Infineon’s CoolSiC™ MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications
Munich, Germany – 29 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the CoolSiC™ MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimized thermal performance, system efficiency, and power density. They were specifically designed for demanding industrial applications that require high performance and reliability, such as electric vehicle chargers, solar inverters, uninterruptible power supplies, motor drives, and solid-state circuit breakers.
The new CoolSiC 1200 V G2 technology offers significant improvements over the previous generation, … Read More → "Infineon’s CoolSiC™ MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications"

