June 2025: GNSS RTK 4 Click is a compact add-on board from MIKROE – the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards. Targeting high-precision … Read More → "Achieve sub-metre positioning accuracy with GNSS RTK 4 Click board from MIKROE"
Taipei, Taiwan (June 24, 2025) – ASRock Industrial proudly presents its latest lineup of edge AI server boards – IMB-XA1901, IMB-X1902, and IMB-X1900 series designed to empower next-generation industrial, edge AI, and high-performance computing with robust power, reliable scalability, and AI-optimized architecture with Intel® AMX. Supporting Intel® Xeon® 6 and Xeon® W processors, these motherboards deliver exceptional performance with up to 86 cores, high-speed DDR5 memory, extensive PCIe Gen5 expansions for up to four graphic cards, and IPMI remote management. Whether deployed in demanding AI workloads, smart manufacturing, or edge server environments, these motherboards provide the computing power and industrial reliability required to … Read More → "ASRock Industrial Introduces Edge AI Server Boards Powered by Intel® Xeon® Processors"
Semiconductor nanolasers are emerging as key components for next-generation optical systems requiring ultra-low power and compact design. Traditional lasers face limitations at the nanoscale, prompting researchers to explore innovative nanolaser architectures. A recent study outlines breakthroughs in photonic crystal nanolasers, deep subwavelength cavities, and Fano lasers. These technologies enable enhanced light confinement and energy efficiency, making them ideal for applications in on-chip communication, neuromorphic computing, and hybrid optical-electronic systems.
A new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as … Read More → "IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies"
SYDNEY and IRVINE, Calif., June 25, 2025 – Morse Micro, the world’s leading provider of Wi-Fi HaLow chips, today announced that its MM6108-EKH05–Light developer platform has received Matter certification from the Read More → "Morse Micro Wi-Fi HaLow Technology Receives Matter Certification"
CANBERRA, Australia, June 25, 2025 – Liquid Instruments, a leader in software-defined instrumentation, today announced the introduction of Generative Instrumentation, a revolutionary approach to test and measurement. Generative Instrumentation enables engineers to create custom instruments and configure complex systems to fit their exact needs using AI and natural language prompts.
This represents a significant leap beyond traditional instrument design, vastly improving users’ productivity and ability to customize and optimize their test setup. Agentic AI opens up the capability to adapt to specialized applications, automate complex test scenarios, and respond to dynamically changing requirements.
Read More → "Liquid Instruments Announces Industry-First Generative Instrumentation, Bringing Agentic AI to Test and Measurement"
June 25, 2025
TDK Corporation (TSE:6762) has expanded its MEMS inertial sensors portfolio with the Tronics AXO315®T0, a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling (MWD) applications in the energy market.
Leveraging TDK’s unique closed-loop architecture that provides an unprecedented level of vibration rectification and resistance to operational shocks, AXO315T0 exhibits a bias residual error of 0.8 mg over its operating temperature range of -30 °C to +150 °C, enabling a precise and continuous inclination measurement for directional drilling tools exposed to high … Read More → "TDK launches a high-temperature, closed-loop MEMS accelerometer for energy market applications"
| June 24, 2025 – Uppsala, Sweden – IAR, a global leader in software solutions for embedded systems, has released new versions of its development toolchains. The IAR toolchains for Renesas RX version 5.20 and RL78 version 5.20, expand the support for these strategic architectures within the IAR’s industry-leading embedded development platform. These updates bring modern development capabilities, including CI/CD integration, cross-platform compatibility for developers working with Renesas-based microcontrollers (MCUs) for industrial, automotive, and consumer applications.
IAR has been partnering with Renesas Electronics since the 1980s. As a long-standing Renesas Alliance Partner, … Read More → "IAR platform upscales embedded software development workflows for Renesas MCU architectures" |
June 24, 2025
TDK Corporation (TSE:6762) announces a suite of InvenSense sensing solutions for intelligent smart home applications that require precise detection of presence, proximity, sound, tilt, liquid levels, acceleration, or motion. TDK’s ultra-low … Read More → "TDK announces suite of sensing solutions for smart home applications"
Munich, Germany – June 24, 2025 – Red Pitaya, a multi-award-winning leader in providing compact, open-source, high-speed signal acquisition and processing boards and services, has announced a new board co-developed with Texas Instruments, a global semiconductor company known for its precision analog and embedded processing … Read More → "Red Pitaya & Texas Instruments team up to launch next-gen STEMlab boards for high-performance data acquisition"
Santa Clara, California, June 24, 2025 – xMEMS Labs, Inc., inventor of the world’s first monolithic silicon MEMS air pump, today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into XR smart glasses, providing the industry’s first in-frame active cooling solution for AI-powered wearable displays.
As smart glasses rapidly evolve to integrate AI processors, advanced cameras, sensors, and high-resolution AR displays, thermal management has become a major design constraint. Total device power (TDP) is increasing from today’s 0.5–1W levels to 2W and beyond, driving significant heat into the frame materials that rest directly on the skin. … Read More → "xMEMS Announces µCooling Fan-on-a-Chip Solution for XR Smart Glasses – Delivering First In-Frame Active Thermal Management for AI-Driven Wearables"
