News – Page 696 – EEJournal

AMD EPYC™ Processors Accelerate High Performance Computing Capability in Perlmutter Supercomputer

New system will enable next-gen research on clean energy, climate and more for the National Energy Research Scientific Computing Center

May 31, 2021

SANTA CLARA, Calif., May 27, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today joined the National Energy Research Scientific Computing Center (NERSC), Lawrence Berkeley National Laboratory (Berkeley Lab) and others in unveiling the new Perlmutter supercomputer powered by Read More → "AMD EPYC™ Processors Accelerate High Performance Computing Capability in Perlmutter Supercomputer"

Magic Information Launches Turnkey Solution for Smart Locks Using Technology from STMicroelectronics

May 31, 2021

China, May 27, 2021 – Magic Information, China’s leading Artificial Intelligence of Things (AIoT) fingerprint-recognition technology provider, has launched a smart-lock reference design, based on AIoT fingerprint recognition running on an STMicroelectronics STM32WB55* Bluetooth® LE (BLE) microcontroller (MCU) that manufacturers can integrate into their designs to make Smart Locks.

This reference design leverages the dual-core (Arm® Cortex® M0+ and M4) advantages of the STM32WB55, designed with high interoperability between the hosting MCU, fingerprint recognition, as well as Bluetooth LE 5.2. The Magic Information fingerprint-recognition algorithm runs on the high-performance STM32WB55 MCU that also … Read More → "Magic Information Launches Turnkey Solution for Smart Locks Using Technology from STMicroelectronics"

Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS

Clarity 3D Solver Cloud integrates on-premises simulation setup with cloud computation and acceleration at no additional cost

May 31, 2021

Highlights:
Simple yet powerful push-button interface initiates simulation in the cloud while ensuring data is secure
Unbounded 3D simulation scalability extends computational resources, enabling rapid optimization of EM results to reduce turnaround time
Immediate access to cloud eliminates the wait for on-premises server farm resources to become available

SAN JOSE, Calif., May 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a straightforward, secure and cost-effective approach to gaining access to compute resources in the cloud when executing 3D electromagnetic (EM) simulations with Cadence® Clarity™ 3D Solver Cloud. Clarity 3D Solver Cloud provides the ability … Read More → "Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS"

Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications

New 8.2mm Creepage IGBT Drivers and IPM Driver Reduce PCB Mounting Area by 35 Percent to Maximize Board Space

May 31, 2021

Düsseldorf, May 27, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its family of 8.2mm creepage photocouplers with three new devices designed for operation in harsh industrial automation equipment, solar inverter, and EV charger operating environments. Measuring a mere 2.5mm x 2.1mm in an LSSO5 package, the world’s smallest optical isolated IGBT drivers and intelligent power module (IPM) driver reduce PCB mounting areas by up to 35 percent compared with other devices on the market.

“Industrial equipment and green energy system manufacturers are currently facing two core challenges: Equipment needs to get … Read More → "Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications"

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications

Class-leading SOA and Avalanche characteristics increase ruggedness and reliability

May 31, 2021

Nijmegen, May 27 2021: Nexperia, the expert in essential semiconductors, today announced new 0.55 mΩ R_DS(on)40 V power MOSFETs in the high-reliability LFPAK88 package for automotive (BUK7S0R5-40H) and Read More → "Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications"

TDK offers extremely compact current-compensated ring core double chokes for very high frequencies

May 31, 2021

May 27, 2021 — TDK Corporation (TSE: 6762) presents a new series of very compact current-compensated EPCOS power line ring core double chokes for very high frequencies. The B82791H2*N010 series is available with current ratings from 1.5 A to 4 A at a nominal ambient temperature of +70 °C without derating, and for a nominal voltage of 250 V AC (50/60 Hz). Depending on the type, the inductance values are 14 µH to 100 µH. The utilized plastic material meets UL 94 V-0. To match significant requirements for specific applications such as drives, the plastic material fulfills the specifications for GWIT (+775 °C), GWFI (850 °C) and Ball Pressure (+125 °C). The … Read More → "TDK offers extremely compact current-compensated ring core double chokes for very high frequencies"

IAR Systems and Secure Thingz present embedded security compliance solution for Renesas RX

Compliance Suite includes security development tools and practical guidance, delivering a shrink-wrapped solution for organizations to ensure security legislation compliance in their IoT applications

May 31, 2021

Cambridge, United Kingdom / Uppsala, Sweden—May 27, 2021—IAR Systems®, the future-proof supplier of software tools and services for embedded development, and Secure Thingz, an IAR Systems Group company, today presented Compliance Suite for Renesas RX. Compliance Suite provides developers and organizations with the security development tools, practical guidance and knowledge needed to rapidly build applications that are compliant with security legislation, such as the Consumer IoT Security Standard EN 303 645, UK & Australian 13 Best Practices, and the evolving US Cybersecurity Improvement Act (NISTIR 8259). The Compliance Suite for Renesas RX is specifically designed for applications based on the Renesas … Read More → "IAR Systems and Secure Thingz present embedded security compliance solution for Renesas RX"

ROHM’s High 8V Gate Withstand Voltage Marking Technology Breakthrough for 150V GaN HEMT

Solving the gate breakdown voltage problem of GaN devices contributes to lower power consumption and greater miniaturization of power supplies for base stations and data centers

May 28, 2021

Santa Clara, CA and Kyoto, Japan, May 27, 2021 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced it has developed the industry’s highest (8V) gate breakdown voltage (rated gate-source voltage) technology for 150 … Read More → "ROHM’s High 8V Gate Withstand Voltage Marking Technology Breakthrough for 150V GaN HEMT"

CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity

Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber For Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses

May 28, 2021

GRENOBLE, France – May 28, 2021 – As part of its broad focus on millimeter-wave (mmWave) data transfer applications, CEA-Leti has developed a hybrid, ultra-fast, ultra-low latency technology that guides mmWave radio signals through flexible plastic tubing. Called H-Link, the low-cost, energy-saving system ensures Gb/s broadband connectivity that also overcomes the limits of copper wire and optical fiber, such as oxidation of metal and brittleness. In addition to being flexible and less sensitive to vibration and electromagnetism, H-Link’s wireless technology delivers transmission speeds of up to 15 Gb/s.

Designed for multiple robotic and other applications, the system meets next-generation … Read More → "CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity"

Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

Joint customers successfully use the certified Cadence digital flow and custom/analog tool suite to complete test chip tapeouts on TSMC’s advanced processes

May 28, 2021

SAN JOSE, Calif., May 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is expanding its collaboration with TSMC to accelerate mobile, AI and hyperscale computing application design using the integrated Cadence® digital flow and custom/analog tool suite on TSMC’s N3 and N4 process technologies. Joint Cadence and TSMC customers have already successfully used the digital and custom/analog tools to complete test chip tapeouts. As part of the collaboration, the Cadence digital and custom/analog tools have been optimized and certified for TSMC’s N3 and N4 process technologies, supporting the latest Design Rule Manual ( … Read More → "Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes"

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