News – Page 885 – EEJournal

Evonetix collaborate with imec to scale-up chip-based technology production for third generation DNA synthesis platform

January 15, 2020

CAMBRIDGE (UK), and LEUVEN (Belgium), January 13, 2020 – EVONETIX LTD (‘Evonetix’), the synthetic biology company developing a desktop platform for scalable, high-fidelity and rapid gene synthesis, today announced it has partnered with imec, a world-leading research and innovation hub active in the fields of nanoelectronics and digital technologies, to increase production of Evonetix’s proprietary microelectromechanical systems (MEMS)-based silicon chips, enabling the platform to be manufactured at a commercial scale. The novel silicon chip is a key component of Evonetix’s desktop DNA platform which, once fully developed, will facilitate and enable the rapidly growing field of … Read More → "Evonetix collaborate with imec to scale-up chip-based technology production for third generation DNA synthesis platform"

Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs

January 14, 2020

Successful 7nm designs with Cadence digital technology lead to broader collaboration
Cadence digital implementation solutions and technology leadership drive expanded usage on 5/7nm designs
SAN JOSE, Calif., January 14, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications. Building upon successful 7nm designs, Cadence and Broadcom are expanding the collaboration to include the creation of 5nm designs using Cadence® digital implementation solutions. With these Cadence solutions in place, Broadcom can further augment engineering … Read More → "Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs"

Green Hills Software and StradVision Demonstrate Road-Ready Deep Learning Perception at CES 2020

Safe and Secure INTEGRITY RTOS and StradVision’s SVNet Vision Processing Technology Combine for Deep Learning Driving in Late 2020 Vehicles

January 14, 2020

SANTA BARBARA, Calif., and SAN JOSE, Calif. (Jan. 9, 2020) — When the biggest stakeholders in the automotive and technology worlds converge in Las Vegas at Read More → "Green Hills Software and StradVision Demonstrate Road-Ready Deep Learning Perception at CES 2020"

New RX310 Rugged SDR from Pixus Features TwinRX Option

January 14, 2020

Waterloo, Ontario — Jan 09, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has developed ruggedized versions of commercial software defined radios. The latest in the series is the RX310-2 that features standard commercially available TwinRX daughtercards from Ettus Research(TM), a National Instruments(R) brand.

The RX310-2 allows one or two TwinRX daughtercards to be installed in the chassis. The TwinRX is a dual channel super-heterodyne receiver that offers wide dynamic range and accurate phase synchronization with Local Oscillator (LO) sharing for spectrum monitoring and direction finding. A GPS disciplined oscillator is optional as … Read More → "New RX310 Rugged SDR from Pixus Features TwinRX Option"

VadaTech Announces 1,344Gb/s Fiber FMC+ Module

January 14, 2020

Henderson, NV – January 13, 2020 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the FMC259. The FMC259 is an FPGA Mezzanine Module per VITA 57.4 (FMC+) specification with dual Board-Mount Optical Assemblies, each providing 24 channel full-duplex transceivers capable of up to 28.1 Gb/s per channel ( … Read More → "VadaTech Announces 1,344Gb/s Fiber FMC+ Module"

EM Microelectronic enables holistic omnichannel consumer experience and product authentication

em|echo-V brings together powerful RAIN RFID supply chain functionalities with seamless NFC consumer engagement and web authentication

January 14, 2020

Marin, Switzerland, 10 January 2020 – EM Microelectronic, the ultra-low-power semiconductor company of the Swatch Group and an RFID industry pioneer for more than 30 years, today has announced em|echo-V, its enhanced product authentication dual-frequency RAINFC technology.

em|echo-V enables brands and retailers to offer their customers a holistic omnichannel experience, allowing them not only to purchase the products anytime, anywhere, but to interact with them throughout their life-cycle without compromise on consumer privacy.

Benefits to consumers
The addition of powerful NFC web authentication capabilities, along with the significant improvement in user experience … Read More → "EM Microelectronic enables holistic omnichannel consumer experience and product authentication"

Simplifying and accelerating automotive system design: A new collaboration between Arm and Siemens

January 13, 2020

The automotive industry has entered an intense period of innovation, powered by advances in semiconductor, electronic and software technologies. These emerging technologies will enable a new era of mobility, with technology that is safer and accessible to more people through greater levels of driver assistance and autonomy, less polluting through electrification of powertrain, and offers new experiences for passengers through better connectivity and shared services.

Arm’s vision is that compute power will transform our mobility expectations and experiences. However, delivering on this vision creates new challenges in building … Read More → "Simplifying and accelerating automotive system design: A new collaboration between Arm and Siemens"

TE Connectivity releases MS5839-02BA, an ultra-compact, harsh media resistant digital pressure and temperature sensor

Provides exceptional precision and performance in chlorine and harsh environments

January 13, 2020

DORTMUND, Germany – Jan. 13, 2020 – Miniaturization, performance and precision are key for sensors embedded in consumer devices like swim watches and diving equipment, therefore creating a growing need for high-performing and exceptionally precise sensors. To address this growing demand, TE Connectivity (TE), a world leader in connectivity and sensors, has released the Read More → "TE Connectivity releases MS5839-02BA, an ultra-compact, harsh media resistant digital pressure and temperature sensor"

D3 Engineering Announces a DesignCore® Development Kit Designed Around the TDA4VM SoC Processor from Texas Instruments

January 13, 2020

Rochester, NY – January 8, 2020 – D3 Engineering, a Texas Instruments platinum design partner, announced their DesignCore® RVP-TDA4Vx Development Kit with rugged ECU. The DesignCore® RVP-TDA4Vx Rugged ECU accelerates ADAS and autonomous system product design through production. The production-intent kit features TI’s TDA4VM SoC processor and configurable SerDes interface. The RVP-TDA4Vx Development Kit will be available in 1Q2020.

Automotive applications include automated valet park, deep learning, neural networks, video analytics, object identification and tracking, collision avoidance, driver notification, multi-camera display, mirror replacement, driver and cabin monitoring, sensor fusion, in-vehicle infotainment, and … Read More → "D3 Engineering Announces a DesignCore® Development Kit Designed Around the TDA4VM SoC Processor from Texas Instruments"

Mouser and Grant Imahara Showcase Contract Manufacturing in “Engineering Big Ideas” Video Finale

January 13, 2020

January 13, 2020 – Mouser Electronics, Inc. and celebrity engineer Grant Imahara today released the final Read More → "Mouser and Grant Imahara Showcase Contract Manufacturing in “Engineering Big Ideas” Video Finale"