News – Page 925 – EEJournal

Battery Management System with Optical Connectivity Ready for Production

KDPOF Will Demo Galvanic Isolation of Gigabit Ethernet POF at IEEE-SA Technology Day and ELIV VDI Congress

August 29, 2019

Madrid, Spain, August 28, 2019 – KDPOF – leading supplier for gigabit transceivers over POF (Plastic Optical Fiber) – proudly announces that the first application of a Battery Management System (BMS) based on optical connectivity will soon go into production. “We are delighted that by the end of 2019, the first carmaker will start assembly of a battery management system with POF connectivity,” stated Carlos Pardo, CEO and Co-founder of KDPOF. “Due to its inherent galvanic isolation, POF perfectly solves the electrical and interference challenges of new powertrain architectures for electric and autonomous driving.” In battery management systems, galvanic isolation is necessary between primary and … Read More → "Battery Management System with Optical Connectivity Ready for Production"

Simplify Power Delivery (PD) in Growing USB Type-C™ Charging Market with Two USB-PD Solutions from Microchip

Expanding portfolio adds certified USB 3.1 PD SmartHub™ IC with HostFlexing and PDBalancing plus standalone USB Type-C PD controller for simpler applications

August 29, 2019

CHANDLER, Ariz., August 29, 2019 — USB Type-C has become increasingly popular, and with the introduction of Power Delivery (PD), it is now possible to charge more types of devices – and charge faster – than ever before. To remove the traditional complexity and high costs associated with implementing USB Type-C, Microchip Technology Inc. (Nasdaq: MCHP) today announced two new solutions that simplify USB Type-C PD for a range of applications.

As one of the industry’s first USB-IF-certified USB 3.1 SmartHub devices with integrated support for Power Delivery (TID1212), the Read More → "Simplify Power Delivery (PD) in Growing USB Type-C™ Charging Market with Two USB-PD Solutions from Microchip"

SparkFun® Achieves FCC/IC/CE Mark Approval on First Open-Source, US-Manufactured BLE Module

Enables Anyone to Integrate Low-Power Machine Learning, Increases Speed of Development and is Implementable from Prototype to Production

August 28, 2019

Boulder, Colorado, Aug. 28, 2019 (GLOBE NEWSWIRE) —

SparkFun’s Artemis module has earned Federal Communications Commission (FCC), Industry Canada (IC), and Conformité Européenne (CE) mark approval making … Read More → "SparkFun® Achieves FCC/IC/CE Mark Approval on First Open-Source, US-Manufactured BLE Module"

Now at Mouser: Microchip’s SAM R30 Sub-GHz Module for Ultra-Low-Power WPAN Designs

August 28, 2019

August 28, 2019 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the Read More → "Now at Mouser: Microchip’s SAM R30 Sub-GHz Module for Ultra-Low-Power WPAN Designs"

New Isolated Smart Switches from Silicon Labs Drive Any Load in Harsh Industrial Environments

Si834x Family Offers the Most Rugged, Reliable Switches on the Market with Best-in-Class Protection and Diagnostic Reporting Features

August 28, 2019

AUSTIN, Texas – Aug. 28, 2019 – Read More → "New Isolated Smart Switches from Silicon Labs Drive Any Load in Harsh Industrial Environments"

Vishay Intertechnology Automotive Grade WFP Power Metal Plate™ Shunt Resistors Reduce Component Counts and Increase Measurement Accuracy

Hybrid-Mount Devices Feature High 20 W Power Rating and Low Resistance Down to 2 mΩ in 3939 Case Size

August 28, 2019

MALVERN, Pa. — Aug. 28, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) ) today introduced new Automotive Grade Power Metal Plate™ shunt resistors featuring a 20 W power rating in a 3939-size package with Kelvin terminals. With their high power density, the Vishay Dale hybrid-mount WFPA3939 and WFPB3939 are designed to save space, decrease component counts, and increase measurement accuracy in automotive, industrial, and AMS applications.

The devices released today feature a construction that incorporates an improved thermal management design utilizing a copper heat spreader, resulting in 20 W power in the 3939 package size that maintains the superior electrical characteristics of the Power Metal … Read More → "Vishay Intertechnology Automotive Grade WFP Power Metal Plate™ Shunt Resistors Reduce Component Counts and Increase Measurement Accuracy"

Keysight Joins 5G Alliance for Connected Industries and Automation (5G-ACIA) to Accelerate Deployment of New Industrial 5G Use Cases

Keysight's 5G expertise and solution portfolio helps global forum shape 5G in industrial domain

August 28, 2019

SANTA ROSA, Calif., August 28, 2019

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that the company has joined the 5G Alliance for Connected Industries and Automation (5G-ACIA) to help establish a framework for test and verification that will accelerate deployment of new industrial 5 … Read More → "Keysight Joins 5G Alliance for Connected Industries and Automation (5G-ACIA) to Accelerate Deployment of New Industrial 5G Use Cases"

Xilinx® Zynq® UltraScale+™ high memory bandwidth MPSoC module

August 27, 2019

Enclustra’s Mercury+ XU9 SoC module offers 20 multi-gigabit transceivers with data rates of up to 15 Gbit/sec each and memory bandwidth of up to 38.4 GByte/sec. Based on the Xilinx Zynq UltraScale+ MPSoC, the Mercury+ XU9 combines 6 ARM cores, a Mali-400MP2 GPU (EV variant), up to 12 GByte DDR4 SDRAM, numerous standard interfaces, 192 user I/Os and up to 504,000 LUT4 equivalents.

Zurich, 27th August 2019 – With the Read More → "Xilinx® Zynq® UltraScale+™ high memory bandwidth MPSoC module"

Curtiss-Wright Selected by Kappa Optronics to Provide Video Management Technology for Driver’s Vision Enhancer

For use on Norwegian Army’s WiSENT 2 Armored Recovery Vehicle program

August 27, 2019

ASHBURN, Va. – August 27, 2019 – Read More →

ADLINK Announces MAPS Suite for Measurement and Automation Modules

ADLINK Continually Improves User Experience with Support for DAQ, PXI and Third-Party Modules

August 27, 2019

SAN JOSE, Calif., Aug. 27, 2019 – ADLINK Technology, a global provider of leading Edge Computing solutions that drive data-to-decision applications across industries, announces a new generation of all-in-one software solutions: Measurement, Automation, and Platform Suite (MAPS). To improve process efficiency and shorten development time and effort, developers working with DAQ and PXI modules may immediately begin work with MAPS software packages such as ADLINK Connection Explorer (ACE), diagnostic tools, and easy-to-use testing utilities to analyze device functionality in one click. By continuously working with customers and engineers, ADLINK strives to make application development time faster, easier and more productive … Read More → "ADLINK Announces MAPS Suite for Measurement and Automation Modules"