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GLOBALFOUNDRIES to Implement ITAR and Strict Security Assurances at its Advanced U.S. Semiconductor Manufacturing Facility

Company’s most advanced facility to expand capability to support U.S. government defense technology development and manufacturing, while further easing U.S. dependence on overseas suppliers
May 22, 2020

Santa Clara, Calif., May 20, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry and the leading U.S. pure-play manufacturer of semiconductors, today announced plans to implement export control security measures at its most advanced manufacturing facility, Fab 8, in Malta, New York. GF will bring its Fab 8 facility into compliance with both the U.S. International Traffic in Arms Regulations (ITAR) standards and the Export Administration Regulations (EAR), making the company the most advanced ITAR foundry in the country. By taking this significant step, GF deepens its partnership with the U.S. Department of Defense (DoD) and the U.S. … Read More → "GLOBALFOUNDRIES to Implement ITAR and Strict Security Assurances at its Advanced U.S. Semiconductor Manufacturing Facility"

Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications

Enhanced Version of Award-winning Solutions Stack Now Available on Low Power, 28 nm FD-SOI-based Lattice CrossLink-NX FPGAs
May 22, 2020

HILLSBORO, OR – May 21, 2020 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today launched the latest version of its complete solutions stack for on-device AI processing at the Edge, Lattice sensAI™ 3.0. The latest version of the stack includes support for the CrossLink-NX™ family of FPGAs for low power smart vision applications and features customized convolutional neural network (CNN) IP, a flexible accelerator IP that simplifies implementation of … Read More → "Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications"

SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform

Composable Computing Platform future-proofed against needs of future computing paradigms
May 22, 2020

CAMBRIDGE, UK – 21 May 2020

UltraSoC today announced that its embedded analytics technology has been selected by SimpleMachines, Inc (SMI) for use within SMI’s innovative Composable Computing Platform. UltraSoC’s technology will allow SMI and its customers to gain an intimate understanding of the behavior of the hardware and software within the company’s products, which are targeted at a diverse range of demanding applications such as security, visual cognition, language comprehension and web-scale personalization.

SMI’s solutions employ a fundamentally new, patented processor architecture which is designed to be fully customizable to achieve maximum utilization … Read More → "SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform"

Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications

Low-Power Wireless Multi-Sensor Edge-Intelligence Modules Address Smart Factory, Smart Home and Smart Life Solutions
May 20, 2020

Neu-Isenburg, Germany; Munich, Germany; Geneva, Switzerland, 20th of May, 2020 — Arrow Electronics, Panasonic Industry, and STMicroelectronics (ST) have introduced a low-power wireless multi-sensor edge-intelligence solution for smart factory, smart home and smart life applications.

The IoT Solution Module combines Arrow’s engineering and global distribution capabilities with Panasonic Industry’s IoT modules based on the ST BlueTile (STEVAL-BCN002V1B) multi-sensor development kit. This combination enables customers to test their ideas easily and bring new IoT products to the market faster.

The IoT Solution Module features ST’s … Read More → "Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications"

Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization

Imec extends its secure proximity portfolio with next-generation high-precision and low-power ultra wideband technology
May 20, 2020

LEUVEN (Belgium), MAY 19, 2020 — Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, expands its secure proximity research program (for secure and very high accuracy ranging) with next-generation high-precision and low-power ultra wideband (UWB) technology. With a track record of over 15 years of UWB research, imec has been rallying experts in hardware and software to develop next-gen UWB technology that achieves a ranging accuracy of less than 10cm in challenging environments while consuming 10 times less power than today’s implementations. The technology paves the way for micro-localization applications in a wide range of domains: from secure (keyless) … Read More → "Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization"

Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications

Latest additions to the portfolio deliver improved verification throughput to ensure SoCs and microcontrollers meet industry standards
May 20, 2020

SAN JOSE, Calif., May 19, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of 10 new Verification IP (VIP) solutions that allow engineers to quickly and effectively verify their designs to meet the specifications for the latest standards protocols. The expansion of the Cadence® VIP portfolio supports customers developing SoCs and microcontrollers for automotive, hyperscale data center and mobile applications, including with CXL, HBM3, TileLink and MIPI® CSI 2sm 3.0.

The Cadence VIP are part of the Cadence Verification Suite and support the company’s Intelligent System Design™ strategy. The Cadence Verification Suite is comprised of core engines … Read More → "Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications"

Sundance launches the VF370 Intel-based 3U OpenVPX SBC module for SWaP applications

May 19, 2020
  • Highly flexible architecture combining Intel Atom E3900 Series embedded processors, Intel Cyclone FPGA technology and an FMC mezzanine site
  • Ideally suited to extreme environments, enhanced reliability industrial control, automotive, mil/aero and UltraHD video and graphics processing
  • Available in standard air-cooled and rugged conduction-cooled versions

Chesham, UK – May 19, 2020. Sundance Multiprocessor Technology Ltd., an established manufacturer and supplier of embedded modules, has launched the VF370, an Intel-based 3U OpenVPX single board computer (SBC) module designed for reduced Size, Weight and Power (SWaP) requirements. Available in standard air-cooled and … Read More → "Sundance launches the VF370 Intel-based 3U OpenVPX SBC module for SWaP applications"

Industry-First, Automotive-Compliant ReDriver from Diodes Incorporated Enables DisplayPort via USB Type-C

May 19, 2020

Plano, Texas – May 19, 2020 – Diodes Incorporated (NASDAQ: DIOD) today announced the industry’s first automotive AEC-Q100 grade 3 qualified 10Gbps USB-C® DisplayPort™ Alternate (DP-Alt) mode linear ReDriver™ IC. The DP-Alt mode allows the transfer of DisplayPort signals through a USB Type-C® connector. Supporting 8.1Gbps DP1.4 and the 10Gbps USB 3.2 specifications, the PI3DPX1207Q provides a transparent, protocol-agnostic … Read More → "Industry-First, Automotive-Compliant ReDriver from Diodes Incorporated Enables DisplayPort via USB Type-C"

With the VERA-P3, u-blox reaffirms its commitment to traffic safety by making V2X easily accessible

The compact module, based on u-blox core technology, brings easy access to V2X, an essential enabler of increased safety, convenience, and efficiency on the road
May 19, 2020

Thalwil, Switzerland – May 19, 2020 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, today announced its latest contribution to vehicle-to-everything (V2X) technology: the VERA-P3 V2X module (https://www.u-blox.com/en/product/vera-p3-series). Based on the u-blox UBX-P3 V2X chip, VERA-P3 puts automotive OEMs, Tier-1s, and … Read More → "With the VERA-P3, u-blox reaffirms its commitment to traffic safety by making V2X easily accessible"

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