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Siemens and Digital Charging Solutions make it easier for companies to switch to zero-emission fleets

March 18, 2021
  • Siemens Smart Infrastructure and Digital Charging Solutions have started cooperation
  • A jointly developed service offers corporate customers access to over 190,000 public charging points in currently 21 European countries
  • Simplified processes for fleet drivers and managers through integrated billing

Siemens Smart Infrastructure and Digital Charging Solutions (DCS) will make it easier for fleet drivers and managers in companies to switch to electromobility as part of a cooperation. The first result of the cooperation is the new Siemens charging service “Enterprise Charging Network”. This service offers a consistent and simple solution for charging at … Read More → "Siemens and Digital Charging Solutions make it easier for companies to switch to zero-emission fleets"

eSync™ Alliance announces v2.0 specification for automotive OTA updates and data gathering

Secure bi-directional OTA pipeline to in-vehicle devices
March 18, 2021

Silicon Valley, CA, March 17, 2021 – The eSync™ Alliance announces that it has released v2.0 of the eSync specification. The new release expands on data gathering while further extending the cybersecurity specifications for over-the-air (OTA) software update capabilities of eSync, with full bi-directional communications in a single pipeline.

Based on a server/client/agent architecture, the eSync software platform provides a secure data path between the cloud and any number of electronic end devices located inside a vehicle. It can work across multiple operating systems and networks/busses to reach any ECU or smart sensor … Read More → "eSync™ Alliance announces v2.0 specification for automotive OTA updates and data gathering"

X-FAB Enters into Collaboration with IHP to Progress SiGe BiCMOS Technology

March 17, 2021

Tessenderlo, Belgium and Frankfurt/Oder, Germany – March 17, 2021

X-FAB Silicon Foundries and IHP – Leibniz Institute for High Performance Microelectronics have announced a major industry-academic partnership. The objective of the cooperation between these two bodies, which brings together X-FAB’s proficiency in semiconductor manufacture with IHP’s wireless communication expertise, is to exchange knowledge and establish mutually beneficial engineering synergies.

IHP’s active devices will be directly integrated into the backend of line (BEOL) of X-FAB’s 130 nm XR013 RF-SOI process featuring Cu and thick-Cu based metallization, alongside high-performance passive elements, such as inductors and transformers. This … Read More → "X-FAB Enters into Collaboration with IHP to Progress SiGe BiCMOS Technology"

Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis

Sigrity X leverages breakthrough distributed computing architecture for hyperscale, 5G communications, automotive and aerospace applications
March 17, 2021

Highlights:

  • Sigrity X delivers up to 10X performance improvement with uncompromised accuracy
  • Breakthrough massively distributed simulation enables large-scale
  • complex analysis in the cloud
  • Tightly integrated, leading SI/PI technology available across Cadence design platforms
  • New user experience enables immediate transition across different analysis workflows, minimizing setup time for detailed system analysis

    SAN JOSE, Calif., March 16, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the next-generation Cadence® Sigrity™ X signal and power integrity (SI/PI) solutions. Sigrity X features powerful new simulation engines for system-level analysis and includes … Read More → "Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis"

MathWorks Introduces Release 2021a of MATLAB and Simulink

Includes three new products, 12 major updates, and hundreds of new features
March 17, 2021

NATICK, Mass. – (March 16, 2021) – MathWorks today introduced Release 2021a of the MATLAB and Simulink product families. Release 2021a (R2021a) offers hundreds of new and updated features and functions in MATLAB® and Simulink®, along with three new products and 12 major updates. New capabilities in MATLAB include dynamic controls in live scripts as well as a new task for adding plots to live scripts without writing … Read More → "MathWorks Introduces Release 2021a of MATLAB and Simulink"

Switching to an ever more digital PCB design

Panasonic Industry 3D relay component libraries now available in Autodesk Fusion 360
March 17, 2021

MUNICH, MARCH 2021 — The seemingly endless quest in product design to simultaneously miniaturize devices while increasing functionality has rendered PCB-based engineering the silver bullet of contemporary applications efficiency.

PCB layouts are drafted, developed and realized with the help of digital parts libraries used within Autodesk Fusion 360. The purpose of these parts libraries is to help designers create electric circuits, place components on the PCB or conceive the board routing.

Libraries are most useful when they are complete. Accordingly, Panasonic Industry now announces availability of almost all its relay families (including … Read More → "Switching to an ever more digital PCB design"

Synopsys Launches Industry’s First Complete IP Solution for PCI Express 6.0

DesignWare IP for PCI Express 6.0 Delivers 64 GT/s Data Rate with Low Latency for High-Performance Computing, AI and Storage SoCs
March 17, 2021

Highlights:

  • DesignWare Controller, PHY and Verification IP supports the latest features in the PCI Express 6.0 specification, enabling early SoC development
  • Low-latency controller with new MultiStream architecture delivers up to 2X the throughput of a conventional PCI Express controller
  • High-performance PHY in 5-nm process with unique analog and DSP techniques provides 20 percent less power across chip-to-chip, riser card and backplane interfaces
  • Comprehensive set of protocol, methodology and productivity features enable rapid verification of PCI Express 6.0 designs

Read More → "Synopsys Launches Industry’s First Complete IP Solution for PCI Express 6.0"

PolyPhaser Launches RF Cable Assemblies and Accessories Product Line

Assemblies, Connector Caps, and Cables with Integrated Surge Protection Help Users Complete Installations—All from a Single, Trusted Source
March 17, 2021

IRVINE, Calif. (March 16, 2021) – PolyPhaser, an Infinite Electronics brand and an industry-leading provider of RF and data surge protection, filtering and grounding solutions, today announced the expansion of its globally deployed RF product portfolio—now including RF cable assemblies, connector caps, and cables with … Read More → "PolyPhaser Launches RF Cable Assemblies and Accessories Product Line"

MicroSys Electronics introduces new System-on-Module with NXP LX2160A processor

Rugged edge server module for commercial vehicles and mobile systems offers 16 Arm Cortex-A72 cores
March 17, 2021

Sauerlach near Munich, Germany, March 16, 2021 – MicroSys Electronics announces an expansion to its range of ultra robust System-on-Modules in the embedded edge server class. Based on the NXP QorIQ Layerscape LX2160A processor, the new miriac MPX‑LX2160A System-on-Module (SoM) is optimized for the demanding operating conditions of commercial vehicles and mobile systems. With its 16 Arm Cortex-A72 cores, it provides the technological basis for the significantly greater performance requirements of (AI) edge server applications, autonomous driving, and situational awareness in cobot applications. Offering twice as many cores as its predecessors, the NXP  … Read More → "MicroSys Electronics introduces new System-on-Module with NXP LX2160A processor"

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