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High tech meets design: screenless wristband enables communication and contactless payment with innovative biometrics

June 28, 2021

Munich, Germany – 28 June 2021 – The IoT (Internet of Things) building blocks from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) are becoming ever more powerful, energy-efficient, and smaller. Today, practically any everyday object can be enriched with smart functions to make life easier. Using system solutions from Infineon, Deed ®, a deep tech start-up from Turin, Italy, has been able to create a screenless yet feature-rich wearable: The sleek and elegant get ® bracelet interprets human gestures and uses biometric data, … Read More → "High tech meets design: screenless wristband enables communication and contactless payment with innovative biometrics"

AMD Leads High Performance Computing Towards Exascale and Beyond

June 28, 2021
  • Adoption of AMD EPYC processors in Top500 list of world’s fastest supercomputers accelerates; number of AMD-powered systems doubles since November and EPYC processors power half of the newly ranked systems
  • AMD EPYC™ processors and AMD Instinct™ accelerators enabling engineering breakthroughs and powering research addressing the world’s most complex scientific challenges

SANTA CLARA, Calif., June 28, 2021 (GLOBE NEWSWIRE) — At this year’s International Supercomputing 2021 digital event, Read More → "AMD Leads High Performance Computing Towards Exascale and Beyond"

NVIDIA and Google Cloud to Create Industry’s First AI-on-5G Lab to Speed Development of AI Everywhere

Joint Innovation Lab to Support Vendors in Conceiving, Testing, Optimizing, and Validating 5G and AI Applications Running On-Prem and Across Google Cloud
June 28, 2021

BARCELONA, Spain, June 28, 2021 (GLOBE NEWSWIRE) — Mobile World Congress—NVIDIA today announced that it is partnering with Google Cloud to establish the industry’s first AI-on-5G Innovation Lab, enabling network infrastructure players and AI software partners to develop, test and adopt solutions that will help accelerate the creation of smart cities, smart factories and other advanced 5G and AI applications.

The lab will provide enterprises with access to Google Cloud’s Anthos platform and NVIDIA accelerated computing hardware and software platforms that let them harness data and AI to drive business performance, improve operational efficiency … Read More → "NVIDIA and Google Cloud to Create Industry’s First AI-on-5G Lab to Speed Development of AI Everywhere"

Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology

Fusion Design Platform Advancements Provide New Levels of Power-Optimized Performance for High-Growth AI, HPC and 5G Markets
June 28, 2021

MOUNTAIN VIEW, Calif., June 28, 2021 /PRNewswire/ —

Highlights for this Announcement:

NXP Brings GaN to 5G Multi-Chip Modules for Energy-Efficient Mobile Networks

June 28, 2021
  • GaN performance in NXP’s multi-chip modules for 5G infrastructure increases efficiency by 8 percentage points
  • Reduces size and weight of radios; accelerates the design and deployment of 5G systems
  • NXP combines multiple technologies to drive optimal performance

    Eindhoven, Netherlands – June 28, 2021 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a major industry milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, the most advanced fab dedicated to RF power amplifiers in the United … Read More → "NXP Brings GaN to 5G Multi-Chip Modules for Energy-Efficient Mobile Networks"

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services
June 28, 2021

Meyreuil, France and San Jose, Calif., June 24, 2021—Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto is adopting the Cadence® system design and analysis portfolio for advanced IC packaging, which includes the Cadence Allegro® X Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ technology and Celsius™ Thermal Solver, on an exclusive basis in order to design IC packaging solutions for its automotive and IoT customers. In addition, … Read More → "Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets"

Alpha Data delivers new FPGA-based solution for High Altitude environments

Alpha Data, a world-leading company in FPGA-based acceleration, is pleased to announce the first shipment of the System on a Module (SoM) ADM-VPX3-9Z5 product to customers. This rugged, military specification product is designed for challenging environments including High Altitude operations.
June 28, 2021

24 June 2021, Edinburgh, UK – The Defense-Grade ADM-VPX3-9Z5 has been produced by Alpha Data in collaboration with Xilinx and Texas Instruments, and features Mil-temp range (-55C to +125C) components throughout, for utilization in challenging environments.

The ADM-VPX3-9Z5 delivers high-performance in demanding environments and is especially designed to accelerate digital signal processing — making it particularly useful for remote sensing and Earth Observation.

Built by Alpha Data, the ADM-VPX3-9Z5 is a SOSA-aligned OpenVPX standard System on Module (SoM) that utilizes the Xilinx Defense-Grade Zynq UltraScale+ XQZU19EG FPGA. The board features Mil-temp … Read More → "Alpha Data delivers new FPGA-based solution for High Altitude environments"

RS Components incorporates SnapEDA component library into DesignSpark

Millions of free CAD models added to free-to-use PCB design suite
June 28, 2021

LONDON, UK, 24 June 2021 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel provider of product and service solutions, has integrated the SnapEDA electronic component library and search engine into its award winning DesignSpark PCB CAD platform. The new search capability gives engineers easy access to free CAD models of millions of electronic components, significantly reducing design times.

SnapEDA provides free access to the essential building blocks for electronic design, including schematic symbols, PCB footprints and 3D models created using proprietary creation, verification and translation technology. As the industry’s only vendor agnostic … Read More → "RS Components incorporates SnapEDA component library into DesignSpark"

Maxim Integrated and SICK AG Team Up for Industry’s Smallest LiDAR Safety Laser Scanner

Maxim’s MAX14914 software configurable digital IO supports industrial sensor leader SICK AG to shrink safety laser scanners by 50 percent with their new nanoScan3 model
June 28, 2021

SAN JOSE, Calif.—June 24, 2021—Maxim Integrated Products, Inc. (NASDAQ: MXIM) today announced that its software-configurable digital IO products helped enable a 50 percent size reduction for the microScan3 Core I/O LiDAR-based safety laser scanner from SICK AG, a leader in the design and manufacturing of industrial sensor-based solutions. Achieving the industry’s smallest design allows SICK to expand the versatility of the new nanoScan3 Safety Laser Scanner for machines and vehicles that require high performance but have minimal mounting space.

Maxim and SICK designers worked side-by-side to optimize the new scanner design by … Read More → "Maxim Integrated and SICK AG Team Up for Industry’s Smallest LiDAR Safety Laser Scanner"

Synopsys PrimeShield Selected by Samsung Electronics to Maximize Energy Efficiency and Performance for Next-Generation Process Node Designs

Best-in-Class, Machine-Learning-Driven Technology from Synopsys Fusion Design Platform Delivers Design Robustness for Mobile, 5G and Automotive SoCs
June 28, 2021

MOUNTAIN VIEW, Calif., June 24, 2021 /PRNewswire/ —

  • Synopsys and Samsung’s System LSI Business collaborate and deploy key technology innovations to address design vulnerability to variation
  • PrimeShield improves design resilience to voltage variation and enables power savings using voltage slack analysis
  • Comprehensive design variation analysis minimizes timing pessimism and design over-margins, delivering improved performance
< … Read More → "Synopsys PrimeShield Selected by Samsung Electronics to Maximize Energy Efficiency and Performance for Next-Generation Process Node Designs"
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