EEJournal

industry news archive
Subscribe Now

Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement

Strategic supply agreement positions GLOBALFOUNDRIES to meet the growing demand for its most advanced RF-SOI solution, 8SW, used by top FEM providers to 5G sub-6 GHz smartphones
November 5, 2020

Santa Clara, Calif., and Bernin (Grenoble), France, November 5, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and Soitec, a world leader in designing and manufacturing innovative semiconductor materials, today announced a multi-year supply agreement for 300mm radio frequency silicon-on-insulator (RF-SOI) wafers. Building on the long partnership between the two companies, this strategic agreement secures the supply of wafers that will allow GF to further expand its critical role in providing solutions for the next-generation mobile phone market. The agreement was finalized earlier this week in a virtual signing ceremony with leadership from both companies.

Read More → "Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement"

STMicroelectronics Unveils World’s Fastest 50W Qi Wireless-Charging IC

November 5, 2020

Geneva, November 5, 2020 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the world’s fastest Qi wireless charging IC, STWLC88. Delivering as much as 50W of power, the new device enables consumers to charge smartphones, tablets, laptops, and other Read More → "STMicroelectronics Unveils World’s Fastest 50W Qi Wireless-Charging IC"

NXP Announces Low-cost, Low-power, MCU-based Face Recognition Solution with Liveness Detection for Touchless Access Control

November 5, 2020

EINDHOVEN, The Netherlands, Nov. 5, 2020 – NXP Semiconductors N.V. (NASDAQ:NXPI) today announced its latest NXP EdgeReady IoT solution for secure face recognition that enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add vision-based touchless access control. NXP’s turnkey solution includes the i.MX RT106F crossover microcontroller (MCU) and license to AI/ML-based face recognition software, which makes possible face recognition with liveness checking using infrared and RGB cameras, flash and SDRAM memories at a total cost lower than $10 (USD).

This solution can be used to implement face recognition for authenticating and operating secure … Read More → "NXP Announces Low-cost, Low-power, MCU-based Face Recognition Solution with Liveness Detection for Touchless Access Control"

Keysight First to be Approved by Global Certification Forum for 5G Universal Subscriber Identity Module Application Toolkit Test Cases

Early access to validated 5G protocol test cases on common hardware and software platforms speeds validation of multi-mode devices
November 5, 2020

SANTA ROSA, Calif., November 5, 2020

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that the company was first to be approved by the Global Certification Forum (GCF) for 5G universal subscriber identity module (USIM) application toolkit (USAT) test cases.

Keysight received the approval at the conformance agreement group (CAG) #64 meeting led by the Global Certification Forum (GCF) using Keysight’s S8704A Read More → "Keysight First to be Approved by Global Certification Forum for 5G Universal Subscriber Identity Module Application Toolkit Test Cases"

Toshiba’s Announces New Dual-Channel H-bridge Motor Driver IC with PWM Control

Meeting the modern requirements of mains-, 5V USB- and battery-powered equipment
November 5, 2020

Düsseldorf, Germany, 4th November 2020 – Toshiba Electronics Europe GmbH (“Toshiba”) has further expanded its portfolio of driver solutions for brushed DC and stepper motors with the introduction of the TC78H660FNG. This H-bridge motor driver IC, which is based on the company’s latest generation DMOS process, can deliver a PWM-controlled current of 2A (maximum). Running off a 2.5V to 16V input supply voltage, it can drive two brushed DC motors or a single stepper motor.

The on-resistance of this driver at typical operating conditions is just 0.48Ω. This is highly advantageous from a thermal management perspective, … Read More → "Toshiba’s Announces New Dual-Channel H-bridge Motor Driver IC with PWM Control"

55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices

With more than 3 billion units shipped, GF’s 55 BCDLite solution is featured in five of seven of today’s leading top-tier premium smartphones
November 4, 2020

Singapore, November 4, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced at its Global Technology Conference (GTC) Asia event that it has shipped more than 3 billion units of its 55 BCDLite® specialized semiconductor solution, which is found in five of the seven leading top-tier smartphones currently on the market.

Built on GF’s proven 55nm platform, the 55 BCDLite specialty solution is optimized to provide superior audio amplifier performance for mobile audio applications across a range of voltages, from 0.9V to 30V. With its finely tuned combination of low-power logic, best-in-class low drain-source on resistance, … Read More → "55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices"

LoadSlammer Brings Standardized Testing Methodology to Power Stamp DC-DC Direct Power Conversion

November 4, 2020

[November 4, 2020] – The Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced that LoadSlammer, designers and manufacturers of transient load testing devices, has joined the Alliance to bring the option for a consistent, standardized testing methodology to users of power stamps.

This is the first time that a multi-vendor alliance around dc-dc power conversion has agreed a testing methodology and tools. Design engineers will be able to use a common, consistent, and repeatable load to significantly reduce validation and integration time, speeding their end-product to market and reducing risk in … Read More → "LoadSlammer Brings Standardized Testing Methodology to Power Stamp DC-DC Direct Power Conversion"

High capacity switching for next-gen automotive technology

With the new 60A-rated TT series, Panasonic Industry meets the increasing demand for PCB-based miniaturized relays in the context of modern automotive applications
November 4, 2020

MUNICH, NOVEMBER 2020

When it comes to switching solutions, contemporary automotive application design resorts more and more to PCB mounted products. The primacy of miniaturization and efficiency without compromises in terms of reliability and performance render THT or PiP mounted relays a perfect solution for multiple high current loads.

The high capacity TT series – supporting 60A @14VDC with a double make 2 Form A (1 Form U) contact configuration – is tailored to smart junction boxes that come to use in applications throughout the vehicle.

“Those state-of-the-art junction boxes”, as Michael Immle from Panasonic Industry Europe summarizes, “ … Read More → "High capacity switching for next-gen automotive technology"

featured blogs
Sci-Fi and Fantasy Books They Should Make into Movies
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...
More from Max's Cool Beans...