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Efinix® Transitions Trion™ T20 FPGAs to High-Volume Production; Expands Executive Leadership Focused on Sales and Business Development

SANTA CLARA, Calif., March 27, 2019 (GLOBE NEWSWIRE) — Efinix®, an innovator in programmable product platforms and technologies, today announced the transition of its Trion™ T20 FPGAs to high-volume production. Read More → "Efinix® Transitions Trion™ T20 FPGAs to High-Volume Production; Expands Executive Leadership Focused on Sales and Business Development"

SparkFun Electronics® Releases SparkFun Edge—the Ultra-Low Power Development Board for Machine Learning using TensorFlow Lite

Boulder, CO, April 01, 2019 (GLOBE NEWSWIRE) — The SparkFun Edge, a new development board powered by Apollo3 from Ambiq, is now shipping from SparkFun.com. The SparkFun Edge was created in collaboration with Google’s TensorFlow Lite team to create new tools for developers to bring voice and gesture recognition to edge devices. The Apollo3 from Ambiq uses a Cortex M4 processor with 384KB of RAM and 1MB of Flash storage, requiring extremely low levels of power and allowing the SparkFun Edge to run for several days on a coin cell battery. SparkFun Founder, Nathan Seidle, and Google Engineer, Pete Warden, … Read More → "SparkFun Electronics® Releases SparkFun Edge—the Ultra-Low Power Development Board for Machine Learning using TensorFlow Lite"

Hardware Lifecycle Data Management for Teams

Henderson, Nevada, USA – April 1, 2019 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has enhanced its popular unified requirements lifecycle management EDA tool, Spec-TRACER™, to better support team-based projects when working on designs that must be certified to safety standards such as DO-254. The 2019.3 release contains a relational database, in order to support multiple users at once, within which there are repositories of project examples.

“Spec-TRACER has always supported team-based workflows and methodologies, but it was necessary to manually add and then configure an … Read More → "Hardware Lifecycle Data Management for Teams"

2U MicroTCA Chassis from Pixus Technologies Has Rugged Features

Waterloo, Ontario  —  Mar 27, 2019 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, offers a 2U high rackmount MicroTCA chassis holding a versatile range of AdvancedMCs.

The 2U MicroTCA chassis comes with 1 MCH (MicroTCA Carrier Hub) slot and 7 AdvancedMCs (AMCs) standard.  The backplane supports 40GbE and PCIe Gen3 speed signals.  Other backplane sizes and configurations are available upon request.

The chassis platform has the card cage recessed within the enclosure, providing protection for the AMCs and the cabling.  The left side of the card cage is raised slightly to … Read More → "2U MicroTCA Chassis from Pixus Technologies Has Rugged Features"

RS Components partners with TE Connectivity to launch TE Learning Centre on DesignSpark

LONDON, UK, 22 March 2019 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, has partnered with TE Connectivity, a world leader in connectivity and sensors, to launch the TE Learning Centre on DesignSpark, the global platform and community for design engineers. The courses will enable designers and engineers to obtain a fast overview of many advanced products, technologies and solutions.

Available at Read More → "RS Components partners with TE Connectivity to launch TE Learning Centre on DesignSpark"

Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology

Highlights

•       Long-term collaboration between Cadence and Samsung results in successful tapeout of test vehicle using EUV technology
•       Cadence Innovus Implementation System and Quantus Extraction Solution enhanced to support latest Samsung GAA technology requirements

SAN JOSE, Calif., March 29, 2019— Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Innovus Implementation System and Quantus Extraction Solution are now enabled for the Samsung Foundry Gate-All-Around (GAA) technology. The Cadence tools have been confirmed to meet Samsung Foundry’s technology requirements, which lets customers who produce high-end products for the mobile, networking, server and automotive markets leverage … Read More → "Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology"

Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs

CHANDLER, Ariz., March 28, 2019 — From NewSpace to critical space missions, designers of space applications need to reduce design cycles and costs while scaling development across missions with different radiation requirements. To support this trend, Microchip Technology Inc. (Nasdaq: MCHP) today introduced the space industry’s first Arm®-based microcontrollers (MCUs) that combine the low-cost and large ecosystem benefits of Commercial Off-the-Shelf (COTS) technology with space-qualified versions that have scalable levels of radiation performance. Based on the automotive-qualified SAMV71, the Read More → "Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs"

VadaTech Announces New 3U VPX, Dual RF Agile Transceiver with VITA 67.2 RF Connector

Henderson, NV – March 28, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX571. The VPX571 provides dual agile RF transceivers, each based on AD9364.  One channel includes a programmable filter on transmit.  The combination of dual AD9364 with UltraScale+ MPSoC provides a complete transceiver solution for SDR and SIGINT applications, supporting both TDD and FDD operation.

The module is available with RF routed to front panel or to the rear via a VITA 67.2 connector.  The AD9364 operates in the 70 MHz to 6.0 GHz range, covering most licensed … Read More → "VadaTech Announces New 3U VPX, Dual RF Agile Transceiver with VITA 67.2 RF Connector"

SimScale Releases Major Upgrade for Finite Element-based Analysis Types

Munich, March 27, 2019 SimScale announces the upgrade of their solver for both structural and thermo-structural analyses to bring increased speed and robustness across all FEM-based simulation types available on the cloud-based CAE platform.

Following the release of a completely reworked Workbench in December last year along with multiple feature releases for computational fluid dynamics (CFD), the cloud simulation provider now brings FEA to focus by releasing automatic contact detection, improved robustness of … Read More → "SimScale Releases Major Upgrade for Finite Element-based Analysis Types"

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