EEJournal

industry news archive
Subscribe Now

DDC-I Showcases Artificial Intelligence and Edge Processing Capabilities for Deos Safety-Critical RTOS at 17th Annual GVSETS Show

August 8, 2025

DDC-I Booth #733

Novi, MI – August 6, 2025. DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced that it will demonstrate the integration of Klepsydra’s artificial intelligence and edge processing capabilities with DDC-I’s Deos™ safety-critical DO-178C real-time operating system at the 17th Annual Ground Vehicle Systems Engineering & Technology Symposium (GVSETS) & Modernization Update. The show will be held August 12-14 at the Suburban Collection Showplace … Read More → "DDC-I Showcases Artificial Intelligence and Edge Processing Capabilities for Deos Safety-Critical RTOS at 17th Annual GVSETS Show"

TDK announces high-performance IMU to accelerate optical image stabilization adoption

August 7, 2025
  • TDK’s SmartMotion® high-performance optical image stabilization (OIS) solution brings crisp, blur-free photos and videos to a wide range of smartphones, tablets and cameras
  • The new custom sensing solution for OIS supports superb image stabilization and quality, even in low light
  • Now in production, the ICM-536xx IMU is immediately available to select customers by direct sales inquiry

August 7, 2025

TDK Corporation (TSE:6762) announces availability of the new InvenSense SmartMotion® ICM-536xx family of high-performance 6-axis IMUs to select customers, bringing high-performance optical image stabilization (OIS) to a wide range … Read More → "TDK announces high-performance IMU to accelerate optical image stabilization adoption"

EFBE and SGS unite to set new standards in bicycle and e-bike compliance

August 7, 2025
Geneva (August 6, 2025) – SGS, the world’s leading testing, inspection and certification company, is pleased to announce that EFBE Prüftechnik GmbH and EFBE Co., Ltd. (collectively EFBE) have joined the SGS family. This move expands SGS’s global capabilities in the bicycle and e-bike sector.

Based in Waltrop, Germany, with a subsidiary in Taichung, Taiwan, EFBE brings over 30 years of expertise in testing bicycles, e-bikes and components. Their services include advanced testing solutions, test bench design, laboratory and manufacturing audits and specialized … Read More → "EFBE and SGS unite to set new standards in bicycle and e-bike compliance"

Vishay Intertechnology Automotive Grade IHDM Inductors Offer Stable Inductance and Saturation at Temps to +180 °C

Featuring Powdered Iron Alloy Core Technology, Edge-Wound, Through-Hole Devices Provide Low DCR to Reduce Power Losses and Increase Efficiency
August 6, 2025

MALVERN, Pa. — Aug. 6, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced two new IHDM Automotive Grade edge-wound, through-hole inductors in the 1107 case size with soft saturation current to 422 A. Featuring a powdered iron alloy core technology, the Vishay Inductors Division’s IHDM-1107BBEV-2A and IHDM-1107BBEV-3A provide stable inductance and saturation over a demanding operating temperature range from -40 °C to +180 °C with low power losses and excellent heat dissipation.

The edge-wound coil of the devices released today provides low DCR down to 0.22 mΩ, which minimizes losses and improves rated current performance for increased efficiency. Compared … Read More → "Vishay Intertechnology Automotive Grade IHDM Inductors Offer Stable Inductance and Saturation at Temps to +180 °C"

Ceva’s 20 Billion Device Milestone Paves the Way for a New Era in Smart Edge Innovation

Achievement underscores Ceva’s technology leadership and deep industry partnerships for more than two decades, amid accelerating demand for ubiquitous edge AI
August 6, 2025

ROCKVILLE, MD., August 6, 2025 – In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva’s legacy as a foundational technology provider of the mobile and IoT eras, but sets the stage for the next phase of the company’s journey: bringing the power of on-device AI to every corner of the smart edge ecosystem, across consumer, automotive, industrial, mobile, PC and … Read More → "Ceva’s 20 Billion Device Milestone Paves the Way for a New Era in Smart Edge Innovation"

MIPI Alliance Releases I3C Basic v1.2 Utility and Control Bus Interface for Mobile, IoT and Data Center Applications

Growing ecosystem of developers and companies embrace the flexibility and ease-of-design benefits of I3C and I3C Basic
August 6, 2025

BRIDGEWATER, N.J., Aug. 6, 2025 – The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of MIPI I3C Basic v1.2, a scalable utility and control … Read More → "MIPI Alliance Releases I3C Basic v1.2 Utility and Control Bus Interface for Mobile, IoT and Data Center Applications"

Elma’s Liquid Cooling Test & Development Platform Easily Handles Power Densities of More Than 200 W

New VITA 48.4 chassis accommodates six 6U VPX plug-in cards and RTMs
August 6, 2025
Technical Highlights
  • Engineered in strict conformance with VITA 48.4 for liquid flow through cooling
  • Handles up to six 6U VPX cards using 200 W or more
  • High-performance power and ground backplane
  • Full rear transition support to facilitate testing and debugging

FREMONT, Calif., August 2025 – Elma Electronic’s Read More → "Elma’s Liquid Cooling Test & Development Platform Easily Handles Power Densities of More Than 200 W"

Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs

Arteris’ FlexGen smart NoC IP will be utilized by AMD in semiconductor designs to enable improved product performance and efficiency.
August 6, 2025

CAMPBELL, Calif., Aug. 04, 2025 (GLOBE NEWSWIRE) — In a market reshaped by the compute demands of AI, Arteris, Inc. (Nasdaq: AIP), a leading provider of semiconductor system IP for accelerating system-on-chip (SoC) creation, today announced AMD (Nasdaq: AMD), a global leader in high-performance and adaptive computing, has licensed FlexGen network-on-chip (NoC) interconnect IP for its next generation of AI chiplet design. FlexGen, Arteris’ smart NoC IP technology, will provide high-performance data transport in AMD chiplets powering AI across the company’s broad portfolio which spans from data centers to edge and end devices.

The strategic … Read More → "Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs"

Machine Learning-Based Design Enables More Efficient Wireless Power Transfer

The fully numerical technique uses machine learning and real-world circuit modeling to achieve stable, efficient wireless power transfer
August 6, 2025

Wireless power transfer (WPT) systems deliver electricity without cables but often struggle with voltage stability when loads change. In this study, researchers developed a machine learning-based design method that uses numerical optimization to achieve load-independent operation. Their approach ensures stable output voltage (fluctuations under 5%) and high efficiency (86.7%) under varying loads. This breakthrough simplifies WPT design and could help create more practical, reliable wireless power systems for a wide range of applications.

Wireless power transfer (WPT) systems transmit electrical energy from a power source to a load without physical connectors or wires, using electromagnetic fields. This idea goes … Read More → "Machine Learning-Based Design Enables More Efficient Wireless Power Transfer"

featured blogs
Everything You Ever Wanted to Know About Gyroscopic Precession (But Were Too Afraid to Ask)
Jan 29, 2026
Most of the materials you read and see about gyroscopic precession explain WHAT happens, not WHY it happens....
More from Max's Cool Beans...