SAN JOSE, Calif., June 17, 2021 (GLOBE NEWSWIRE) — SmartDV™ Technologies, the leader in Design and Verification Intellectual Property (IP), today confirmed it is … Read More → "SmartDV Joins the Xilinx Partner Program"
San Jose, Calif. – June 16, 2021 – Power Integrations (Nasdaq: Read More → "Power Integrations Incorporates Lossless Zero-Cross Detection and X-Capacitor Discharge into New LinkSwitch-TNZ Offline Switcher ICs"
TOKYO, Japan, June 17, 2021 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on the V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs). This novel approach can correlate scan testing results between established and new test routines, boot up and execute on-chip test software and achieve a seamless end-to-end data flow in conjunction with Advantest’s partners in electronic design automation (EDA).
IRVINE, Calif., June 17, 2021 (GLOBE NEWSWIRE) — Lantronix Inc. (NASDAQ: LTRX), a global provider of … Read More → "Lantronix Drives Development of Smart Industrial Solutions That Increase Safety and Efficiency"
June 17, 2021 — TDK Corporation (TSE:6762) expands its Micronas 3D HAL® sensor portfolio with the Hall-sensor family HAC® 39xy*, which features integrated capacitors for stray-field robust position detection in automotive and industrial applications. The TO92UF package was designed explicitly for PCB-less applications, combining both a chip from the HAL® 39xy* family featuring stray-field compensation capability, and up to two capacitors with up to 330 nF. The new sensors suit a wide range of applications, including valves and actuators, gear shifters, transmission systems, or brake stroke position detection. The PSI5 interface supports the latest requirements of chassis-position detection sensors. **
SANTA CLARA, Calif., June 16, 2021 (GLOBE NEWSWIRE) — Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
While size reduction benefits transistor performance, the opposite is true in the interconnect wiring: smaller … Read More → "Applied Materials Breakthrough in Chip Wiring Enables Logic Scaling to 3nm and Beyond"
Geneva, Switzerland, June 16, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has begun delivering the first Stellar … Read More → "STMicroelectronics Delivers First Stellar Advanced Automotive Microcontrollers for New Road-Car Projects"
Siemens Digital Industries Software today announced the establishment of JEP181—a neutral file, XML-based standard from the JEDEC Solid State Technology Association, which is the global leader in standards development for the microelectronics industry. The JEP181 standard simplifies thermal model data sharing between suppliers and end-users in a single file format called ECXML (Electronics Cooling eXtensible Markup Language).
The new standard was created to meet a significant challenge for electronics manufacturers: as increasingly powerful processors allow companies to pack more performance and functionality into their designs, the effective management of heat dissipation and other thermal factors has … Read More → "Siemens announces new JEDEC industry standard for electronics cooling simulation"
Düsseldorf, June 15, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that customers designing with all mainstream Renesas 32-bit MCU families now have access to < … Read More → "Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families With Simple Licensing For Secure Embedded IoT Development"
