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Hyperstone introduces the Use Case Tracker to optimise NAND Flash memory configuration and management

By enabling the ability to track and analyse the way an application uses Flash memory, manufacturers can now identify the most optimal Flash storage technology for any use case.
April 26, 2019

Konstanz, Germany 23. 04. 2019 – Hyperstone is pleased to offer customers access to its Use Case Tracker technology, that leverages its expertise in NAND flash management to track and analyse a customer’s unique use case. The data is gathered in the field and is analysed in order to provide manufacturers with recommendations customised to their specific use case.

The tracking facility is enabled through a firmware extension to the hySMART tool. The data captured is stored on a standard memory card, and is generated by traffic between the host and the memory. The data, such as sequential and random … Read More → "Hyperstone introduces the Use Case Tracker to optimise NAND Flash memory configuration and management"

Renesas Electronics Ships First Plastic Packaged, Radiation-Tolerant PWM Controller and GaN FET Driver for New Space SmallSats

Rad-Tolerant ISL71043M and ISL71040M Provide Size and Cost Optimized Power Supply Solution for Small Satellite Mega-Constellations in Low Earth Orbit
April 25, 2019

Düsseldorf, April 18, 2019 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the space industry’s first plastic-packaged, radiation-tolerant PWM controller and Gallium Nitride (GaN) FET driver for DC/DC power supplies in small satellites (smallsats) and launch vehicles. The ISL71043M single-ended current mode PWM controller and ISL71040M low-side GaN FET driver are ideal for isolated flyback and half-bridge power stages, and … Read More → "Renesas Electronics Ships First Plastic Packaged, Radiation-Tolerant PWM Controller and GaN FET Driver for New Space SmallSats"

Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems

New Virtualizer Development Kit for ST Stellar Multicore MCU Deployed at Lead Automotive Tier 1 Companies Enabled Early Software Development
April 25, 2019

MOUNTAIN VIEW, Calif., April 18, 2019 /PRNewswire/ —

Highlights:

  • VDKs enable software development before hardware availability and accelerate systems and software testing by moving from physical to virtual environment
  • Multi-year collaboration delivers VDKs for ST Stellar MCU family with first virtual prototype available today

Read More → "Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems"

Accellera Announces Proposed Working Group to Standardize UVM Analog/Mixed-Signal Extensions

Initiative to collect industry interest and requirements for mixed-signal verification and standardization
April 25, 2019

Elk Grove, Calif., April 24, 2019 — Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards, announced today the formation of a Proposed Working Group (PWG) to focus on the standardization of analog/mixed signal extensions (AMS) for the Universal Verification Methodology (UVM) standard.

“There have been many discussions in recent years about the need to make UVM more mixed-signal aware,” stated Lu Dai, Chair of Accellera.  “The purpose of the PWG is to explore the need further and to determine … Read More → "Accellera Announces Proposed Working Group to Standardize UVM Analog/Mixed-Signal Extensions"

SEGGER introduces RAID5 to Embedded Systems

SEGGER adds a RAID5 option to its emFile embedded file system to maximize data integrity and reliability
April 25, 2019

Monheim, Germany – April 24th, 2019
RAID5 delivers unsurpassed data integrity in providing an additional layer of fail-safety on top of the CRC and/or error correction used by the underlying driver or storage medium.

With RAID5, the storage device is divided into several partitions, one of which holds parity information allowing data recovery in case of a partition fail. It can be used on any storage medium and the parity information can be stored on the same storage device (in a separate partition) or on a separate device.

The add-on has a tiny memory footprint, … Read More → "SEGGER introduces RAID5 to Embedded Systems"

RS Components introduces new easy-to-connect cloud IoT development board from Microchip

Linking to Google’s Cloud IoT Core, PIC-microcontroller-based board is ideal for creating secure and low-power cloud-connected designs
April 25, 2019

LONDON, UK, 24 April 2019 – RS Components (https://uk.rs-online.com/web/) (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, today announced availability of a new development board that makes it easy for engineers to create secure cloud-connected designs.

The new PIC-IoT WG development board (AC164164) (Read More → "RS Components introduces new easy-to-connect cloud IoT development board from Microchip"

Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design

April 25, 2019

SAN JOSE, Calif., 22 Apr 2019

Highlights:

Synopsys Design Platform Certified for TSMC’s Innovative SoIC Chip Stacking Technology

Close Collaboration Delivers Design Solutions for True 3D Device Integration
April 24, 2019

MOUNTAIN VIEW, Calif., April 23, 2019 /PRNewswire/ —

Highlights:

  • Efficient support for the new chip stacking technology ensures realization of highest-performing 3D-IC solutions
  • Solution includes multi-die layout implementation, as well as parasitic extraction and timing analysis coupled with physical verification
  • Collaborating with early partners to accelerate their highly integrated, next-generation products to market

< … Read More → "Synopsys Design Platform Certified for TSMC’s Innovative SoIC Chip Stacking Technology"

Cadence Design Solutions Certified for TSMC-SoIC™ Advanced 3D Chip Stacking Technology

Full suite of Cadence digital and signoff, custom/analog, and IC package and PCB analysis tools optimized for TSMC SoIC chip stacking technology
April 24, 2019

SAN JOSE, Calif., 23 Apr 2019

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC™) 3D advanced chip stacking technology, which integrates heterogenous chips—including logic ICs and memory—that are fabricated on different process nodes onto a single chip stack for a subsequent packaging process. A full suite of Cadence® digital and signoff, custom/analog, and IC package and PCB analysis tools have been optimized for TSMC’s SoIC chip stacking … Read More → "Cadence Design Solutions Certified for TSMC-SoIC™ Advanced 3D Chip Stacking Technology"

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