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Transparency and object identity: Infineon and DIGISEQ develop secured physical asset verification to provide end-to-end brand protection

Munich, Germany – 1. February 2021 – In a joint project, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and DIGISEQ, an IoT platform provider with end-to-end service, utilize SECORA™ Blockchain NFC technology to deliver secured identity data. This advanced solution connects the digital data recorded on blockchain to the physical item, allowing for comprehensive verification of the identity of items – eliminating the challenge of product substitution and heightening supply chain transparency.

“DIGISEQ is the ideal partner to develop an end-to-end brand protection solution based on Infineon’s SECORA … Read More → "Transparency and object identity: Infineon and DIGISEQ develop secured physical asset verification to provide end-to-end brand protection"

NXP and LivingPackets Transform E-Commerce with Reusable Smart Packaging for More Eco-Friendly Online Shopping

What’s New: NXP and LivingPackets have joined forces on THE BOX, LivingPackets’ new, intelligent shipping parcel that reinvents smart packaging via an extremely durable, connected and sustainable way to ship packages. THE BOX represents a successful implementation of NXP’s trusted edge and connectivity technologies that enable more efficient e-commerce operations with greater traceability for more convenient consumer experiences while reducing the impact on society.

Why it Matters:
The “Internet of Boxes” has arrived
NXP is committed to help e-commerce companies advance their operations and become more eco-friendly with the “Internet of Boxes”. Retailers … Read More → "NXP and LivingPackets Transform E-Commerce with Reusable Smart Packaging for More Eco-Friendly Online Shopping"

ADLINK Launches the DLAP x86 Series, a Deep Learning Acceleration Platform for Smarter AI Inferencing at the Edge

Summary:
• ADLINK’s DLAP x86 series is the most compact GPU-enabled deep learning acceleration platforms available, powering AI applications in industrial, manufacturing, and healthcare environments
• Designed to accelerate compute-intensive AI inferencing and learning tasks, the DLAP x86 series optimizes SWaP and AI performance at the edge, offering high performance per watt and per dollar
• Features a heterogeneous architecture combining high-performance CPU and GPU computing in a compact size, optimized with a thermal-efficient design for compute-heavy edge AI applications

Taipei, Taiwan – February 2, 2021

ADLINK Technology Inc., a global leader in edge computing has launched … Read More → "ADLINK Launches the DLAP x86 Series, a Deep Learning Acceleration Platform for Smarter AI Inferencing at the Edge"

Cost-Effective 6 W and 10 W Isolated Dc-Dc Converters with 4:1 Input Range

TUALATIN, Ore. — February 2, 2021

CUI Inc, a Bel Group, today announced the addition of two new EN 62368-1 certified, compact, regulated converter series to its compact isolated dc-dc converters line. The PQQ6W-S and the PQQ10W-S both offer cost-effective solutions for a wide range of applications, including IoT, consumer, industrial and telecom, and data communications.

The PQQ6W-S provides up to 6 W of continuous power with up to 87% efficiency and 1,600 Vdc isolation, whilst the PQQ10W-S offers up to 10 W isolated output with up to 88% efficiency and 1,500 Vdc isolation. Both units are supplied in space … Read More → "Cost-Effective 6 W and 10 W Isolated Dc-Dc Converters with 4:1 Input Range"

D3 Engineering Collaborates with Microsoft to Deploy Time of Flight Imaging Technology in Industrial Applications

Rochester, NY – December 29, 2021 – D3 Engineering announced its collaboration with Microsoft’s Azure Depth Platform program, setup to provide access to Microsoft’s 3D Time of Flight imaging technology to a 3rd party ecosystem. This technology, developed for use in Hololens and Kinect, will allow D3 Engineering to create embedded spatial sensing systems, and deliver customized depth camera modules for camera makers and other OEMs. Further, by integrating with Microsoft’s Azure cloud-based learning and algorithm solutions, the technology can be leveraged to exponentially increase effectiveness.

“Microsoft’s advanced Time of Flight technology is … Read More → "D3 Engineering Collaborates with Microsoft to Deploy Time of Flight Imaging Technology in Industrial Applications"

iSYSTEM and Vector Introduce Free Bundle for Timing Analysis in AUTOSAR Systems

Schwabhausen and Stuttgart, Germany, February 1, 2021 – iSYSTEM, Schwabhausen near Munich, and Vector Informatik, the Stuttgart-based specialist for software and automotive electronics, are now offering a free software bundle for automating timing analysis. With the Vector-iSYSTEM Timing Bundle, AUTOSAR ECU developers can record, analyze, and evaluate the timing behavior of an embedded system in less than seven minutes. The free package includes scripts, header files as well as samples and is compatible with the Vector AUTOSAR Classic base software MICROSAR.

To prove functional safety in complex embedded software applications such as in the ECUs of state-of-the-art vehicles, in-depth analysis … Read More → "iSYSTEM and Vector Introduce Free Bundle for Timing Analysis in AUTOSAR Systems"

IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust

LONDON, February 1st, 2021 – Crypto Quantique, a specialist in quantum-driven cybersecurity for the internet of things (IoT), is to make its universal IoT security platform, QuarkLink, available to semiconductor manufacturers and systems integrators that use root-of-trust (RoT) solutions of their own, or those sourced from other vendors. The platform was originally designed to work with Crypto Quantique’s own quantum-derived root-of-trust IP, called QDID.
The QuarkLink platform’s capabilities are far more comprehensive than typical key management services. QuarkLink handles provisioning, including secure firmware and cryptographic keys, automated secure onboarding, and security monitoring, including firmware encryption, … Read More → "IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust"

EIZO Releases Rugged XMC Graphics/GPGPU Card with Field Programmable Configuration of Analog and Digital Outputs

  • EIZO’s Condor NVP2009AxX supports four field customizable video output combinations of DisplayPort++, 3G-SDI, CVBS, and VGA to provide flexibility and simplify inventory management for high-end surveillance and mission computing.
  • The NVIDIA Quadro P2000 (chip down GP107) design features single-ended or differential signaling, H.265/H.264 hardware encode/decode capability, comes in conduction-cooled and air-cooled variants, and delivers up to 2.3 TFLOPS of processing power.

Altamonte Springs, Florida, February 1, 2021 – EIZO Rugged Solutions Inc., a provider of ruggedized graphics and video products, has released the Condor NVP2009AxX – an … Read More → "EIZO Releases Rugged XMC Graphics/GPGPU Card with Field Programmable Configuration of Analog and Digital Outputs"

SiTime Expands Consumer and IoT Portfolio with Low Power TCXO

SANTA CLARA, Calif., February 1, 2021 – SiTime Corporation (NASDAQ: SITM), a market leader in MEMS timing, today announced the SiT5008 temperature-compensated silicon MEMS oscillator (TCXO). The SiT5008 is ideal for connected consumer and IoT devices such as Internet-connected audio-video, over-the-top streaming devices, industrial smart meters, and other devices that use low power wireless connectivity. Like other SiTime offerings, the SiT5008 offers programmable features, high reliability, and environmental resilience in a small package.

“The development of our SiT5008 is a great example of our rapid release strategy, where we develop up to 15 product derivatives from a … Read More → "SiTime Expands Consumer and IoT Portfolio with Low Power TCXO"

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