July 11, 2019 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now offering the Power by Linear™ Read More → "Analog Devices Power by Linear LTM7400 µModule Regulator Now at Mouser"
Sudbury, MA July 2019 – DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, has broken the world record for having the heaviest lift using adhesive. The company lifted an 18-ton (17.5 metric tons) truck, surpassing the previous record of 16.3 metric tons. The new record was officially recognized by Guinness World Records.
Setting a record
For the world record attempt, an 18-ton truck was lifted by crane to a height of one meter with only 3 grams of adhesive. The entire weight hung for one hour on a bonded … Read More → "DELO Sets World Record for Strongest Adhesive"
Geneva, July 16, 2019 — The STMicroelectronics STDRIVE601 3-phase gate driver for 600V N-channel power MOSFETs and IGBTs provides state-of-the-art ruggedness against negative voltage spikes down to -100V and responds to logic inputs in a … Read More → "600V Three-Phase Gate Driver with Smart Shutdown from STMicroelectronics Enhances Performance and Safety in Industrial Applications"
Tessenderlo, Belgium – July 11, 2019
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry today announced the availability of new high-voltage primitive devices targeted at the growing market for automotive 48V board net and battery management system (BMS) ICs.
Covering voltages of 70V to 125V, these complementary NMOS/PMOS devices are based on the company’s XT018 BCD-on-SOI (Read More → "X-FAB Expands its 180nm BCD-on-SOI Technology Platform with New High-Voltage Devices Designed for Next Generation Automotive Applications"
July 10, 2019 – San Jose, CA
Toposens recently announced the release of their current flag-ship product TS3, a 3D ultrasonic sensor suitable for a wide range of applications in the autonomous systems market that require a strong need for reliable object detection and situational awareness.
In comparison to common ultrasonic sensors, which usually measure the distance only to the closest reflecting surface, Toposens’ new 3D sensors achieve a wide field of view of up to 160° and provide simultaneous 3D measurements for multiple objects within the scanning area. The operation thus mimics … Read More → "Toposens Launches TS3 Ultrasonic Sensor"
Palaiseau, France – July 11, 2019. The Tulipp (Towards Ubiquitous Low-power Image Processing Platforms) Consortium has announced a highly successful conclusion to the EU’s three-year project. Beginning in January 2016, the Tulipp project targeted the improved development of high performance, energy efficient systems for the growing range of complex, vision-based image processing applications. The Tulipp project was funded with nearly €4 million from Horizon 2020, the European Union’s biggest research and innovation programme to date.
The conclusion of the Tulipp project sees the release of a comprehensive reference platform for vision-based embedded … Read More → "Successful conclusion to EU’s three-year Tulipp project for embedded image processing and vision applications"
MOUNTAIN VIEW, Calif., July 11, 2019 /PRNewswire/ —
Highlights:
Read More → "The MOSIS Service Selects Synopsys’ IC Validator for Large-scale FinFET SoCs"
FOUNTAIN INN, S.C., July 11, 2019 (GLOBE NEWSWIRE) —
AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, will fuel the … Read More → "AVX Fuels the Next Generation of Clemson University Vehicle Prototyping through Deep Orange"
SAN JOSE, CALIF –– July 16, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Verification Intellectual Property (VIP), today announced it expanded its portfolio with availability of DisplayPort 2.0 VIP, a digital display interface used to connect a video source to a display or monitor.
“DisplayPort 2.0 will offer noticeable improvement for augmented/virtual reality displays, and the reason our user community requested DisplayPort 2.0 support from us,” remarks Deepak Kumar Tala, … Read More → "SmartDV Adds DisplayPort 2.0 to its Portfolio of Verification IP"
Kirkland (Montréal), July 10, 2019: Reflex Photonics is proud to launch new LightCONEX® active optical blind mate interconnects compatible with the upcoming VITA 66.5 standard and supported by the Sensor Open System Architecture (SOSA™) consortium.
Expanding on the successful LightCONEX style A compatible with VITA 66.4 aperture, Reflex Photonics is launching its style B and style C, both compatible with VITA 67.3 type C, D and E standard apertures. These … Read More → "Reflex Photonics launches a new blind mate active optical interconnect product line compatible with VITA and SOSA standards"
