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Thin film chip resistors available from RS Components deliver elevated reliability in challenging operating environments

Automotive-qualified components from KOA set new benchmarks for precision, stability and longevity
February 23, 2021

LONDON, UK, 23 February 2021 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel solutions partner for industrial customers and suppliers, has added new ultra-high precision chip resistors to its extensive passive portfolio. Optimised for industrial and automotive applications as well as for use in test instrumentation and audio equipment, the thin film element of KOA’s RN73R series exhibits a temperature coefficient of resistance that ranges from ±5ppm to ±100ppm. The new series has a far greater electrolytic corrosion resistance than its predecessor – the RN73 series – which ensures a more reliable device, especially in … Read More → "Thin film chip resistors available from RS Components deliver elevated reliability in challenging operating environments"

OKdo and Qualcomm give makers and developers easy access to Amazon Voice Services

Home Hub 100 Development Kit comes with support for voice controlled IoT applications
February 23, 2021

London, UK, 23 February 2021 – OKdo, the global technology company from Electrocomponents plc, is pleased to announce it is now supplying the Qualcomm® Home Hub 100 Development Kit for Amazon Voice Services (AVS).

Based on Qualcomm’s highly integrated, multi-mode System-on-Chip (SoC), the QCA4020, the Home Hub 100 kit is provided with pre-integrated software support for AVS, to help kickstart the development of voice-controlled IoT applications.

Voice control is rapidly becoming the preferred user interface for consumer IoT devices, such as smart light switches and sockets, as well as controlling appliances and heating systems. With built-in software support for … Read More → "OKdo and Qualcomm give makers and developers easy access to Amazon Voice Services"

ams partners with ArcSoft to demonstrate complete solution for world-facing 3D dToF sensing in mobile devices

February 23, 2021

 

  • ams dToF technology for world-facing mobile aims to achieve higher range and lower power consumption than other implementations
  • The option to integrate ArcSoft imaging software enables new applications including more immersive augmented reality capabilities
  • To minimize integration effort for mobile device OEMs, the resulting 3D dToF system provides a complete technology stack – from optical sensing through to scene reconstruction and integration with RGB camera
  • The ams 3D dToF sensing solution will be ready for mass production by the end of 2021

Premstaetten, Austria (February 23, 2021) — ams ( … Read More → "ams partners with ArcSoft to demonstrate complete solution for world-facing 3D dToF sensing in mobile devices"

Matthew Ballance to Receive Accellera Systems Initiative Technical Excellence Award

Siemens’ Ballance will be honored during virtual DVCon U.S. 2021 for his contributions to the development of the Portable Test and Stimulus Standard
February 23, 2021

Elk Grove, Calif., February 23, 2021 — Accellera Systems Initiative (Accellera) announced today that Matthew Ballance, a member of the Portable Stimulus Working Group and a Product Engineer and Portable Stimulus Technologist with Siemens Digital Industries Software, is the recipient of the 2021 Accellera Technical Excellence Award. The award was established to recognize the outstanding achievements of an individual among Accellera’s working group members and their significant contributions to the development of its standards.

Ballance, one of the earliest and most frequent contributors to the Portable Test and Stimulus standard (PSS), will be presented with the … Read More → "Matthew Ballance to Receive Accellera Systems Initiative Technical Excellence Award"

STMicroelectronics Boosts Security Along with AI and IoT Application Development with STM32MP1 Ecosystem Extensions

February 23, 2021

Geneva, February 23, 2021 – STMicroelectronics has announced extensions to the broad ecosystem that supports development with STM32MP1* dual-core microprocessors, including new software packages and support for cutting-edge open-source security initiatives.

By providing code for security mechanisms such as OP-TEE (Open Portable Trusted … Read More → "STMicroelectronics Boosts Security Along with AI and IoT Application Development with STM32MP1 Ecosystem Extensions"

Microchip Announces Space-Qualified COTS-Based Radiation-Hardened Power Converters

Expansion of SA50-120 family introduces qualified 100V and 120V bus systems for space applications
February 23, 2021

CHANDLER, Ariz., February 23, 2021 – As reliance on communication and weather satellites grows and space research expands in scope and mission, new technology is required to help speed spaceflight system design and production. Microchip Technology Inc. (Nasdaq: MCHP) today announced the expansion of its SA50-120 power converter family with nine new units based on its Commercial Off-the-Shelf (COTS) technology. This technology provides developers with space-qualified power converters that help to minimize risk and lower development costs.

Microchip’s Read More → "Microchip Announces Space-Qualified COTS-Based Radiation-Hardened Power Converters"

Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package

Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC applications
February 23, 2021

Nijmegen, February 23 2021: Nexperia, the expert in essential semiconductors, today announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The new package provides a half-bridge solution in one device, occupying 30% lower PCB … Read More → "Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package"

Scalable IoT Security Enabled by EPS Global and Crypto Quantique Strategic Partnership

February 23, 2021
DUBLIN & LONDON, Feb 22nd, 2021 — EPS Global, a world-leading provider of IC programming and secure provisioning services, and Crypto Quantique, a specialist in quantum-driven cybersecurity for the internet of things (IoT), today announced a strategic partnership which will enable their joint customers to deploy secure IoT applications at scale.
EPS Global provides secure provisioning services from its global network of secure programming centers, and through its ecosystem partners delivers a complete end-to-end security solution for customers’ connected devices. Crypto Quantique has created QDID, the world’s first proven quantum-driven secure hardware IP for standard silicon … Read More → "Scalable IoT Security Enabled by EPS Global and Crypto Quantique Strategic Partnership"

Vishay Intertechnology Increases Resistance Ratios and Operating Voltages for ACAS AT Precision Thin Film Chip Resistor Arrays

Automotive Grade Devices Increase Design Capability in Voltage Divider and Signal Amplification Applications
February 23, 2021

MALVERN, Pa. — Feb. 22, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision Automotive Grade thin film chip resistor arrays with higher resistance ratios up to 1:100 and operating voltages up to 100 V. The Vishay Beyschlag devices provide designers with greater flexibility by allowing them to use a broader range of input voltages in voltage divider applications or to achieve a five-fold amplification factor increase compared to previous-generation devices.

Offering respectively two and four integrated resistors on one substrate, the Vishay Beyschlag ACAS 0606 AT and ACAS 0612 AT lower costs … Read More → "Vishay Intertechnology Increases Resistance Ratios and Operating Voltages for ACAS AT Precision Thin Film Chip Resistor Arrays"

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