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Vishay Intertechnology IHDM Edge-Wound Inductor Delivers Stable Inductance and Saturation at Temps to +180 °C and Current to 150 A

Featuring Powdered Iron Alloy Core Technology, This Through-Hole Device Provides Low DCR to Reduce Power Losses and Increase Efficiency
August 22, 2019

MALVERN, Pa. — Aug. 21, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHDM edge-wound, through-hole inductor with rated current up to 150 A for industrial and military applications. Featuring a powdered iron alloy core technology, the Vishay Custom Magnetics IHDM-1008BC-30 provides stable inductance and saturation over a demanding operating temperature range from -40 °C to +180 °C with low power losses and excellent heat dissipation.

The edge-wound coil of the device released today provides low DCR down to 0.25 mΩ, which minimizes losses and improves rated current performance for increased efficiency. Compared to competing ferrite-based solutions, the IHDM-1008BC-30 … Read More → "Vishay Intertechnology IHDM Edge-Wound Inductor Delivers Stable Inductance and Saturation at Temps to +180 °C and Current to 150 A"

Trains BERT in Record-Setting 53 Minutes and Slashes Inference to 2 Milliseconds; Enables Microsoft, Others to Use State-of-the-Art Language Understanding in Large-Scale Applications

NVIDIA today announced breakthroughs in language understanding that allow businesses to engage more naturally with customers using real-time conversational AI.
August 21, 2019

NVIDIA’s AI platform is the first to train one of the most advanced AI language models — BERT — in less than an hour and complete AI inference in just over 2 milliseconds. This groundbreaking level of performance makes it possible for developers to use state-of-the-art language understanding for large-scale applications they can make available to hundreds of millions of consumers worldwide.

Early adopters of NVIDIA’s performance advances include Microsoft and some of the world’s most innovative startups, which are harnessing NVIDIA’s platform to develop highly intuitive, immediately responsive language-based services for … Read More → "Trains BERT in Record-Setting 53 Minutes and Slashes Inference to 2 Milliseconds; Enables Microsoft, Others to Use State-of-the-Art Language Understanding in Large-Scale Applications"

Wind River Joins Cloud Native Computing Foundation as Silver Member

August 21, 2019

ALAMEDA, CA — Aug. 21, 2019 — Wind River®, a leader in delivering software for telecommunications and other critical infrastructure markets, today announced that it has joined Cloud Native Computing Foundation (CNCF) (https://www.cncf.io/) as a Silver member to support the advancement of cloud native computing architectures and technologies such as containers for the broader edge market, particularly those creating devices for the network edge.</ … Read More → "Wind River Joins Cloud Native Computing Foundation as Silver Member"

Renesas Electronics’ Enhanced RX65N Wi-Fi Connectivity Cloud Kit Simplifies Secure IoT Endpoint Device Connections to Amazon Web Services

Qualified Kit’s 32-Bit RX65N MCU with Amazon FreeRTOS, Wi-Fi, and Sensors Quickly Connects to AWS Cloud
August 21, 2019

TOKYO, Japan, August 20, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the Renesas RX65N Cloud Kit featuring onboard Wi-Fi, environmental, light and inertial sensors, and support for Amazon FreeRTOS connected to Amazon Web Services (AWS). The kit gives embedded designers a fast start and secure connection to AWS. Using Renesas’ e2 studio Integrated Development Environment (IDE), IoT applications are easily created by configuring Amazon FreeRTOS, all the necessary drivers, and the network stack and component libraries.

The RX65N Cloud Kit provides an excellent evaluation … Read More → "Renesas Electronics’ Enhanced RX65N Wi-Fi Connectivity Cloud Kit Simplifies Secure IoT Endpoint Device Connections to Amazon Web Services"

2019 IEEE International Electron Devices Meeting to Highlight Innovative Devices for an Era of Connected Intelligence

August 20, 2019

 

  • A focus on devices for new and More-than-Moore applications
  • An extensive offering of tutorials, short courses, focus sessions and panels, plus poster sessions from affiliated groups
  • A supplier exhibition will be held in conjunction with the technical program 
  • Industry and scientific leaders will talk about their personal experiences in the context of career growth.

 

< … Read More → "2019 IEEE International Electron Devices Meeting to Highlight Innovative Devices for an Era of Connected Intelligence"

VadaTech Announces a 6U VPX Zynq UltraScale+ FPGA Carrier Board with Dual FMC+ sites

August 20, 2019

Henderson, NV – August 15, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX580 rugged DSP blade. The VPX580 is a 6U VPX board based on Xilinx UltraScale+ XCZU19EG MPSoC FPGA with dual FMC+ sites, coupling real-time processing capability with high speed I/O and making it suitable for radar, signal intelligence and image processing applications.

The XCZU19EG FPGA has 1968 DSP Slices and 1143K logic cells, and includes a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 and ARM Mali™-400 MP2 GPU. The Cortex-A53 Dual … Read More → "VadaTech Announces a 6U VPX Zynq UltraScale+ FPGA Carrier Board with Dual FMC+ sites"

Concurrent Technologies announces support for Acromag Carrier Board

Single slot 6U VPX I/O Solution
August 20, 2019

Concurrent Technologies and Acromag have together delivered a single slot, stand-alone I/O controller for 6U VPX™ deployments.  The base product consists of a Concurrent Technologies processor XMC module fitted on an Acromag VPX452x carrier which has four sites for AcroPack® modules.  The combination enables a wide variety of I/O combinations to be available within a single slot.  Air and conduction-cooled variants are available to meet environmental requirements for the military, aerospace, oil and gas exploration and industrial applications.

Depending on computing requirements, the  … Read More → "Concurrent Technologies announces support for Acromag Carrier Board"

HCC Embedded Flash Management Software Adds Support for Adesto® FusionHD™ Non-Volatile Memories

HCC file system products enable significant performance, cost, reliability, and battery life improvements when using Adesto’s latest serial flash products
August 20, 2019

Budapest, Hungary – 14 August 2019 – HCC Embedded (HCC), long-time experts in flash management software, announced today its collaboration with Adesto Technologies Corporation to support the new Adesto FusionHD serial flash technology. HCC’s field-proven file system products use the unique features of Read More → "HCC Embedded Flash Management Software Adds Support for Adesto® FusionHD™ Non-Volatile Memories"

Artilux announces new GeSi 3D sensing technology to improve eye safety and outdoor user experiences

August 20, 2019

Proven technology developed at TSMC now ready for mass production
Innovative GeSi photonics-based approach overcomes current 3D image sensor limitations and enables operation at safer laser wavelengths (1050-1550nm) than existing solutions

Zhubei, Taiwan, August 15, 2019 – Artilux, an innovator in optical and electronics technology, announces its new Artilux Explore Series for wide spectrum 3D sensing. By operating at longer wavelength light than conventional solutions, the new Explore Series delivers exceptional accuracy, reduces the risk of eye damage and minimizes sunlight interference, enabling a consistent outdoor-indoor user experience. The breakthrough is based on a new GeSi technology platform … Read More → "Artilux announces new GeSi 3D sensing technology to improve eye safety and outdoor user experiences"

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