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Kwikset Announces New Wi-Fi Deadbolt Designed for the Hubspace Smart Home Platform

New Wi-Fi smart lock developed exclusively for Hubspace expands Kwikset’s connected residential security portfolio
January 9, 2026

LAKE FOREST, Calif. — Jan. 6, 2026 — Kwikset®, a trusted leader in residential security and a registered trademark of ASSA ABLOY Americas Residential Inc., an ASSA ABLOY Group Company, today announced the upcoming Kwikset® Wi-Fi Smart Lock, designed exclusively for The Home Depot’s Hubspace™ Smart Home Platform. The new Wi-Fi deadbolt further expands the company’s connected lock portfolio and breadth of seamless smart home ecosystem integration.</ … Read More → "Kwikset Announces New Wi-Fi Deadbolt Designed for the Hubspace Smart Home Platform"

Zeekr and Intellias Elevate Quality Assurance with AI, Presenting Superior EV Experience at CES 2026

Two companies showcasing an AI-driven innovation for automated visual testing of next-generation in-vehicle infotainment
January 8, 2026

(Chicago) January 6, 2026 – Intellias, a global partner for AI-enabled product engineering and digital solutions, and Zeekr Technology Europe, the European research and development center of Zeekr, a global premium electric mobility brand, will present an AI-powered innovation … Read More → "Zeekr and Intellias Elevate Quality Assurance with AI, Presenting Superior EV Experience at CES 2026"

TDK establishes TDK AIsight and announces new ultra-low power DSP platform for AI Glasses

January 8, 2026
  • TDK AIsight will focus on offering an eye-intent/tracking solution with TDK’s technologies for physical AI
  • TDK announces the TDK AIsight SED0112, a next-generation ultra-low power DSP platform integrating a microcontroller, state machine, and hardware CNN engine for AI Glasses
  • TDK AIsight solutions will be demonstrated at CES at the TDK booth #15803
Read More → "TDK establishes TDK AIsight and announces new ultra-low power DSP platform for AI Glasses"

TDK introduces 3-phase input 4500 W AC-DC power supplies capable of providing single or dual outputs

January 8, 2026

January 7, 2026

TDK Corporation (TSE:6762) introduces the TDK-Lambda TPS4500 single- or dual-output industrial power supplies with a 4500 W rating. The modules can be configured to share the loads in any proportion, up to the rated output specifications, and are designed to operate in series or in parallel to increase the output voltage or power.

Capable of operating from a high voltage three-phase input in a 360 – 528 Vac Delta or Wye configuration, the TPS4500 series can be used in multiple applications, including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, lasers, … Read More → "TDK introduces 3-phase input 4500 W AC-DC power supplies capable of providing single or dual outputs"

AMD Expands AI Leadership Across Client, Graphics, and Software with New Ryzen, Ryzen AI, and AMD ROCm Announcements at CES 2026

January 8, 2026

News Summary

  • AMD introduces new Ryzen AI 400 and PRO 400 Series processors, delivering up to 60 NPU TOPS for Copilot+ PCs and AI experiences across consumer and commercial systems.
  • AMD introduces new Ryzen AI Max+ SKUs, bringing high-performance AI and graphics to ultra-thin notebooks, workstations, and small form factors for creation, gaming, and AI development.
  • AMD unveils AMD Ryzen AI Halo, a powerful, easy-to-use mini-PC that brings Ryzen AI Max+ performance to AI developers with an out-of-the-box experience designed to accelerate AI innovation at the edge.
  • AMD announced the new … Read More → "AMD Expands AI Leadership Across Client, Graphics, and Software with New Ryzen, Ryzen AI, and AMD ROCm Announcements at CES 2026"

AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI

January 7, 2026

News Highlights

  • New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and an AMD XDNA™ 2 NPU for low-power AI acceleration
  • Delivers energy-efficient, low-latency AI on a single chip for immersive in-vehicle experiences, industrial automation and physical AI for autonomous systems
  • Launching today, the Ryzen AI Embedded P100 Series processors featuring 4-6 CPU cores, estimated 35% faster GPU performance1, and up to 50 AI TOPS2

SANTA CLARA, Calif., Jan. 05, 2026 (GLOBE NEWSWIRE) — Today, Read More → "AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and Physical AI"

Elektrobit unveils EB civion to fast-track SDV cockpit development

EB civion to take center stage at CES 2026 where Elektrobit will showcase the evolution of the automotive supply chain and accelerated cockpit development for SDVs through build-to-print designs and cloud-native technologies
January 7, 2026

LAS VEGAS, Jan. 6, 2026 /PRNewswire/ — CES 2026, Las Vegas Convention Center, West Hall, Booth #3719 — Elektrobit, the trusted partner in the transition to the software-defined … Read More → "Elektrobit unveils EB civion to fast-track SDV cockpit development"

New Ruggedized NI E320 Software Defined Radio is IP67 Weatherproof

January 7, 2026
Waterloo, Ontario — Jan 5, 2026 –    The E320 is the latest edition to the Pixus line of ruggedized Ettus/NI Software Defined Radios (SDRs).   The first in the E-series ruggedized enclosures is an IP67 weatherproof design.
The E320 is an IP67 rated outdoor solution in a compact size.    It features a conduction-cooled design from -10C to 60C temperature ranges, with extreme options from -40C to 70C upon request.   A full MIL ruggedized version or other customized configurations are also available.

Kudelski Labs Addresses Edge AI and Quantum-Era Security Threats at CES®

In its CES debut, Kudelski Labs, the innovation arm of the Kudelski Group, will showcase advances in embedded security from chip to cloud designed to help semiconductor manufacturers address new security challenges
January 7, 2026

CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA—January 5, 2026— Kudelski Labs, the innovation arm of the Kudelski Group, will be making its CES debut at Booth #52923 of the Venetian Expo, January 6-9, 2026. Showcasing advances in embedded security, from the silicon layer to the AI model and across the entire device lifecycle, demonstrations will focus on autonomous robotics, edge AI and real-time, in-field security provisioning.

As semiconductor and device manufacturers add local reasoning, autonomy, and advanced connectivity to new products, and with “harvest now, decrypt later” attacks already underway, security risks continue to escalate. Kudelski Labs, leveraging more than 30 years … Read More → "Kudelski Labs Addresses Edge AI and Quantum-Era Security Threats at CES®"

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