News – Page 860 – EEJournal

Pixus Announces Line of Chassis Slot Baffles for Controlling Airflow Levels

April 28, 2020

Waterloo, Ontario — Apr 28, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers electronic enclosure air baffles for controlling the amount of airflow for an individual backplane slot. The air blockers can be employed in OpenVPX designs or other Eurocard standards such as VME/64x, CompactPCI, cPCI Serial, and more.

There are four variants of the Pixus airflow slot baffles: 50% blockage, 75% blockage, total blockage and custom. They come in 160mm length standard and 5HP (1.0”) width, but are customizable to 4HP (0.8”). The airflow baffles only modify the airflow on the front side … Read More → "Pixus Announces Line of Chassis Slot Baffles for Controlling Airflow Levels"

OmniVision Unveils World’s First 0.7 Micron, 64 Megapixel Image Sensor for Ultra Thin, High End Smartphones

Industry’s Smallest 64 MP, 1/2” Optical Format Sensor for Smartphone Cameras

April 28, 2020

SANTA CLARA, Calif. – April 28, 2020 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV64B, the industry’s only 64 megapixel (MP) Read More → "OmniVision Unveils World’s First 0.7 Micron, 64 Megapixel Image Sensor for Ultra Thin, High End Smartphones"

Cellular IoT: Infineon’s OPTIGA™ Connect eSIM solution offers pre-integrated network coverage in 200+ countries and territories

April 28, 2020

Munich, Germany – 28 April 2020 – Cellular networks will be the communication backbone for billions of mobile devices and machines connected to the Internet of Things (IoT). At the core of this development is the embedded Subscriber Identity Module (eSIM), which securely connects devices to networks. To shape this development, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching a comprehensive turnkey eSIM solution for the plethora of IoT devices and applications.

Infineon’s new OPTIGA™ Connect eSIM IoT solution based on leading-edge security hardware comes with pre-integrated carrier-agnostic cellular coverage in more than 200 countries and territories. Infineon has partnered … Read More → "Cellular IoT: Infineon’s OPTIGA™ Connect eSIM solution offers pre-integrated network coverage in 200+ countries and territories"

ACEINNA Launches Ultra Reliable and Highly Accurate 1.3°/hr IMU Sensor

April 28, 2020

Easy to integrate, cost effective, triple redundant IMU hardware and software for guidance and navigation solutions in autonomous machines and vehicles
Includes standard SPI bus for cost-effective board-to-board communications.

Andover, Massachusetts- April 28, 2020

Keysight Launches New 5G Core Network Test Solution – LoadCore

New LoadCore software selected by China Mobile Research Institute to qualify performance and reliability of voice and data

April 28, 2020

SANTA ROSA, Calif., April 28, 2020

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced LoadCore 5G Core (5GC) Testing software – and China Mobile Research Institute (CMRI) has selected LoadCore to validate performance using 5GC network … Read More → "Keysight Launches New 5G Core Network Test Solution – LoadCore"

Khronos Group Releases OpenCL 3.0

Provisional Specifications publicly available today for industry feedback Enhanced deployment flexibility sets stage for new pervasively available core functionality

April 27, 2020

IWOCL – April 27, 2020 – 6:00 AM GMT – Today, The Khronos^® Group, an open consortium of industry-leading companies creating advanced interoperability standards, publicly releases the OpenCL™ 3.0 Provisional Specifications. OpenCL 3.0 realigns the OpenCL roadmap to enable developer-requested functionality to be broadly deployed by hardware vendors, and it significantly increases deployment flexibility by empowering conformant OpenCL implementations to focus on functionality relevant to their target markets. OpenCL 3.0 also integrates subgroup functionality into the core specification, ships with a new OpenCL C 3.0 language specification, uses a new unified specification format, and introduces extensions for asynchronous data copies to enable a new class of embedded … Read More →

ON Semiconductor Expands its Portfolio for Industrial Motor Drive Applications

Latest product offerings provide integration, energy efficiency, precision, and reliability

April 27, 2020

PHOENIX, Ari. – April 27, 2020 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, continues to expand its portfolio for industrial motor drive applications (https://bit.ly/2JOz1VH), to further help customers solve their specific design challenges. Motor drive systems are proliferating along with industrial automation and robotics (Read More → "ON Semiconductor Expands its Portfolio for Industrial Motor Drive Applications"

STMicroelectronics Integrates Common-Mode Filter and ESD Suppression in New Automotive-Protection Devices

April 27, 2020

Geneva, April 27, 2020 – STMicroelectronics’ ECMF04-4HSM10Y and ECMF04-4HSWM10Y automotive-qualified common-mode filters (CMF) for high-speed serial buses protect interface ICs by integrating transient-suppression diodes with low clamping voltage.

These are the first CMFs on the market with automotive-grade qualification and automotive surge compliance guaranteed. They are not only produced and qualified according to AEC-Q101 requirements but are also designed and tested against automotive surge specifics such as ISO10605.

The filters replace discrete common-mode chokes or LTCC (low-temperature cofired ceramic) devices that are typically larger and provide … Read More → "STMicroelectronics Integrates Common-Mode Filter and ESD Suppression in New Automotive-Protection Devices"

NXP Supplies Murata with RF Front-end ICs for Wi-Fi 6 Modules

Companies combine NXP’s front-end ICs (FEIC) and Murata’s integration expertise to deliver small, ultra-compact RF modules for Wi-Fi 6

April 24, 2020

Eindhoven, Netherlands – April 23, 2020 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced it has collaborated with Murata, a system-in-package integrator for 5G mobile platforms, to deliver the industry’s first radio frequency (RF) front-end modules designed with the latest Wi-Fi 6 standards. Together, the companies are delivering a solution that can reduce design times, improve time-to-market and save board space in next generation Wi-Fi 6 implementations.

The NXP FEIC (Read More → "NXP Supplies Murata with RF Front-end ICs for Wi-Fi 6 Modules"

Imperas Leading RISC-V CPU Reference Model for Hardware Design Verification Selected by Mellanox

Verification tools and golden reference model provide support for RISC-V custom instruction extensions and full processor design verification

April 24, 2020

We have announced that Mellanox Technologies, a leading supplier of high-performance, end-to-end smart interconnect solutions for datacenter servers and storage systems, has selected our advanced hardware verification of RISC-V processors. RISC-V as an open ISA (Instruction Set Architecture) permits many configuration and options for processor implementation and microarchitectural features, in addition to extension with custom instructions. Simulation based methodologies are the foundation for hardware design verification (DV) throughout the semiconductor industry in achieving first pass prototype success.

The Imperas RISC-V models are provided in source form, which allows users to adapt and extend for custom configurations independently. … Read More → "Imperas Leading RISC-V CPU Reference Model for Hardware Design Verification Selected by Mellanox"