. “At the same time, circuitry space within smartphones is at a premium. With the OV32 … Read More → "OmniVision Announces Its First 0.8 Micron, 32 Megapixel Image Sensor"

Telit Transforms Wireless Broadband Networking with Blazing Fast 5G Wireless Speeds

February 22, 2019
  • Telit announces new data cards based on the Qualcomm® Snapdragon™ X55 5G modem and RF Front-End solutions, the latest in a series of first to market introductions based on Qualcomm Technologies’ chipsets
  • Featuring support for 5G in millimeter wave (mmWave) and sub-6 GHz spectrum as well as 4G LTE, the new cards are ideal for fixed wireless solutions and high bandwidth enterprise networking

London, February 19, 2019 – Telit, a global enabler of the Internet of Things (IoT), today announces that it will be among the first providers of data … Read More → "Telit Transforms Wireless Broadband Networking with Blazing Fast 5G Wireless Speeds"

Flicq and Ioetec Cooperate on Securing the Industrial Internet of Things (IIoT)

Californian remote monitoring specialist and British security company cooperate on end-to-end security
February 22, 2019

San Jose, California & Sheffield, UK. 20th February 2019. Flicq Inc. an innovator in the Industrial Internet of Things (IIoT) solutions and Ioetec Ltd, a company focused on securing the Internet of everything announced today that they are cooperating on providing end-to-end security from the edge to the cloud.

As the internet of things (IoT) grows there are an increasing number of sensor-based devices that are being interconnected. This provides an ever-growing attack surface for hackers and for malware risking damage to valuable industrial assets and businesses. In areas such as … Read More → "Flicq and Ioetec Cooperate on Securing the Industrial Internet of Things (IIoT)"

Autotalks and CEVA Collaborate on World’s First Global V2X Solution

Autotalks chipset leverages CEVA-XC SDR DSP to unify DSRC and C-V2X in a single solution, reducing development, integration and certification effort for global V2X deployment
February 21, 2019

MOUNTAIN VIEW, Calif. and Kfar Netter, Israel – February 19, 2019 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, and Autotalks, a world leader in V2X (Vehicle-to-Everything) communications solutions, announced today that the companies collaborated to add C-V2X Rel. 14/15 support to the CEVA-XC DSP based Autotalks chipset, making it the world’s first and only … Read More → "Autotalks and CEVA Collaborate on World’s First Global V2X Solution"

Renesas Electronics Develops 28 nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures

New 600MHz Test Chip Combines Enhanced Built-In Self-Test Functionality and Gigabit Ethernet Interface
February 21, 2019
TOKYO, Japan, February 19, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development and successful operation verification of an automotive test chip as a technological stepping stone toward the realization of next-generation automotive-control flash Microcontrollers(MCUs) employing a 28 nanometer (nm) low-power process.
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