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New Seal Type Sliding Switches from Panasonic Industry enhance reliability and efficiency

Double the functionality, half the footprint with three types to choose from: Failure Detection Type, Two-Step Detection Type, Redundancy Type
June 30, 2025

Munich, 30th June 2025

Panasonic Industry has recently introduced the ASQD1 series of Seal Type Sliding Switches, a new state-of-the-art line of micro switches designed for enhanced reliability and efficiency across various applications. The durable ASQD1 series components benefit from dual internal circuits, allowing for failure detection, redundant circuit design, and two-step detection due to its flexible circuit setup. The design optimizes space and reduces the need for multiple switches, streamlining assembly, and terminal connections.

The new product range features three different setups:

Wise Integration Launches First Digital Controller, WiseWare® 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz

With WiseWare® 1.1, GaN-Based Designs Achieve Compact Size and Peak Efficiency
June 27, 2025

Hyeres, France – June 26, 2025 – Wise Integration, a pioneer in digital control for gallium nitride (GaN) and GaN IC-based power supplies, today announced the release to production of its first fully digital controller, WiseWare 1.1 (WIW1101) based on the MCU 32 bits. This milestone innovation enables high-frequency operation up to 2 MHz, unlocking new levels of power density, efficiency, and form factor in compact AC-DC power converters.

The product is now available and ready for volume production in customer-validated designs.

“This release marks a strategic milestone for Wise Integration’s roadmap,” said Thierry Bouchet, … Read More → "Wise Integration Launches First Digital Controller, WiseWare® 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz"

Silicon Motion’s UFS Solution Completes Compatibility Validation with Qualcomm® Snapdragon® Cockpit SA8295P Platform

June 27, 2025

TAIPEI and MILPITAS, Calif., June 26, 2025 /PRNewswire/ — Silicon Motion Technology  Corporation (NasdaqGS: SIMO) (“Silicon Motion”), a global leader in the design and  marketing of NAND flash controllers for solid-state storage devices, is pleased to announce  that its Universal Flash Storage (UFS) solution has successfully completed compatibility  validation on Qualcomm® Snapdragon® Cockpit SA8295P Platform. This achievement  enables automotive customers to confidently adopt Silicon Motion’s UFS solution with the  Snapdragon™ Cockpit SA8295P designs. 

Silicon Motion enables superior performance and multitasking support, with high reliability  on the Qualcomm® Snapdragon® Cockpit SA8295 … Read More → "Silicon Motion’s UFS Solution Completes Compatibility Validation with Qualcomm® Snapdragon® Cockpit SA8295P Platform"

TDK offers MLCCs with the industry’s highest capacitance at 100 V for commercial applications in the 1608 case size

June 27, 2025
  • New 100-V product for commercial applications with 1 μF capacitance in 1608 case size (achieving large capacitance)
  • Contributes to the reduction of component count and the miniaturization of sets

June 26, 2025

TDK Corporation (TSE: 6762) has expanded its C series for commercial multilayer ceramic capacitors (MLCCs) to 1 µF at 100 V in the 1608 size (1.6 x 0.8 x 0.8 mm – L x W x H), with X7R characteristics. This is the industry’s highest capacitance* for a 100-V-rated product in this size and this temperature characteristic. Mass production of the product series began in June 2025.

In … Read More → "TDK offers MLCCs with the industry’s highest capacitance at 100 V for commercial applications in the 1608 case size"

PX5 Announces Functional Safety Certification of the PX5 FILE Embedded FAT File System

PX5 FILE is the first deeply embedded file presenting a native Linux file system API to be certified by SGS-TÜV Saar to the highest levels of the IEC 61508, IEC 62304, ISO 26262, and EN 50128 functional safety standards; offers developers a faster path to certification, reduces product liability with improved quality and time to market
June 26, 2025

SAN DIEGO—June 25, 2025—PX5, a global leader in high-performance real-time operating systems and middleware, today announced off-the-shelf functional safety certification of the PX5 FILE. Developers can now leverage the SGS-TÜV Saar certification of this embedded file allocation table (FAT) file system in conjunction with their application software certification to more quickly and cost effectively build a reliable safety-certified device for the automotive, industrial and medical industries.

For developers of both safety-critical and non-safety-critical devices, the ultra-small certified file system offers a … Read More → "PX5 Announces Functional Safety Certification of the PX5 FILE Embedded FAT File System"

Earth Systems Launches New Remote Sensing and AI Solutions Service

New service from Earth Systems will provide advanced geospatial intelligence through the fusion of satellite imagery and AI.
June 26, 2025

West Palm Beach, FL, June 26, 2025 (GLOBE NEWSWIRE) — Earth Systems (West Palm Beach, FL) announced today the launch of its Remote Sensing and AI Solutions service. The service will specialize in delivering advanced geospatial intelligence through the integration of satellite and aerial remote sensing and artificial intelligence.

Earth Systems will use satellite imagery from a variety of sensors and spatial resolutions to analyze large geographic areas and monitor changes over time, enabling the team to conduct broad-scale assessments and high-frequency temporal analyses, tailored to clients’ specific needs.

In addition to high-resolution imagery, Earth Systems now will … Read More → "Earth Systems Launches New Remote Sensing and AI Solutions Service"

Sensors Converge 2025: Bosch boosts ecosystem around BMV080 particulate matter sensor

Plug-and-play platforms simplify and accelerate development with Bosch environmental sensors
June 26, 2025
  • Ecosystem shortens time-to-market and reduces complexity
  • Developer platforms offer documented tools, hardware, and support
  • Bosch at Sensors Converge: booth 530, Convention Center, Santa Clara, CA

In today’s fast-paced development landscape, having the right tools can mean the difference between months of delay and a rapid product launch. At Sensors Converge 2025, Bosch Sensortec is spotlighting the rapid evolution of its developer ecosystem, as new tools and platforms launch to support the integration of the BMV080 — the world’s smallest particulate matter sensor.

Visitors to … Read More → "Sensors Converge 2025: Bosch boosts ecosystem around BMV080 particulate matter sensor"

Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs

June 26, 2025
  • New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity
  • Calibre 3DStress delivers early analysis/simulation of chip/package interactions at all stages of the design process

Siemens Digital Industries Software today introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges associated with the design and manufacture of 2.5D and 3D Integrated Circuit (IC) designs.

Siemens’ new Innovator3D IC™ solution suite enables IC designers to efficiently author, simulate and manage heterogeneously … Read More → "Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs"

EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe’s 1st Commercial Supplier of LNOI Wafers

Capacity to Deliver Millions of TFLN Chips Annually ‘Firmly Positions Europe as a Global Leader in Photonic Chip Manufacturing’
June 26, 2025

June 23, 2025 – A recently concluded 42-month EU project, ELENA, announced today the development of the first-ever, European-made lithium niobate on insulator (LNOI) substrates for photonic integrated circuits (PICs)—a breakthrough that establishes a fully European supply chain for thin-film lithium niobate (TFLN) technology.

TFLN is a breakthrough material platform enabling high-performance PICs through its thin-film structure, offering unique electro-optic, nonlinear optical, and acousto-optic properties. … Read More → "EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe’s 1st Commercial Supplier of LNOI Wafers"

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