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Airspan Networks Extends Collaboration with ON Semiconductor on Wi-Fi 6 Solutions for Fixed Wireless Access Applications

BOCA RATON and PHOENIX, May 6 , 2020 — Airspan Networks Inc. announced its collaboration with ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, to capitalize on their industry-leading Wi-Fi 6 performance solutions, including the QCS-AX, for Fixed Wireless Access (FWA) applications.

With hundreds of thousands of sites deployed globally Airspan is at the forefront of providing mobile operators innovative wireless solutions for high-reliability public and private urban, suburban and rural applications. Offering high-capacity, high-performance solutions that allow operators to rapidly deploy at scale.

Next-generation Airspan solutions will leverage ON Semiconductor’s QCS-AX Wi-Fi 6 family of chipsets. These products will … Read More → "Airspan Networks Extends Collaboration with ON Semiconductor on Wi-Fi 6 Solutions for Fixed Wireless Access Applications"

TDK launches high-performance 6-axis IMU with industry-leading motion sensor performance for IoT, robotics, AR/VR and wearable applications

  • External clock input improves system level performance 
  • 19-bit gyroscope resolution enhances slow-motion sensing accuracy
  • 2x increased temperature stability minimizes motion drift 
  • 40% lower noise-figure enhances sensor responsiveness

May 5, 2020

TDK Corporation announces the availability of the InvenSense ICM-42688-P high-performance motion sensor, a 6-axis MEMS MotionTracking™ device that combines a 3-axis gyroscope and a 3-axis accelerometer in a 2.5 … Read More → "TDK launches high-performance 6-axis IMU with industry-leading motion sensor performance for IoT, robotics, AR/VR and wearable applications"

Xilinx Teams with Leading Universities Around the World to Establish Adaptive Compute Research Clusters

SAN JOSE, Calif., May 5, 2020 – Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced it is establishing Xilinx® Adaptive Compute Clusters (XACC) at four of the world’s most prestigious universities. The XACCs provide critical infrastructure and funding to support novel research in adaptive compute acceleration for high performance computing (HPC). The scope of the research is broad and encompasses systems, architecture, tools and applications.

The XACCs will be equipped with the latest Xilinx hardware and software technologies for adaptive compute acceleration. Each cluster is specially configured … Read More → "Xilinx Teams with Leading Universities Around the World to Establish Adaptive Compute Research Clusters"

MathWorks Delivers Additional AI Capabilities to Engineers and Scientists with Release 2020a of MATLAB and Simulink

Natick, Massachusetts, United States – (6 May 2020)

MathWorks today introduced Release 2020a with expanded AI capabilities for deep learning. Engineers can now train neural networks in the updated Deep Network Designer app, manage multiple deep learning experiments in a new Experiment Manager app, and choose from more network options to generate deep learning code. R2020a introduces new capabilities specifically for automotive and wireless engineers in addition to hundreds of … Read More → "MathWorks Delivers Additional AI Capabilities to Engineers and Scientists with Release 2020a of MATLAB and Simulink"

Powercast and Liquid X Announce Printed Electronics Venture to Enable Durable, Washable e-Textiles that Seal in Wireless Charging Electronics

Powercast Corporation, the leader in radio-frequency (RF)-based long-range over-the-air wireless power technology, and Liquid X, an advanced manufacturer of functional metallic inks with prototype-to-production design and manufacturing capabilities, today announced a printed electronics venture to enable garment manufacturers to easily integrate wireless power functionality into durable, flexible, high performance and washable e-textiles.

Utilizing Liquid X’s proprietary ink technology, manufacturers can print circuitry directly onto a garment, add Powercast’s wireless power technology and a battery, and seal this all into the garment during the … Read More → "Powercast and Liquid X Announce Printed Electronics Venture to Enable Durable, Washable e-Textiles that Seal in Wireless Charging Electronics"

Versatile, compact and efficient 250/450W power supply for healthcare, industrial and ITE applications

May 5, 2020 – XP Power announces the new ECH450 series of compact, high efficiency power supplies available in open frame or a range of enclosed formats. Delivering 250W when convection cooled and the full 450W when force cooled, or when using the enclosed versions with an integral fan, the ECH450 series offers class B conducted & radiated emissions and carries worldwide ITE and medical approvals making it ideal for a vast range of industrial, IT and healthcare applications including those requiring BF patient protection.

The convection cooled ratings make these power supplies ideally suited to medical device applications, where … Read More → "Versatile, compact and efficient 250/450W power supply for healthcare, industrial and ITE applications"

STMicroelectronics Helps Meet Functional-Safety Norms with Certified Software for STM32 and STM8 Families

Geneva, May 5, 2020 – STMicroelectronics has released three functional-safety packages that simplify development of safety-critical industrial, medical, consumer and automotive products based on STM32 and STM8 microcontrollers and microprocessors.

The packages are available free of charge and contain the resources developers need to satisfy applicable IEC and ISO specifications. ST’s portfolio of over 1000 STM32 devices and the STM8 microcontroller family including STM8AF automotive-qualified devices delivers breadth of choice and affordability typically unequalled by more expensive dedicated safety MCUs.

Targeting industrial applications, the Read More → "STMicroelectronics Helps Meet Functional-Safety Norms with Certified Software for STM32 and STM8 Families"

SmartDV Expands Line of Memory Controller Design IP, strengthening its Already Broad Portfolio of IP Products

SAN JOSE, CALIF. –– April 30, 2020 –– SmartDV™ Technologies, the Proven and Trusted choice for Design and Verification Intellectual Property (IP), today released a line of memory controller Design IP used for high-speed memories including HBM2/2E, HBM3, GDDR6 and LPDDR4/5. 

 It also expanded its support for Flash memory controllers with the additions of Serial Flash, XSPI, and Octal SPI controllers, strengthening its already broad portfolio of Design IP. 

Read More → "SmartDV Expands Line of Memory Controller Design IP, strengthening its Already Broad Portfolio of IP Products"

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