TOKYO, Japan, June 10, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the Read More → "Renesas Brings USB-C Rev. 2.4 Support to New Ultra-Low-Power RA2L2 Microcontroller Group"
GRENOBLE, France – June 6, 2025 – The FAMES Pilot Line today announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU’s commitment to develop next-generation chips. The academy will be unveiled during Read More → "FAMES Pilot Line Launches FAMES Academy To Train Europe’s Chip Engineers with Skills to Leverage FD-SOI Technology and Design Circuits Using Advanced Setups"
Co-packaged optics (CPO) technology requires reliable laser sources, either integrated or external, for operation. Since integrated laser sources are associated with reliability challenges, researchers are increasingly exploring CPO systems with external sources. Recently, polymer waveguides fabricated on glass-epoxy substrates have emerged as a reliable solution for transmitting laser signals from external sources to photonic circuits. Researchers from Japan have now demonstrated the suitability of these waveguides for use in CPO systems.
Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology … Read More → "IEEE Study Describes Polymer Waveguides for Reliable, High-Capacity Optical Communication"
LEUVEN (Belgium), 5 June, 2025— This month, the Photonics Research Group
and IDlab, two imec research groups at Ghent University, and imec, a
world-leading research and innovation hub in nanoelectronics and digital
technologies, have published the demonstration of a fully-integrated
single-chip microwave photonics system, combining optical and microwave
signal processing on a single silicon chip. The chip integrates
high-speed modulators, optical filters, photodetectors, as well as
transfer-printed lasers, making it a compact, self-contained and
programmable solution for high-frequency signal processing. This
breakthrough can replace bulky and power-hungry components, enabling
faster wireless … Read More → "Imec and Ghent University present a fully-integrated, single-chip microwave photonics system for compact and versatile signal processing"
Santa Clara, CA and Kyoto Japan, June 04, 2025 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced they have developed AI-equipped MCUs (AI MCUs) – Read More → "ROHM Develops Breakthrough AI-Equipped MCU"
Palo Alto, CA – 4 June 2025. Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves. Sarcina’s pioneering work in photonic package design is enabling a new era of high data rate, high bandwidth and low power interconnects.
Traditional copper interconnects can no longer meet the performance, power and density demands of next generation data center systems. Copper interconnects become … Read More → "Sarcina Technology advances photonic package design to address key data center challenges"
STONY BROOK, NY, June 6, 2025 – A team of biomedical researchers led by Read More → "New Method of Biofabrication Could Advance Tissue Engineering, Bioprinting"
DRESDEN, Germany — June 9, 2025 — The SEMI Read More → "SEMI 3D & Systems Summit to Highlight Heterogeneous Integration as Key to Europe’s Semiconductor Resilience"
GRENOBLE, France – June 6, 2025 – A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry today announced the launch of the GENESIS project. This integrated, large-scale initiative aims to enable Europe’s chip industry to meet its sustainability goals—from materials development to final waste treatment.
Coordinated by CEA-Leti, the three-year project brings together Read More → "GENESIS Project Launches to Lead Europe’s Transition To Sustainable Semiconductor Manufacturing"
