News – Page 644 – EEJournal

Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform

Industry’s first comprehensive 3D-IC platform for multi-chiplet design and advanced packaging

October 8, 2021

Highlights:

• Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit
• Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities
• Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive

SAN JOSE, Calif., October 7, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the delivery of the Cadence® Integrity™ 3D-IC platform, the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation and system analysis in a single, … Read More → "Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform"

ROHM’s 75W High Optical Output Laser Diode for LiDAR

High density emission, along with the industry’s narrowest width, supports longer distances and higher accuracy in LiDAR-equipped applications

October 8, 2021

Santa Clara, CA and Kyoto, Japan, Oct. 07, 2021 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced they have developed a Read More → "ROHM’s 75W High Optical Output Laser Diode for LiDAR"

MicroSys Partners with Leading AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform

MicroSys miriac embedded modules and platforms combined with Hailo-8 AI acceleration modules offer a high-performance, scalable embedded platform for AI processing at the edge, with applications in fields such as Industry 4.0, automotive and heavy machinery

October 8, 2021

Columbia, MD and Tel Aviv, Israel, September 30^th, 2021 – MicroSys Electronics announced today its partnership with leading AI (Artificial Intelligence) chipmaker Hailo to launch its miriac AIP-LX2160A embedded platform hosting up to 5 integrated Hailo-8 AI accelerator modules. The new edge server-grade AI solution enables high-performance and scalable AI inference capabilities at the edge. The new, application-ready AI platform offers industries a high bandwidth … Read More → "MicroSys Partners with Leading AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform"

Robust Isolated SiC Gate Driver from STMicroelectronics Saves Space in Narrow SO-8 Package

October 7, 2021

Geneva, October 7, 2021 – STMicroelectronics’ STGAP2SiCSN single-channel gate driver, optimized to control silicon-carbide MOSFETs, comes in a space-saving narrow-body SO-8 package and delivers robust performance with accurate PWM control.

As SiC technology becomes widely adopted to boost power-conversion efficiency, the STGAP2SiCSN simplifies design, saves space, … Read More → "Robust Isolated SiC Gate Driver from STMicroelectronics Saves Space in Narrow SO-8 Package"

PICMG Ratifies IoT.1 Firmware Specification for Smart IoT connected Sensors and Effecters

October 7, 2021

Wakefield, MA., October 2021 – PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of IoT.1 specification defining a communication standard between sensors / effecters and local IoT controllers such as micro Sensor Adapter Modules (microSAM) already specified by PICMGs IoT.0 specification.

The IoT.1 specification defines a firmware interface and low-level data model that provides for vendor-independent configuration of smart sensors and effecters, as well as plug … Read More → "PICMG Ratifies IoT.1 Firmware Specification for Smart IoT connected Sensors and Effecters"

TDK offers miniaturized, highly sensitive MEMS pressure sensor element

October 7, 2021

TDK Corporation (TSE:6762) presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35* works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V. Offering a high sensitivity of 110 mV/V/bar, C35 is well suited for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON. Furthermore, C35 … Read More → "TDK offers miniaturized, highly sensitive MEMS pressure sensor element"

Synopsys Accelerates Multi-Die Designs with Industry’s First Complete HBM3 IP and Verification Solutions

HBM3 IP Solution Delivers Maximum Memory Bandwidth of 921 GB/s for High-Performance Computing, AI, and Graphics SoCs

October 7, 2021

MOUNTAIN VIEW, Calif., Oct. 7, 2021 /PRNewswire/ —

Highlights of this Announcement:

The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and maximizes memory performance in 2.5D multi-die systems
Low-latency HBM3 Controller with flexible configuration options enhance memory bandwidth
Pre-hardened or configurable HBM3 PHY in 5-nm process operates at 7200 Mbps for … Read More → "Synopsys Accelerates Multi-Die Designs with Industry’s First Complete HBM3 IP and Verification Solutions"

Movandi Achieves Landmark 5G mmWave Automotive Test Results

Test drive with Movandi BeamXR powered smart repeaters delivers continuous 5G mmWave connectivity and 19X industry average downlink speeds up to 3 Gb/s in mobile vehicles

October 7, 2021

IRVINE, Calif., October 7, 2021 – Movandi, a leader in new 5G millimeter-wave (mmWave) technology, today announced the test drive results showing how 5G mmWave can deliver exceptional performance in a moving automobile when Movandi-powered BeamXR smart repeater with Movandi BeamX cloud software control, machine learning and artificial intelligence (AI) are combined. This Read More → "Movandi Achieves Landmark 5G mmWave Automotive Test Results"

SOSA Aligned Development Platform Series from Elma Expanded to Include Midline CompacFrame

3U VPX mid-range platform accommodates up to eight cards with easy access for testing and development

October 7, 2021

Technology Highlights:

System development platform aligned with the SOSA™ Technical Standard, Edition 1.0
Up to eight air- or conduction-cooled slots for plug-in cards (PICs)
Tilted card cage for easier access and viewing

FREMONT, Calif., October 2021 – Elma Electronic Inc. is expanding its series of development platforms to include the 3U VPX mid-range CompacFrame that features up to eight slots. This larger platform is designed to Read More →

Newark launches new sensors-to-software solutions featuring NI and Omega

The new solutions from Newark are designed to save customers time and money in temperature monitoring, reliability testing and product-lifecycle evaluation.

October 7, 2021

Chicago, October 7, 2021: Newark, an Avnet Company and global distributor of electronic components, products and solutions, has introduced new configuration-based solutions featuring high-quality data acquisition software and hardware from NI coupled with market-leading sensors from Omega. The competitively priced solutions reduce the need to research system compatibility, saving customers time and money in temperature monitoring, reliability testing and product-lifecycle evaluation. Newark is the only global distributor offering these specific solutions.</ … Read More → "Newark launches new sensors-to-software solutions featuring NI and Omega"