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ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors

ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors

Summary:
● ADLINK’s Express-TL COM Express Type 6 module features 11th Generation Intel® Core™, Xeon® W, and Celeron® 6000 processors with up to 8 cores and 128 GB memory
● As the first COM Express module to support PCI Express Gen 4 x16, the Express-TL effectively doubles the bandwidth of previous COM Express modules
● Designed for rugged operating temperatures between -40°C – 85°C, the Express-TL can operate 24/7 in industrial settings with 10-year availability

Taipei, Taiwan — August 03, 2021

ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel® Core™, Xeon® … Read More → "ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors"

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency

CHANDLER, Ariz., August 3, 2021 – In the race to reduce aircraft emissions, developers increasingly are moving toward more efficient designs including electrical systems that replace today’s pneumatics and hydraulics powering everything from on-board alternators to actuators and Auxiliary Power Units (APUs). To enable next-generation aircraft electrical systems, new power conversion technology is required. Microchip Technology Inc. (Nasdaq: MCHP) today announced its development with Clean Sky, a joint European Commission (EC) and industry consortium, of the first aerospace-qualified baseless power modules enabling higher-efficiency, lighter and more compact power conversion and motor drive systems.

Partnering with … Read More → "First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency"

TDK develops downsized, compact, thin-film power inductors for automotive power circuits

August 3, 2021 — TDK Corporation (TSE: 6762) has developed a series of thin-film metal power inductors for automotive power circuits. The new TFM201210ALMA inductors feature a mounting area downsized approximately 22 % from TDK’s conventional product, TFM201610ALMA (2.0 mm (L) x 1.6 mm (W) x 1.0 mm (H)). Mass production will begin in August 2021.

Demand has recently increased in ECU* mounting for the electrification of various automotive controlling functions, autonomous driving, information communication and other purposes. Downsized inductors for power circuits contribute to space-saving in a mounting substrate, at a time when quick advances in ADAS** performance increase the number of components … Read More → "TDK develops downsized, compact, thin-film power inductors for automotive power circuits"

IAR Systems collaborates with NSITEXE to accelerate functional safety development for RISC-V

Uppsala, Sweden—August 2, 2021—IAR Systems®, the future-proof supplier of software tools and services for embedded development, today announced its partnership with NSITEXE, a group company of DENSO Corporation that develops and sells high-performance semiconductor IP. The partnership focuses on bringing high-performance development tools solutions with ensured functional safety and extensive support services to innovative applications based on RISC-V.

Functional safety is a constant growing requirement for embedded systems, with automotive applications, industrial automation and medical devices as three of the major driving forces. IAR Systems launched the first edition of … Read More → "IAR Systems collaborates with NSITEXE to accelerate functional safety development for RISC-V"

Efabless & OpenROAD Advance Commercial Open Source Chip Design

SAN JOSE, Calif., July 29, 2021 (GLOBE NEWSWIRE) — Efabless and the OpenROAD project are excited to announce combining their efforts to work closer together to advance and democratize chip design. Moving forward OpenROAD will adopt Efabless’ OpenLane as the flow of record for the OpenROAD program. This will provide users of OpenROAD a more robust flow as well as additional point tools which add value to the base OpenROAD application. Importantly, the unifying of the offerings under the OpenROAD organization will provide a single point of focus for open source development, bringing more clarity and concentration of effort to … Read More → "Efabless & OpenROAD Advance Commercial Open Source Chip Design"

New Low-Capacitance ESD Protection Array for High Speed Data & Audio Interfaces Released by New Yorker Electronics

NORTHVALE, New Jersey, USA – New Yorker Electronics has announced its release of the new Amazing Microelectronic Corp. (AMC) AZ1015-02N Low-Capacitance ESD Protection TVS Array for High-Speed Data Interfaces. The device is used for Audio Interface, Monitor and Flat Panel Display, USB2.0 and SIM Ports. The multifaceted AZ1015-02N maintains low surge clamping voltage for ESD/EOS Protection, low capacitance to keep signal integrity and offers varying integration techniques to reduce cost.

The Read More → "New Low-Capacitance ESD Protection Array for High Speed Data & Audio Interfaces Released by New Yorker Electronics"

SEGGER’s Linux Studio makes top rated development environment available to Linux developers

Monheim am Rhein, Germany – 2nd August 2021

Linux Studio is a development environment designed specifically for native host development, making the features of SEGGER’s top rated Embedded Studio IDE available to all Linux application developers. With its sleek Visual Studio-style user interface, powerful project management and integrated source-level debugger, Linux Studio greatly simplifies development on Linux.

Linux Studio’s project manager enables clear organization of all project resources. Multi-project solutions can keep all parts of an application together, such as an executable file, additional libraries and resources.

SEGGER’s Linux Studio guides successful … Read More → "SEGGER’s Linux Studio makes top rated development environment available to Linux developers"

Keysight Technologies to Showcase Advanced High-Speed Digital Design Solutions at DesignCon 2021

What: High-speed digital standards are evolving, and technological generational changes introduce new test challenges for digital designs. At DesignCon 2021, Keysight’s technical experts will highlight high-speed digital designs across all product development stages which enables customers to anticipate test challenges and optimize performance, as well as accelerate time-to-market of high-speed computing interfaces, data center … Read More → "Keysight Technologies to Showcase Advanced High-Speed Digital Design Solutions at DesignCon 2021"

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