DENVER, CO – June 17, 2025 – Accuris, the market leader in engineering standards content and technology, today announced the addition of new regulatory content to its flagship platform. Read More → "Accuris Enhances Engineering Workbench with Regulatory Intelligence to Streamline Compliance for Engineers"
The PIANO product family from PULS, a technology and market leader in DIN-rail power supplies, has been designed for customers who need reliable, easy-to-use and cost-effective DIN rail power supplies. Read More → "PULS PIANO easy-to-use and cost-effective DIN-rail power supply range"
AMD is pleased to announce that the initial devices in the Spartan™ UltraScale+™ cost-optimized family are now in volume production! The three smallest devices, the SU10P, SU25P, and SU35P, are currently available for order with production device support in Read More → "AMD Spartan™ UltraScale+™ FPGAs Begin Production Shipments"
Siemens and Samsung grow their cooperation with new solutions for power integrity, silicon photonics innovation, and analog mixed-signal reliability verification
Siemens Digital Industries Software announced today a significant expansion of its collaboration with Samsung Foundry, including extending certification for many of Samsung’s most advanced process technologies across Siemens’ comprehensive Electronic Design Automation (EDA) portfolio.
These certifications encompass Samsung’s cutting-edge FinFET and MBCFET processes – including 14nm through 2nm nodes (SF2/SF2P) – enabling mutual customers to leverage Siemens’ Calibre® software, Solido™ software and Aprisa™ software with confidence when designing next-generation semiconductor devices for manufacture … Read More → "Siemens collaborates with Samsung Foundry on advanced node product certifications and EDA innovation"
SUNNYVALE, Calif., June 16, 2025 /Read More → "Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes"
Munich, Germany – 16 June 2025 – Electronic identification (eID) documents are seeing growing demand worldwide as governments push ahead with their digitalization efforts. To meet these rapidly evolving requirements more quickly and flexibly, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced two new solutions: SECORA™ ID V2 and the eID-OS. These solutions offer local security printers and card manufacturers greater flexibility in selecting the right solution for their specific project requirements, while helping to reduce development time and accelerate deployment.
“Our broad range of solutions is a clear commitment to our customers … Read More → "Infineon expands government ID portfolio with SECORA™ ID V2 and eID-OS for enhanced flexibility and faster time-to-market"
STGWA30IH160DF2 IGBT combines a breakdown-voltage rating of 1600V and high thermal performance with efficiency in soft-switching topologies and easy paralleling in high-power applications, including induction heaters and cookers, microwave ovens, and rice cookers.
With maximum junction temperature of 175°C and low thermal resistance ensuring efficient dissipation, the STGWA30IH160DF2 has a current rating of 30A and ensures long-term reliability in challenging environments.
Extending the STPOWER portfolio, this … Read More → "Advanced 1600V IGBTs for cost-sensitive, energy-conscious appliance markets"
AUSTIN, Texas, June 16, 2025 (GLOBE NEWSWIRE) — Quantic X-Microwave®, a business of Read More → "Quantic X-Microwave Launches Newly Enhanced Layout Tool for RF Designers"
SANTA CLARA, Calif. and GRENOBLE, France, June 16, 2025 – Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Through an expansion of their joint lab, the organizations plan to develop materials engineering solutions to address emerging infrastructure challenges in AI data centers.
The joint lab is focused on … Read More → "Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips"
