News – Page 9 – EEJournal

Macronix Flash Memory Family Includes Highest Level of Automotive Safety High-Performance MXSMIO Flash Devices Now Compliant with ISO 26262 ASIL D Standard

January 7, 2026

HSINCHU, Taiwan — January 7, 2006 — Macronix International Co., Ltd.
(TSE: 2337), a leading integrated device manufacturer in the
non-volatile memory (NVM) market, today announced the high-performance
and efficiency MXSMIO™ family of flash memory has been expanded to
include optimal-safety features for automotive applications. The MXSMIO
flash devices, which feature multiple-I/O interfaces, are now compliant
with the ISO 26262 ASIL D standard, requiring much higher levels of
safety in vehicles’ electronics.

Automotive Safety Integrity Level D (ASIL D) refers to the systems in
vehicles that require current highest safety level. Many
automotive-electronics … Read More → "Macronix Flash Memory Family Includes Highest Level of Automotive Safety High-Performance MXSMIO Flash Devices Now Compliant with ISO 26262 ASIL D Standard"

Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for IoT

January 7, 2026

Munich, Germany – 07 January 2026 – To support continued growth of connected devices in home, industrial and commercial markets, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth® LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device. This product family introduces the industry’s first 20 MHz Wi-Fi 7 device for IoT, provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the … Read More → "Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for IoT"

Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles

Integration of Ceva’s AI DSP in NXP’s S32Z2 and S32E2 real-time processors enables predictive analytics, energy management and intelligent control for software-defined vehicles

January 7, 2026

LAS VEGAS, NV. – CES 2026 – January 6, 2026 – As vehicles evolve into software-defined platforms, the demand for real-time processing, safety, and intelligence is accelerating. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that NXP® Semiconductors has integrated Ceva’s AI DSP into its Read More → "Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles"

Ambiq Unveils Atomiq®, the World’s First Ultra-Low Power NPU SoC Built on SPOT®

Enabling always-on audio, vision, and reasoning for next-generation edge AI devices

January 7, 2026

AUSTIN, Texas, January 6, 2026 — Ambiq Micro, Inc. (“Ambiq”) (NYSE: AMBQ), a recognized leader in ultra-low-power semiconductor solutions for edge AI, today announced Atomiq, the highly anticipated system-on-chip (SoC) integrating a Neural Processing Unit (NPU) designed to enable real-time, always-on artificial intelligence at the edge. Built on Ambiq’s Subthreshold Power Optimized Technology (SPOT) platform, Atomiq aims to establish a new benchmark for energy efficiency in demanding edge AI applications.

High Performance Meets Power Efficiency

As AI models continue to grow in complexity, manufacturers face a critical challenge: scaling device intelligence without compromising … Read More → "Ambiq Unveils Atomiq®, the World’s First Ultra-Low Power NPU SoC Built on SPOT®"

Keysight Launches Software Solution to Ensure Trustworthy AI Deployment in Safety-Critical Environments

Integrated solution supports AI development and maintenance, real-world inference, and monitoring for data drift and performance

January 7, 2026

January 6, 2026

SANTA ROSA, Calif., – Keysight Technologies, Inc. (NYSE: KEYS) today introduced Keysight AI Software Integrity Builder, … Read More → "Keysight Launches Software Solution to Ensure Trustworthy AI Deployment in Safety-Critical Environments"

NXP Advances Edge AI Leadership with New eIQ Agentic AI Framework

January 7, 2026

New eIQ Agentic AI Framework enables autonomous agentic intelligence at the edge, adding a new pillar to NXP’s edge AI platform
Brings agentic AI to the edge, delivering real-time autonomous decision making for use cases requiring low latency, high reliability and data privacy
Trusted foundation for both experienced and new developers to rapidly prototype and deploy agentic AI designs for autonomous edge devices

LAS VEGAS, January 6, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its new eIQ Agentic AI Framework, … Read More → "NXP Advances Edge AI Leadership with New eIQ Agentic AI Framework"

congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards

January 7, 2026

San Diego, CA, January 5, 2026 * * * congatec – a leading vendor of embedded and edge computing building blocks – today launched the industry’s broadest portfolio of Computer-on-Modules (COMs) based on Intel Core Ultra Series 3 processors. The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI acceleration. In most scenarios, the modules’ high level of processing capability means discrete accelerator cards will not be necessary for embedded AI applications. The new Intel Core Ultra Series 3 processor-based COMs are ideal for deployment in AI-powered market segments spanning industrial automation and robotics, smart city and transportation, and healthcare and retail … Read More → "congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards"

With TDK sensing solutions, Engo delivers augmented reality eyewear for performance athletics

January 7, 2026

InvenSense, a TDK Group company, partners with Engo, whose augmented reality glasses enhance athletic performance by placing real-time training stats within an athlete’s field of vision
Using TDK’s compact and ultra-low-power MEMS and TMR sensors with sensor fusion software, Engo offers its AR glasses at the same weight as standard sports sunglasses (36g) and with 12-hour active battery life
TDK enables sensor-detected user gestures like tap detection, which make interactions seamless while running
Engo smart glasses will be demonstrated at CES at TDK booth #15803

Ambarella Launches a Developer Zone to Broaden its Edge AI Ecosystem

Ambarella Developer Zone provides early access for Partners to Evaluate, Build and Deploy Edge AI applications at Scale on Ambarella’s Edge AI SoCs and Cooper Development Software

January 7, 2026

SANTA CLARA, Calif., Jan. 6, 2026 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor … Read More →

BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms

Eagle-A leverages SensPro™ to accelerate LiDAR and radar sensing workloads for real-time perception and sensor fusion

January 6, 2026

LAS VEGAS, NV. – CES 2026 – January 6, 2026 – As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) today announced that BOS Semiconductors has licensed its SensPro™ Read More → "BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms"