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Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications

Multiple site designation achieved through addition of Horsham, Pa. facility
June 2, 2025
Technical Highlights
  • Multiple Elma sites are now accredited to AS9100
  • Quality management highlighted as a core principle for the company
  • Certification developed specifically for aviation, space and defense industries

 

FREMONT, Calif., June 2025 – Elma Electronic now includes AS9100:D and ISO 9001:2015 certifications at its Horsham, … Read More → "Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications"

xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs

With temperature reduction as much as 30%, µCooling for SSDs is poised to revolutionize thermal management in high-density data centers and consumer computing devices.
May 29, 2025

Santa Clara, California, May 29, 2025 – xMEMS Labs, Inc., inventor of the world’s first monolithic silicon MEMS air pump, today announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs.

Traditionally, SSD thermal management has relied on passive heat spreaders and ambient airflow from system fans, which often fall short in managing the intense, sustained workloads common in AI, HPC, and modern computing environments. As SSD speeds push … Read More → "xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs"

Siemens expands OSAT Alliance membership to build domestic semiconductor supply chains

Mosaic Microsystems and NHanced Semiconductors are latest to join Siemens’ initiative to build secure domestic semiconductor industry in the USA
May 29, 2025

Siemens Digital Industries Software announced today the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.

The OSAT Alliance helps mutual customers to fully leverage the integrated workflow across Siemens’ EDA portfolio (including Calibre® software, Innovator3D IC™ software, HyperLynx™ software and Xpedition™ Package Designer software) and encourage selected supply-chain partners to develop design … Read More → "Siemens expands OSAT Alliance membership to build domestic semiconductor supply chains"

NXP Enables Secure Authentication with New NTAG X DNA Connected NFC Tag

Compatible with any NFC mobile device, NXP’s NTAG X DNA connected NFC tag combines high-density memory and a high data rate with secure unique NFC (SUN) authentication to enable secure authentication and seamless connectivity.
May 29, 2025

What’s new: NXP Semiconductors today announced NTAG X DNA, the company’s new Type 4 secure connected NFC tag. The NTAG X DNA leverages 16KB of high-density memory, a high data rate and secure unique NFC (SUN) authentication to quickly and easily verify … Read More → "NXP Enables Secure Authentication with New NTAG X DNA Connected NFC Tag"

Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz

Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications
May 28, 2025
LEUVEN (Belgium), MAY 27, 2025 — At the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform. The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a single carrier, achieving a record-low insertion loss of just 0.73dB/mm at frequencies up to 325GHz. This advancement paves the way for compact, low-loss, and scalable next-generation RF and mixed-signal systems.
In pursuit of advanced applications – from wireless data centers and high-resolution automotive radar to pluggable optical transceivers … Read More → "Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz"
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