News – Page 8 – EEJournal

IAR accelerates SDV development with Infineon DRIVECORE bundles and AURIX™ RISC-V Debug capabilities

March 4, 2026

Uppsala, Sweden — March 3, 2026 — IAR today announced expanded automotive ecosystem capabilities to be showcased at Embedded World 2026, highlighting its collaboration with Infineon Technologies AG across Infineon’s DRIVECORE software evaluation bundle portfolio and previewing upcoming debug capabilities for Infineon’s AURIX™ RISC-V family.

As software-defined vehicles (SDVs) accelerate innovation cycles across the automotive industry, development teams must deliver increasingly complex software across evolving architectures and long product lifecycles. IAR supports this shift through a scalable ecosystem approach that enables consistent workflows, faster onboarding, and cross-architecture continuity.

Strategic DRIVECORE Bundles: Start … Read More → "IAR accelerates SDV development with Infineon DRIVECORE bundles and AURIX™ RISC-V Debug capabilities"

Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification

March 3, 2026

Caspia’s flagship product, CODAx delivers new levels of security improvement, paving the way for agentic workflows.
The company is expanding its management team to support delivery of agentic security workflows.
Caspia will present its latest technology at DVCon on March 2-5, 2026.

GAINESVILLE, Fla., Feb. 24, 2026 // PRNewswire/

Caspia Technologies today announced broad availability of its … Read More → "Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification"

Infineon expands AURIX™ TC3x with 400 MHz option to add real-time compute headroom without a platform change

March 3, 2026

Munich, Germany – 3 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a 400 MHz performance class for its AURIX™ TC3x automotive microcontroller family. The new performance option addresses increasing software complexity and real-time processing demands in powertrain, chassis, and zone or domain control designs, allowing OEMs and Tier-1 suppliers to upgrade functionality without the need for a costly platform migration. By extending performance within the proven AURIX TC3x architecture, the 400 MHz devices enable faster deployment and lower integration risk while … Read More → "Infineon expands AURIX™ TC3x with 400 MHz option to add real-time compute headroom without a platform change"

ASRock Industrial Launches the iEPF-11000S Series to Push AI Workloads beyond Limits

March 3, 2026

Taipei, Taiwan (Mar 3, 2026) ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI applications. Powered by Intel® Xeon® 600 processors with W890 chipset, the iEPF-11000S Series delivers professional grade CPU performance, support for up to four graphic cards, PCIe Gen5 connectivity, and up to 2TB of RDIMM/RDIMM-3DS DDR5 memory with ECC protection for mission-critical edge processes. Designed for versatility, the iEPF-11000S Series features a comprehensive I/O with multiple expansion slots, high-speed networking including 10 GbE, and advanced storage capabilities. Built for professional computing environments, it … Read More → "ASRock Industrial Launches the iEPF-11000S Series to Push AI Workloads beyond Limits"

Innatera and Byte Lab Announce Strategic Solution Partnership to Accelerate Deployable Neuromorphic Edge AI Systems

Combining brain-like processing with production-ready electronics design to accelerate real-world deployments

March 3, 2026

DELFT, NETHERLANDS – March 3, 2026 – Read More → "Innatera and Byte Lab Announce Strategic Solution Partnership to Accelerate Deployable Neuromorphic Edge AI Systems"

Consortium to Build Quantum-Enabled ‘Brain-on-Chip’ Platform for Neurological Drug Discovery and Screening

Platform to detect earlier, human-relevant insights for the discovery and development of therapies for neurological diseases, including Alzheimer's, epilepsy, and schizophrenia

March 3, 2026

Melbourne, Australia – March 3, 2026 – Read More → "Consortium to Build Quantum-Enabled ‘Brain-on-Chip’ Platform for Neurological Drug Discovery and Screening"

Innoviz Technologies Expands Partnership with Dataspeed Inc. to Integrate InnovizSMART LiDAR to Drive-by-Wire Platforms

With an outstanding resolution, blockage resilience, range and reliability, Dataspeed is expected to integrate InnovizSMART LiDARs in autonomy projects across North America

March 3, 2026

Tel Aviv, ISRAEL – March 3, 2026 – Read More → "Innoviz Technologies Expands Partnership with Dataspeed Inc. to Integrate InnovizSMART LiDAR to Drive-by-Wire Platforms"

e‑peas to showcase a simplified path to powering the Ambient IoT at Embedded World: Booth #4A 301

Demonstrations will highlight benefits across consumer, logistics and transportation, and smart building applications while showcasing the industry’s first single-chip PMIC for hybrid indoor-outdoor photovoltaic systems

March 3, 2026

Louvain-la-Neuve, Belgium, 3rd March 2026 – e‑peas, a pioneer in ultra-low-power energy harvesting power management technologies, will showcase its range … Read More →

TDK to highlight innovative solutions shaping current and future power electronics technology at APEC 2026

March 3, 2026

TDK Showcases solutions for multiple applications including automotive, energy systems, solid-state transformers, optical solutions, data center, robotics and more

TDK will be at booth #1419, March 23-25, 2026, in San Antonio, TX

March 3, 2026

TDK Corporation (TSE:6762) announces its participation at the 2026 Applied Power Electronics Conference (APEC) highlighting solutions for a broad range of applications on March 23-25, 2026, at Henry B. Gonzalez Convention Center in San Antonio, Texas. TDK Corporation of America and TDK-Lambda Americas will be located at booth #1419.

Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 Eval Board at Embedded World 2026, Germany

Company will present compact, low-power system-on-module for FPGA/DSP-intensive applications, at Embedded World 2026 in Hall 1 Booth 1-500

March 3, 2026

Chesham, UK — March 03, 2026 — Read More → "Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 Eval Board at Embedded World 2026, Germany"