Plano, Texas – December 17, 2020 – Diodes Incorporated (Nasdaq: DIOD) has announced a family of automotive-compliant, two-wire unipolar (AH323xQ/4xQ) and latch Read More → "Automotive-Compliant, Two-Wire Hall Effect Switches with Self-Diagnostics from Diodes Incorporated Deliver High Sensitivity and Stable Performance"
GRENOBLE, France – Dec. 17, 2020 – CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The projects were designed to look at different ways to leverage 3D’s strengths in lowering device energy consumption as well as energy lost during data transfer.
“Today, storage-class memories like high-density 3D crossbar RRAM are promising for applications requiring a large amount of on-chip memory,” explained the paper 3D RRAMs with Gate-All-Around (GAA) Stacked Nanosheet Transistors for In-Memory-Computing. “ … Read More → "CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM"
December 17, 2020 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, has created a new resource site dedicated to the LoRaWAN® standard and its capabilities, applications, … Read More → "Mouser Electronics Presents New Resource Site Dedicated to LoRaWAN Technology"
SANTA ROSA, Calif., December 17, 2020
Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that ArrayComm will use the company’s end-to-end portfolio of test solutions to speed development of network equipment based on the O-RAN standard.
CAMARILLO, Calif., Dec. 15th, 2020 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced that they have teamed up with Amazon Web Services (AWS) to integrate the LoRaWAN® protocol on the Network Server with AWS IoT Core, AWS’s managed Cloud service that lets connected devices easily and securely interact with Cloud applications and other devices.
Read More → "Semtech and AWS Collaborate on AWS IoT Core for LoRaWAN®"
Henderson, NV – December 15, 2020 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VT085/Read More → "VadaTech Announces a new Advanced Secure Keyboard, Video and Mouse (KVM) Transmitter"
5G – the current framework for mobile communication reality means nothing less than an entirely new dimension in capacity, speed and simultaneity of daily data communication – especially within the defined frequency range 2 (FR2) using the millimeter-wave spectrum (28 GHz band). This is boosting the necessity for device technology being able to reliably handle a corresponding extent of data transmission.
To ensure devices like smartphones, routers and many others meeting those data transmission stability requirements, Panasonic Industry now offers a specific … Read More → "Plug-in 5G data stability"
Bel Power Solutions today announced the BCL25-700-8, a 22/25 kW bi-directional liquid-cooled on-board inverter battery charger with export functionalities for hybrid (HEV) or full electric (EV) vehicles, as well as medium and heavy-duty on- and off-highway vehicles. The BCL25-700-8 is parallelable up to 4 units in charge mode, with typical efficiency up to 94%.
With the BCL25-700-8, it is possible … Read More → "Bel Power Solutions Announces BCL25-700-8 22/25 kW Liquid-Cooled On-Board Inverter Battery Charger"
SAN JOSE, Calif., December 16, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius™ Thermal Solver and Clarity™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more information, visit Read More → "Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs"
Andover, Massachusetts- December 16, 2020
ACEINNA (https://www.aceinna.com) today announced the general market availability of ACEINNA OpenRTK330LI EVK, a complete evaluation and development kit for the OpenRTK330LI GNSS/INS module. The OpenRTK330LI … Read More → "ACEINNA Launches OpenRTK330LI EVK – Development Kit for the Industry’s Most Compact RTK INS Solution with an Embedded Precision IMU"
