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Infineon launches new radiation hardened GaN transistors, including one of the first DLA JANS certified GaN device

May 28, 2025

Munich, Germany – 29 May 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the first of a new family of radiation hardened Gallium Nitride (GaN) transistors, fabricated at Infineon’s own foundry, based on its proven CoolGan™ technology. Designed to operate in harsh space environments, the company’s new product is the first in-house manufactured GaN transistor to earn the highest quality certification of reliability assigned by … Read More → "Infineon launches new radiation hardened GaN transistors, including one of the first DLA JANS certified GaN device"

TRI and Bosch Partner on AI Solution for MEMS Packaging

May 27, 2025

[May 26, 2025 – Taipei, Taiwan] Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI’s valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI’s … Read More → "TRI and Bosch Partner on AI Solution for MEMS Packaging"

ABLIC launches Voltage monitoring ICs for driving 5 and 4 LED indicators for simple remaining battery power displays in power tools and other applications

Contributes to energy saving and space saving by not using a microcontroller with one tip of voltage monitoring IC
May 27, 2025

ABLIC (President: Seiji Tanaka, Head Office: Minato-ku, Tokyo; hereinafter “ABLIC”), a group company of MinebeaMitsumi Inc., today launched the S-82F9 Series for driving 5 LED indicators and the S-82D9 Series for driving 4 LED indicators of voltage monitoring ICs for simple remaining battery power displays.

The S-82F9 Series and S-82D9 Series launched today are voltage monitoring ICs for simple remain battery power displays with 5 LED or 4 LED indicators. These products achieve monitoring of multiple voltages on a single IC which contributes to saving space, and can also carry out voltage monitoring of batteries at low … Read More → "ABLIC launches Voltage monitoring ICs for driving 5 and 4 LED indicators for simple remaining battery power displays in power tools and other applications"

ASRock Industrial Enhances Industrial Edge Computing with Ubuntu Pro-Enabled Robust Edge AIoT Platforms

May 27, 2025

Taipei, Taiwan (May 27, 2025) – ASRock Industrial, a leader in Industrial computing, and Canonical have partnered to bring Ubuntu Pro for Devices to the entire range of Robust Edge AIoT Platforms. This partnership represents a major leap forward in secure industrial edge computing, providing enterprises with unparalleled security, extended lifecycle support, and real-time computing capabilities. With Ubuntu Pro’s 10 years of security updates for the operating system and open-source application packages, along with compliance with the Cyber Resilience Act (CRA) and other cybersecurity regulations like FIPS and NIST, this integration empowers seamless deployment across various industries, including industrial automation, … Read More → "ASRock Industrial Enhances Industrial Edge Computing with Ubuntu Pro-Enabled Robust Edge AIoT Platforms"

Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz

Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications
May 27, 2025

LEUVEN (Belgium), MAY 27, 2025 — At the IEEE ECTC 2025 conference, imec
– a world-leading research and innovation hub in nanoelectronics and
digital technologies – highlights the exceptional performance and
flexibility of its 300mm RF silicon interposer platform. The platform
enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on
a single carrier, achieving a record-low insertion loss of just
0.73dB/mm at frequencies up to 325GHz. This advancement paves the way
for compact, low-loss, and scalable next-generation RF and mixed-signal
systems.

In pursuit of advanced applications – from wireless data centers and
… Read More → "Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz"

Siemens democratizes AI-driven PCB design for small and medium electronics teams

May 23, 2025

New PADS Pro Essentials and Xpedition Standard software bring accessible, collaborative and AI powered, professional-grade PCB design to the SMB market to accelerate design cycles, reduce risk and help engineers and small teams deliver higher-quality products faster

Siemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.

Built on Siemens’ Xpedition technology, these new offerings combine intuitive user experiences, integrated cloud collaboration and AI-driven automation to empower small teams and independent engineers … Read More → "Siemens democratizes AI-driven PCB design for small and medium electronics teams"

Silicon Labs Unveils First Series 3 SoCs, Powering the Next Wave of IoT Breakthroughs

SiXG301 and SiXG302, Silicon Labs' first wireless SoC families at the 22 nm process node, deliver breakthroughs in compute, power efficiency, integration and security
May 23, 2025

AUSTIN, Texas, May 22, 2025 /PRNewswire/ — Silicon Labs, the leading innovator in low-power wireless solutions, today announced the first products of its Series 3 portfolio with the introduction of two new wireless … Read More → "Silicon Labs Unveils First Series 3 SoCs, Powering the Next Wave of IoT Breakthroughs"

New Intel Xeon 6 CPUs to Maximize GPU-Accelerated AI Performance

New Xeon 6 processors with Priority Core Turbo technology boost AI workloads and debut in NVIDIA’s latest DGX B300 AI systems.
May 23, 2025

SANTA CLARA, Calif., May 22, 2025 – Intel today unveiled three new additions to its Intel® Xeon® 6 series of central processing units (CPUs), designed specifically to manage the most advanced graphics processing unit (GPU)-powered AI systems. These new processors with Performance-cores (P-cores) include Intel’s innovative Priority Core Turbo (PCT) technology and Intel® Speed Select Technology – Turbo Frequency (Intel® SST-TF), delivering customizable CPU core frequencies to boost GPU performance across demanding … Read More → "New Intel Xeon 6 CPUs to Maximize GPU-Accelerated AI Performance"

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