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Yonsei University Researchers Develop Deep Learning Model for Microsatellite Instability-High Tumor Prediction

Patients with microsatellite instability-high (MSI-H) tumors are likely to have better clinical outcomes than other patients. Recently, researchers from Yonsei University College of Medicine have proposed MSI-SEER, a novel AI model for accurate MSI prediction as well as immune checkpoint inhibitor responsiveness prediction. The innovative technology is expected to help battle gastric and colorectal cancers and further cancer research in general.

One in every three people is expected to have cancer in their lifetime, making it a major health concern for mankind. A crucial indicator of the outcome of cancer is its tumor microsatellite status—whether it … Read More → "Yonsei University Researchers Develop Deep Learning Model for Microsatellite Instability-High Tumor Prediction"

Samtec Development and Evaluation Kits For Military Applications

August 2025: Samtec, Inc., the service leader in the connector industry, offers development and evaluation kits to ensure and validate that its interconnect products meet customers’ performance requirements. This includes mil/aero applications and using COTS and open standards products.

Development and Evaluation Kits

Samtec-designed evaluation and development kits featuring high-speed interconnect solutions help simplify design, from concept and prototype to development and production.

VITA defines and develops key computer bus, board, and system specifications, including VMEbus, PCI Mezzanine Card (PMC), VXS, VPX, VNX+, FMC™, FMC+™, QMC& … Read More → "Samtec Development and Evaluation Kits For Military Applications"

New Resource Center Equips Engineers with In-Depth High Voltage Relay Switching Expertise

August 2025, Clacton-on-Sea, UK:  Leading manufacturer of high performance reed relays, Pickering Electronics, has established its new High Voltage Reed Relay Resource Center, an online reference library of technical information for engineers building HV switching systems or … Read More → "New Resource Center Equips Engineers with In-Depth High Voltage Relay Switching Expertise"

Adaptec® SmartRAID 4300 Series of Accelerators Deliver Scalable, Secure NVMe® RAID Storage Solutions

CHANDLER, Ariz., August 5, 2025 —To better support server OEMs, storage systems, data centers and enterprise customers, Microchip Technology (Nasdaq: MCHP) has launched the Adaptec® SmartRAID 4300 series of NVMe® RAID storage accelerators. The new family is a feature-rich, secure, RAID-enabled, high-performance Software-Defined Storage (SDS) solution for NVMe deployments. The accelerators are especially suited for modern AI data center … Read More → "Adaptec® SmartRAID 4300 Series of Accelerators Deliver Scalable, Secure NVMe® RAID Storage Solutions"

Point2 Technology and Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect

SAN JOSE, Calif., Aug. 5, 2025 – Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions. This collaboration breaks new ground in AI cluster scalability, … Read More → "Point2 Technology and Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect"

Magnachip Introduces TOLT-Packaged 80V MXT MV MOSFET for E-Scooters and LEVs

SEOUL, South Korea, July 28, 2025 – Magnachip Semiconductor Corporation (“Magnachip” or “Company”) (NYSE: MX) today announced the release of a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package. The Company has already begun supplying the new MOSFET to a leading global electric motor manufacturer.

The TOLT-packaged MOSFET delivers a major advancement in thermal management. Unlike conventional TOLL (TO-Leadless) packages that dissipate heat through the bottom, the TOLT package is engineered to release heat directly from the top via a mounted metal heat sink. This innovative structure … Read More → "Magnachip Introduces TOLT-Packaged 80V MXT MV MOSFET for E-Scooters and LEVs"

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Jan 29, 2026
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