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Agile Analog announces deal with tier 1 US customer for agileSecure anti-tamper IP on TSMC N4P Including new electromagnetic sensor to increase tamper detection capabilities

September 15, 2025
10th September 2025. Cambridge, UK. Agile Analog, the customizable analog IP company, has announced a significant agreement with a major US tier 1 repeat customer, to deliver its agileSecure suite of anti-tamper IP on the TSMC N4P process node, including its new electromagnetic sensor.
 
The agileSecure portfolio of anti-tamper IP is designed to … Read More → "Agile Analog announces deal with tier 1 US customer for agileSecure anti-tamper IP on TSMC N4P Including new electromagnetic sensor to increase tamper detection capabilities"

Parasoft Helps Ribbit, Innovative Developer of Autonomous Aircraft Solutions, Soar With AI-Driven Testing of C/C++ Based, Safety-Critical Autopilot Software

September 15, 2025
  • Ribbit’s safety-first approach and Parasoft collaboration prove vital to securing multiple $1M+ government contracts
  • Parasoft C/C++test and C++test CT support modern, Agile software processes, resulting in 95% test coverage through CI pipelines and 100% compliance with MISRA and JSF
  • Combined aerospace expertise and unified focus on verified processes prove instrumental in securing SFOC approvals for unmanned test flights

 Monrovia, Calif. – September 15, 2025 – Read More → "Parasoft Helps Ribbit, Innovative Developer of Autonomous Aircraft Solutions, Soar With AI-Driven Testing of C/C++ Based, Safety-Critical Autopilot Software"

Bee-Sting Inspired Microneedles from Chung-Ang University Could Revolutionize Drug Delivery

Researchers develop new wearable microneedles that improve drug absorption while reducing pain in long-term delivery
September 12, 2025

Patients who suffer from chronic conditions often require continuous injections of drugs, which is quite painful and often inconvenient. To address this, researchers from South Korea have developed new wearable microneedles which are inspired by bee stings. These electrospun web microneedles (EW-MNs) deliver drugs continuously through the skin without causing discomfort. In animal models, the system enhanced drug absorption while ensuring comfort—offering a safer and convenient alternative to conventional needle systems.

Neurological diseases affect millions worldwide, and the need for long-term patient-friendly treatments has never been greater. While needle-based injections are the standard … Read More → "Bee-Sting Inspired Microneedles from Chung-Ang University Could Revolutionize Drug Delivery"

Silicon Catalyst Startups Fast-Track Chip Development with Synopsys Cloud

Long-term In-Kind Partnership relationship now includes Cloud-based EDA & IP
September 11, 2025

Silicon Valley, Calif., September 8, 2025 – Silicon Catalyst, the only incubator + accelerator focused on the global semiconductor industry, including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum, today announced that companies in its 24-month program will have access to Synopsys Cloud, expanding and simplifying their ability to leverage industry-leading Electronic Design Automation (EDA) software and IP for accelerated chip design and innovation.

Read More → "Silicon Catalyst Startups Fast-Track Chip Development with Synopsys Cloud"

NeuReality Unveils AI-SuperNIC and UEC Compliance, Delivers Ideal Architecture for Scale Out AI Infrastructure

Breakthrough 1.6 Tbps NR2 AI-SuperNIC and UEC-compliant networking will set a new standard for scalable AI training and inference
September 11, 2025

Santa Clara, California – Sept. 9, 2025 – Today at AI Infrastructure Summit, Read More → "NeuReality Unveils AI-SuperNIC and UEC Compliance, Delivers Ideal Architecture for Scale Out AI Infrastructure"

Advantest Introduces Advanced Mask CD-SEM “E3660”

2nm Node-Ready System with Enhanced Reproducibility, Throughput, and Curvilinear Pattern Measurement
September 11, 2025

TOKYO, Sept. 09, 2025 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the release of its next-generation CD-SEM* E3660, engineered for the dimensional metrology of photomasks and EUV masks used in cutting-edge semiconductor manufacturing. Compared to the previous generation’s Read More → "Advantest Introduces Advanced Mask CD-SEM “E3660”"

DVCon Europe 2025 to Feature Broad Technical Program and New Applications

Highlights include Medicine, SystemC, AI and Open Source
September 11, 2025

Munich, Germany – 9th September 2025- The Design and Verification Conference & Exhibition Europe (DVCon Europe), sponsored by Accellera Systems Initiative, has announced an extensive technical program, with industry leading keynotes and an in-depth technical panel session.  The program is broad, covering UVM, SystemC, Open Source and AI and touching on new application areas.   DVCon Europe 2025 runs on 14th and 15 … Read More → "DVCon Europe 2025 to Feature Broad Technical Program and New Applications"

Eaton delivers edge-based innovation to help mitigate the impact of AI power bursting on both data centers and the grid

September 11, 2025
  • Industry-first solution helps customers detect AI load spikes to enhance resiliency of critical data center and grid infrastructure
  • New solution furthers Eaton’s grid-to-chip strategy, using power management innovation to meet critical data center energy challenges

CLEVELAND – Intelligent power management company Eaton today announced that it has achieved an industry-first solution for identifying large fluctuations in energy demanded by artificial intelligence (AI) computing infrastructure, known as AI power bursts. Eaton’s new edge-based solution, available via a firmware update for its Read More → "Eaton delivers edge-based innovation to help mitigate the impact of AI power bursting on both data centers and the grid"

Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers

GN1834D enables emerging 1.6T optical interconnect market while GN1818 offers up to 20% power reduction for enhanced 800G efficiency
September 11, 2025

SHENZHEN, China and CAMARILLO, Calif., September 8, 2025 – Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (“IoT”) systems and cloud connectivity service solutions, today announced two new FiberEdge® transimpedance amplifiers (TIAs) designed to address power efficiency challenges in AI infrastructure scaling. The new TIAs expand Semtech’s industry-leading signal integrity portfolio and further enhance power efficiency for continued 800G deployment optimization.

As AI workloads drive exponential bandwidth growth toward 1.6T infrastructure, power consumption has become a critical constraint in data center scaling. Semtech’s latest FiberEdge innovations directly address this challenge, with the GN1834 … Read More → "Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers"

Semtech Launches 2.5G FTTR Chipset for Next-Generation PON Networks

Comprehensive 2.5G symmetric FTTR chipset delivers cost efficiency breakthroughs for expanding fiber-to-premises deployments
September 11, 2025

SHENZHEN, China and CAMARILLO, Calif., September 9, 2025 – Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (“IoT”) systems and cloud connectivity service solutions, today announced its comprehensive 2.5G symmetric Fiber to the Room (FTTR) chipset designed to accelerate global Passive Optical Network (PON) deployments. The integrated solution addresses critical cost and performance challenges as the FTTR market prepares for significant growth driven … Read More → "Semtech Launches 2.5G FTTR Chipset for Next-Generation PON Networks"

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