News – Page 700 – EEJournal

Avery Design Systems and Rambus Extend Memory Model and PCIe® VIP Collaboration

May 24, 2021

Tewksbury, MA. and San Jose, Calif. – May 19, 2021 – Avery Design Systems, a leader in functional verification solutions, and Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, announced today they are extending their long-term memory model and PCIe® Verification IP (VIP) collaboration.

Rambus utilizes Avery’s high-quality, full-featured memory models to verify their memory controllers including HBM2/2E, GDDR6, LPDDR4, and DDR3/4. Rambus includes these … Read More → "Avery Design Systems and Rambus Extend Memory Model and PCIe® VIP Collaboration"

Canatu achieves record-high carbon nanotube opto-electric performance with its Carbon NanoBud (CNB™) transparent conductive film

Expands potential applications and makes CNB more affordable for automotive ADAS heater and capacitive touch applications

May 24, 2021

VANTAA, Finland May 19th, 2021 – Carbon nanomaterial company Read More → "Canatu achieves record-high carbon nanotube opto-electric performance with its Carbon NanoBud (CNB™) transparent conductive film"

New 67GHz microwave multiplexers in PXI, PXIe and LXI formats from Pickering Interfaces enable engineers to scale up performance in the same test system footprint

May 21, 2021

On demonstration at the International Microwave Symposium,
June 8-10, Atlanta, GA., USA (In-Person Event); and June 20-25 (Virtual Event)

May 20, 2021 – Clacton-on-Sea, UK – Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions … Read More → "New 67GHz microwave multiplexers in PXI, PXIe and LXI formats from Pickering Interfaces enable engineers to scale up performance in the same test system footprint"

AVX Releases New UBC 550 Series Ultra-Broadband Capacitors for Reliable, Repeatable Performance from 16KHz to 70+GHz

Optimized for high-performance, ultra-broadband microwave and millimeter-wave RF applications, the new UBC 550Z, 550U, and 550L Series capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high repeatability.

May 21, 2021

FOUNTAIN INN, S.C., May 20, 2021 (GLOBE NEWSWIRE) — AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has released new Read More → "AVX Releases New UBC 550 Series Ultra-Broadband Capacitors for Reliable, Repeatable Performance from 16KHz to 70+GHz"

KP Performance Antennas Launches New ProLine 5 GHz, 2-Port Sector Antennas

New Antennas Deliver High Gain and Tailored Patterns that are Stable Over Wide Bandwidth

May 21, 2021

IRVINE, Calif. – KP Performance Antennas, an Infinite Electronics brand and a manufacturer of wireless network antennas, just introduced new 2-port ProLine 5GHz antennas that provide higher signal strength and improved interference rejection over equivalent asymmetric horn antennas.

KP’s new line of Read More → "KP Performance Antennas Launches New ProLine 5 GHz, 2-Port Sector Antennas"

MU-Thermocouple1 CAN FD – Temperature Measuring Unit with CAN FD Support

May 21, 2021

The new measuring unit MU-Thermocouple1 CAN FD from PEAK-System transmits its temperature measurement data using the modern standard CAN FD. Depending on the product version, eight mini-connectors for thermocouples of the types J, K, or T are available for temperature measurement. The CAN communication is done via a D-Sub connector. The measuring unit supports the CAN FD standard with data bit rates up to 10 Mbit/s and is at the same time downward compatible to classic CAN 2.0 A/B.

With the MU-Thermocouple1 CAN FD, temperature measurement can be integrated directly into automotive test benches or industrial plants … Read More → "MU-Thermocouple1 CAN FD – Temperature Measuring Unit with CAN FD Support"

ROHM Launches “Environmental Vision 2050” Program

Aims to achieve zero CO2 emissions within 30 years

May 21, 2021

Santa Clara, CA and Kyoto, Japan, May 21, 2021 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced its “Environmental Vision 2050” program, which will contribute to achieving a sustainable society by 2050. In addition to … Read More →

Altium Advances Electronic & Mechanical Co-Design

ECAD/MCAD Capability Keeps Electronic and Mechanical Designs in Sync

May 20, 2021

SAN DIEGO, May 20, 2021: In the process of designing electronic products for industries like IoT, autonomous vehicles, and industrial automation—mechanical and electrical engineers face multiple challenges. One of the greatest sources of frustration mechanical engineers face happens when mechanical and PCB designers collaborate on the same electronic design assemblies.

During the design process of any complex electronics product, both mechanical and PCB designers are continually importing, exporting, and converting files in an effort to keep mechanical and electronic designs in sync. This adds hours of manual labor, data loss, and rework to the design process – and yet … Read More → "Altium Advances Electronic & Mechanical Co-Design"

IAR Systems boosts development of embedded applications based on NXP’s i.MX RT1160 crossover MCUs

IAR Embedded Workbench® for Arm® now supports all i.MX RT crossover MCUs from NXP® Semiconductors, enabling developers to fully leverage the high performance and the ease of use of these processors

May 20, 2021

Uppsala, Sweden—May 20, 2021—IAR Systems®, the future-proof supplier of software tools and services for embedded development, today announced that the latest version of the development toolchain IAR Embedded Workbench for Arm adds support for NXP’s latest crossover MCU – the i.MX RT1160 MCU. This is in addition to the already supported i.MX RT1170, i.MX RT1064, i.MX RT1060, i.MX RT1050 i.MX RT1024, i.MX RT1020, i.MX RT1015, i.MX RT1010, i.MX RT600 and i.MX RT500 MCU families.

IAR Embedded Workbench for Arm … Read More → "IAR Systems boosts development of embedded applications based on NXP’s i.MX RT1160 crossover MCUs"

TDK announces the ASIL-B upgrade of its 3D HAL® direct-angle sensor family HAL 37xy

May 20, 2021

May 20, 2021 — TDK Corporation (TSE:6762) has upgraded its Micronas 3D HAL® direct-angle Hall-effect sensor family, HAL 37xy (HAL 37xy, HAR 37xy and HAC 37xy),* for automotive and industrial applications regarding functional safety aspects. All members of HAL 37xy are now defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262. HAL 37xy rotary position detection features are used in applications such as accelerator pedals, electronic throttle controls, rotary shifters (with push-function) and rear-axis steering systems. Furthermore, the sensors detect linear position in applications like clutch or brake pedals, transmission systems, cylinders and valve position sensing.** Relevant documentation, … Read More → "TDK announces the ASIL-B upgrade of its 3D HAL® direct-angle sensor family HAL 37xy"