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Keysight Delivers USB4 Test Solutions to Optimize Design Performance and Ensure Standard Compliance

Quickly and accurately validates USB interfaces to test, debug, and characterize USB4 designs
July 13, 2020

SANTA ROSA, Calif., July 13, 2020 – Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced new USB4™ solutions that maximize the performance of USB designs and ensure compliance with the USB standard to deliver accuracy and high signal fidelity.

Keysight is active in next-generation USB4 specifications implemented by the USB Implementers Forum</ … Read More → "Keysight Delivers USB4 Test Solutions to Optimize Design Performance and Ensure Standard Compliance"

Virtual Sensor Experience: Infineon’s digital sensor booth with live presentations from July 20 to 22, 2020

July 13, 2020

Munich, Germany – 13 July, 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is continuing its virtual trade show strategy and will present the company’s sensor solutions live from July 20 to 22, 2020. The in-house digital trade show “Virtual Sensor Experience” (VSE) will focus on the automotive, consumer and industrial sectors. With 22 product demonstrations, 15 live presentations and a digital Makers’ Corner, Infineon will offer customers, partners and media detailed insights into its portfolio. After the live program ends on July 22, all information will be available on demand until the end of August.

Participation is very easy: After registering at Read More → "Virtual Sensor Experience: Infineon’s digital sensor booth with live presentations from July 20 to 22, 2020"

Vishay Intertechnology’s ENYCAP™ Energy Storage Capacitors Now Available in Seven Smaller Case Sizes

New Sizes for the Electrical Double-Layer Energy Storage Capacitors Range From 10 mm x 20 mm to 12.5 mm x 40 mm, With Capacitance From 5 F to 22 F
July 13, 2020

MALVERN, Pa. — July 13, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that its ENYCAP™ electrical double-layer energy storage capacitors for energy harvesting and power backup applications are now available in seven smaller case sizes ranging from 10 mm by 20 mm to 12.5 mm by 40 mm, with capacitance values from 5 F to 22 F.

With their new compact sizes, the standard 220 EDLC, ruggedized 225 EDLC-R, high voltage 230 EDLC-HV, and ruggedized, high voltage 235 EDLC-HVR series ENYCAP capacitors increase power density and save space in a wide range of industrial, renewable energy, and automotive applications. These include smart meters, handheld electronics, robotics, energy harvesting devices, … Read More → "Vishay Intertechnology’s ENYCAP™ Energy Storage Capacitors Now Available in Seven Smaller Case Sizes"

Imagination announces XS, the automotive industry’s most advanced GPU IP

July 10, 2020

London, UK – 8th July 2020 – Imagination Technologies announces the XS GPU product class for automotive, enabling ADAS acceleration and safety-critical graphics workloads. XS represents the most advanced automotive GPU IP created to-date and is the first licensable IP in the industry that is ISO 26262-capable, a standard that addresses risk in the automotive industry.

 

Safety critical graphics and compute capabilities are a requirement for next-generation in-car systems, such as surround view, digital dashboards and ADAS. The XS design employs a new safety architecture with unique mechanisms for compute and graphics delivering … Read More → "Imagination announces XS, the automotive industry’s most advanced GPU IP"

Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric and Hybrid Electric Vehicle HVAC Systems

July 9, 2020
Düsseldorf, July 9, 2020 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the ZSSC4132 – an automotive pressure sensor solution featuring an integrated certified LIN v2.2a interface. The single-package sensor signal conditioner (SSC) delivers best-in-class performance, increased design flexibility, and cost efficiency in a compact form factor for HVAC applications used in plug-in hybrid electric vehicle (PHEV), Battery Electric Vehicle (BEV), and Fuel-cell Electric Vehicle (FCEV) climate control systems.

u-blox Partners with Cohda Wireless on Next Generation V2X Solution

July 9, 2020

Thalwil, Switzerland – July 9, 2020 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies and services, has partnered with Cohda Wireless, a global leader in the development of connected autonomous vehicle software, to produce an advanced V2X solution for the cooperative intelligent transport market. Cohda’s world-leading V2X software stack will support the u-blox V2X chip UBX-P3 for connectivity based on DSRC/802.11p standards.

Cohda Wireless and u-blox have a long-standing relationship and share a common vision of leveraging wireless technology to reduce the number of road accidents and fatalities across the … Read More → "u-blox Partners with Cohda Wireless on Next Generation V2X Solution"

STMicroelectronics and Fingerprint Cards Cooperate to Develop and Launch an Advanced Biometric Payment Card Solution

July 9, 2020

Geneva, Switzerland and Göteborg, Sweden, July 9, 2020 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has teamed with world-leading biometric company Fingerprint Cards AB (Fingerprints) to develop an advanced Biometric System-on-Card (BSoC) solution based on fingerprint-recognition technology, addressing the market demand to enhance contactless payment-card security and convenience.

The BSoC integration combines ST’s latest-generation secure-payment technology based on the ST31/STPay chipset and STM32 general-purpose microcontrollers with Fingerprints’ next-generation T-shape sensor module to provide a turnkey battery-less secure solution for the banking market.</ … Read More → "STMicroelectronics and Fingerprint Cards Cooperate to Develop and Launch an Advanced Biometric Payment Card Solution"

Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices

July 8, 2020

LEUVEN (Belgium), and Santa Clara, Calif., July 8, 2020 — Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced a hardware demonstration of a new artificial intelligence chip. Based on imec’s Analog in Memory Computing (AiMC) architecture utilizing GF’s 22FDX® solution, the new chip is optimized to perform deep neural network calculations … Read More → "Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices"

IAR Systems launches support for flagship Renesas MCUs across security development framework

July 8, 2020

Uppsala, Sweden—July 8, 2020—IAR Systems®, the future-proof supplier of software tools and services for embedded development, today releases new versions of the security development tool C-Trust® and the Security from Inception Suite, which extend the device support with a number of microcontrollers (MCUs) from Renesas Electronics Corporation, further addressing the increased security requirements for embedded applications.

C-Trust works as an extension of the complete development toolchain IAR Embedded Workbench® and enables developers to easily protect an existing or new application without having to master the deeper complexities of security. The Security from Inception Suite integrates C-Trust with … Read More → "IAR Systems launches support for flagship Renesas MCUs across security development framework"

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