News – Page 862 – EEJournal

ON Semiconductor Unveils New QCS-AX2 Series for Wi-Fi 6E Applications

AdaptivMIMO technology provides flexible configurations for fast 6 GHz adoption

April 21, 2020

PHOENIX, Ariz. – Apr. 21, 2020 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, announced sampling of its new QCS-AX2 chipset family that supports the 6GHz spectrum band based on the enhanced Wi-Fi 6E standard. Designed with a high performance, flexible architecture to maximize usage of the 6GHz band, the new product family is optimized for high-throughput Wi-Fi applications, such as access points, gateways, and mesh networking solutions for dense environments and underserved areas.

The QCS-AX2 series is built on an integrated baseband and RF (radio frequency) architecture that supports key Wi-Fi 6E features, such as orthogonal frequency-division multiple access ( … Read More → "ON Semiconductor Unveils New QCS-AX2 Series for Wi-Fi 6E Applications"

Keysight’s 5G Solutions Enable Hisense Communication to Accelerate Development of High-Quality 5G Devices

Consumer electronics and appliance manufacturer selects Keysight’s 5G test platform to validate the performance of 5G designs

April 21, 2020

SANTA ROSA, Calif., April 21, 2020 – Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that Qingdao Hisense Communication Co., Ltd., has selected Read More → "Keysight’s 5G Solutions Enable Hisense Communication to Accelerate Development of High-Quality 5G Devices"

Fujitsu Develops Easy to Handle, Flexible Nanotube Adhesive Sheet Technology with High Thermal Conductivity

April 21, 2020

KAWASAKI, Japan, Apr 17, 2020 – (JCN Newswire) – Fujitsu Laboratories Ltd. today announced the development of the world’s first adhesive sheet composed of carbon nanotubes with extremely high thermal conductivity of up to 100 W/mK (watt per meter per Kelvin)(1).

Carbon nanotubes have high thermal conductivity and represent a promising candidate for heat dissipation from heat sources including semiconductor devices. Nevertheless, the material remains difficult to handle due to its fragility, rendering it impractical for many purposes. To address this, Fujitsu developed a technology for laminating vertically aligned carbon nanotubes, while maintaining their original characteristics … Read More → "Fujitsu Develops Easy to Handle, Flexible Nanotube Adhesive Sheet Technology with High Thermal Conductivity"

Uhnder and dSPACE Establish Cooperation for Radar Technology Development

April 21, 2020

Detroit / Austin, April 16, 2020. As radar systems are a key technology for automated and autonomous driving, Uhnder and dSPACE have agreed to cooperate to ensure that the developments in radar sensor technology can keep pace with the high safety requirements in traffic. Both companies will support each other in the continuous development of sensors and validation solutions.

Digital Methods for More Reliable Detection

To meet high requirements for safety and quality, radar sensors must detect their surroundings reliably and in great detail. For road use, it is … Read More → "Uhnder and dSPACE Establish Cooperation for Radar Technology Development"

Keysight, DEKRA Join Forces to Address Growing Electric Vehicle Market

Enables automotive industry to deploy interoperable charging solutions across different standards and interfaces

April 21, 2020

SANTA ROSA, Calif., April 16, 2020

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that DEKRA has selected Read More → "Keysight, DEKRA Join Forces to Address Growing Electric Vehicle Market"

Bourns Announces New AEC-Q200 Compliant Thick Film Resistor Series Designed for General Purpose Applications

Available in 8 Compact Form Factors, New Resistors Are Space-Saving Solutions in Form Factors as Small as 0201 to Meet Downsizing Market Trends

April 21, 2020

RIVERSIDE, Calif., April 20, 2020 – Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the availability of a new AEC-Q200 compliant series of thick film chip resistors. Bourns continues to take a leading role in introducing space-saving resistor products by offering its latest Read More → "Bourns Announces New AEC-Q200 Compliant Thick Film Resistor Series Designed for General Purpose Applications"

Sectigo and Infineon Partner to Protect IoT Devices with Automated Factory Provisioning of Certificates

Integration Advances Security in Connected Devices, Including Smart Home, Connected Cars, Industrial Machines, and More

April 20, 2020

ROSELAND, N.J. – April 16, 2020 – Sectigo, a leading provider of automated digital identity management and web security solutions, today announced a partnership with Infineon Technologies AG to provide automated certificate provisioning for Infineon’s OPTIGA™ Trusted Platform … Read More → "Sectigo and Infineon Partner to Protect IoT Devices with Automated Factory Provisioning of Certificates"

SLX FPGA 2020.1 Extends C++ Support and Advanced Array Partitioning

Performance enhancements further enable Aerospace and FinTech Industries

April 20, 2020

San Jose, CA – Apr 20, 2020 – Silexica (silexica.com) has announced the release of SLX FPGA 2020.1 which can now process and analyze the hls::stream template class and support array partitioning of ap_int and ap_fixed data types from Xilinx. These enhancements extend SLX FPGA’s ability to analyze C/C++ code further, make better decisions, and further accelerate performance.

An example of the performance improvements is demonstrated in … Read More → "SLX FPGA 2020.1 Extends C++ Support and Advanced Array Partitioning"

RS Components rallies its DesignSpark engineering community to produce 3D-printed visors to help protect COVID-19 health workers

RS is donating RS PRO PLA filament to provide enough for 20,000 visor frames to support National 3D Printing Society initiative, enabling essential PPE to quickly reach frontline medical and care staff in the UK

April 20, 2020

LONDON, UK, 20 April 2020 – RS Components (RS) (https://uk.rs-online.com/web/), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, has embarked on a partnership with the National 3D Printing Society (N3DPS) (Read More → "RS Components rallies its DesignSpark engineering community to produce 3D-printed visors to help protect COVID-19 health workers"

Curtiss-Wright Expands Industry Leading Family of PCAP Touchscreen Rugged Displays with New Compact 7” Single Input Design

7” SVDU-M 1920x1080 touchscreen display supports intuitive smartphone style multipoint navigation and control

April 20, 2020

ASHBURN, Va. – April 20, 2020 – Curtiss-Wright’s Defense Solutions division, a proven leading supplier of deployed video management solutions, has announced the further expansion of its family of rugged displays designed to meet the unique requirements of deployed military and civil aircraft and ground vehicles. The introduction of the new Read More →