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BrightSign Launches New AI Toolkits at InfoComm 2025 for More Customized, Captivating Digital Signage

New AI capabilities help users engage audiences with more personalized, dynamic digital signage content.
June 9, 2025

SAN JOSE, CA, June 5, 2025 — With digital displays having the power to capture more views than static displays, the stakes are high for organizations to implement digital signage effectively. BrightSign, the provider of the most advanced, capable, and trusted digital media players and … Read More → "BrightSign Launches New AI Toolkits at InfoComm 2025 for More Customized, Captivating Digital Signage"

Innovative Startups Developing Next-Gen Cancer Treatments and Radiation-Shielding Material Selected Through MassChallenge Accelerator for Space-Based Research

Through the Technology in Space Prize, two startups were awarded more than $650,000 in total funding and the ability to leverage the ISS National Lab to advance their R&D
June 9, 2025

BOSTON (MA), June 9, 2025 – Startups RedPoint Oncology and Fourier are the newest recipients of the Technology in Space Prize, funded by Boeing and the Center for the Advancement of Science in Space® (CASIS®), manager of the International Space Station (ISS) National Laboratory. Selected through the Read More → "Innovative Startups Developing Next-Gen Cancer Treatments and Radiation-Shielding Material Selected Through MassChallenge Accelerator for Space-Based Research"

Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation

June 6, 2025

SUNNYVALE, Calif., June 5, 2025 – Plug and Play, the world’s largest innovation platform based in Silicon Valley, has announced a new collaboration with Synopsys, a global silicon-to-systems design solutions company. By collaborating with Plug and Play Semiconductors, Synopsys will provide selected startups with access to its design tools and software licenses.

By providing startups with access to professional-grade EDA tools, which often represent a significant investment at the early stage, Plug and Play and Synopsys aim to help lower the barrier to chip innovation, accelerate time to market, and reduce development costs across the chip design space.

< … Read More → "Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation"

New flagship Arbitrary Waveform Generators with 3.9 GHz bandwidth and 10 GS/s output rate

June 6, 2025

Spectrum Instrumentation announces four new high-performance Arbitrary Waveform Generators (AWGs), marking a significant milestone in the company’s product portfolio. Designed for demanding applications in radio frequency (RF) and microwave signal generation, the new AWGs deliver output rates up to 10 GS/s with exceptional 16-bit vertical resolution and bandwidths reaching up to 3.9 GHz. The new products are aimed at engineers and scientists working in cutting-edge fields such as wireless communications, radar system development, quantum research, and aerospace testing.

“This launch represents a major leap forward for us,” said Oliver Rovini, CTO of Spectrum Instrumentation. “It’s the … Read More → "New flagship Arbitrary Waveform Generators with 3.9 GHz bandwidth and 10 GS/s output rate"

Bourns Releases Two Compact NTC Thermistor Series Offering High-Precision Temperature Sensing and Compensation

The Bourns® BTN02G and BTN04G Series provide essential and highly accurate thermal management for today’s sophisticated and sensitive electronics applications
June 6, 2025

RIVERSIDE, Calif., June 5, 2025 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its BTN02G and Read More → "Bourns Releases Two Compact NTC Thermistor Series Offering High-Precision Temperature Sensing and Compensation"

Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes

First UCIe Die-to-Die IP Subsystem on TSMC’s 2nm Process with CoWoS® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects
June 6, 2025

Q.ANT Debuts First Interactive Live Demonstration and New Benchmarks for Analog Photonic Computing at ISC 2025

June 6, 2025

Stuttgart, Germany – June 4, 2025 – Q.ANT, today announced it will showcase live demonstrations of its photonic Native Processing Server (NPS) at ISC 2025, a leading global conference for high-performance computing (HPC). For the first time, attendees will be able to interact directly with functional photonic computing, witnessing how light can drive breakthroughs in energy and computational efficiency for AI, Physics Simulations, and other complex scientific workloads.

Built on Q.ANT’s Light Empowered Native Arithmetic’s (LENA) architecture, the … Read More → "Q.ANT Debuts First Interactive Live Demonstration and New Benchmarks for Analog Photonic Computing at ISC 2025"

Infineon collaborates with Typhoon HIL to accelerate development of xEV power electronic systems using real-time hardware-in-the-loop platform

June 6, 2025

Munich, Germany – 5 June 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working with Infineon’s AURIX™ TC3x/TC4x automotive microcontrollers (MCUs) can now use a complete HIL simulation and test solution using Typhoon’s HIL simulator for ultra-high fidelity motor drive, on-board charger, … Read More → "Infineon collaborates with Typhoon HIL to accelerate development of xEV power electronic systems using real-time hardware-in-the-loop platform"

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