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Concurrent launches Apollo: compact, rugged edge computing for modern defence missions

Designed for distributed and portable operations, Apollo delivers powerful processing, real-time coordination, and mission-ready reliability.
August 12, 2025

Concurrent, a leader in embedded computing solutions, has unveiled Apollo, a compact, rugged edge computing system engineered to meet the evolving needs of modern defence operations. Built to house a conduction-cooled SOSA®-aligned processor board with mission-centric I/O, Apollo delivers powerful processing in an ultra-compact, MIL-grade form factor, enabling deployment in constrained environments without sacrificing performance.

Compact power for the tactical edge

Apollo is not just a smaller box – it’s a fully capable tactical computing node. Designed for use cases where size, weight, … Read More → "Concurrent launches Apollo: compact, rugged edge computing for modern defence missions"

Innodisk Introduces DDR5 and LPDDR5X CAMM2 Memory Modules for Rugged Industrial Applications

Innodisk, a leading provider of industrial-grade memory solutions, officially releases its new DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) memory modules.
August 12, 2025

Innodisk’s new CAMM2 series features a distinctive design. DDR5 CAMM2 and LPDDR5X CAMM2 consolidate dual channels on a single module, effectively combining the capacity and performance of two separate SODIMMs into a compact footprint. Despite handling a greater signal load, the modules feature a more simplified PCB routing that enhances signal integrity, resulting in cleaner and more reliable data transmission.

Additionally, the new motherboard design, paired with the CAMM2 module, eliminates signal stubs caused by unused DIMM slots in traditional stacked configurations. The flat, board-hugging installation improves thermal contact and frees up space for customized … Read More → "Innodisk Introduces DDR5 and LPDDR5X CAMM2 Memory Modules for Rugged Industrial Applications"

Aitech to Debut New A230 Vortex AI GPGPU Supercomputer, Demonstrating Real-Time Pattern of Life Analysis and Asset Detection at the Ground Vehicle Systems Engineering & Technology Symposium (GVSETS) & Modernization Update

August 12, 2025

NOVI, Mich. (GVSETS, Booth 336) – Aug. 12, 2025 – Aitech, a global leader in AI-powered, rugged embedded computing systems for defense and space applications, announced the Aitech A230 Vortex AI GPGPU (general-purpose computing on graphics processing units) supercomputer, … Read More → "Aitech to Debut New A230 Vortex AI GPGPU Supercomputer, Demonstrating Real-Time Pattern of Life Analysis and Asset Detection at the Ground Vehicle Systems Engineering & Technology Symposium (GVSETS) & Modernization Update"

TDK expands ultra-low voltage TVS diode portfolio for high-speed consumer interfaces

August 12, 2025

August 12, 2025

TDK Corporation (TSE:6762) has expanded its ultra-low clamping voltage TVS diode lineup with three new models in the SD0201 series, tailored for high-speed consumer electronics interfaces. These TVS diodes offer compact protection for USB Type-C, HDMI, DisplayPort, and Thunderbolt connections in smartphones, laptops, tablets, wearables, and networking devices.

Each component comes in a 0201 chip-scale package (CSP), measuring just 0.58 x 0.28 x 0.15 mm (L x W x H) for space-constrained designs. Having working voltages of ±1 V, ±2 V, and ±3.6 V, the new TVS diodes safeguard sensitive circuits from electrostatic discharge (ESD) and transient surges. This means they … Read More → "TDK expands ultra-low voltage TVS diode portfolio for high-speed consumer interfaces"

Learn how to handle dynamic sensor data in your embedded IoT application with free training webinar from Direct Insight & ITTIA

Free online training workshop on August 28th will demonstrate how embedded systems engineers can make data handling ‘software-defined’
August 12, 2025

Oxfordshire, UK, August 2025: Direct Insight, the UK-based technical systems integrator & value-added reseller of system-on-module (SoM) & other embedded systems, working with its high performance data management partner, Read More → "Learn how to handle dynamic sensor data in your embedded IoT application with free training webinar from Direct Insight & ITTIA"

Wearable Devices Secures U.S. Patent for Groundbreaking Neural Interface Technology

Granted Patent Covers Neural Measurement of Weight, Torque and Force with Broad Applications in Brain-Computer Interfaces, Industry 4.0 and Extended Reality
August 11, 2025

YOKNEAM ILLIT, ISRAEL, Aug. 11, 2025 (GLOBE NEWSWIRE) —  Wearable Devices Ltd. (the “Company” or “Wearable Devices”) (Nasdaq: WLDS, WLDSW), a technology growth company specializing in artificial intelligence (“AI”)-powered … Read More → "Wearable Devices Secures U.S. Patent for Groundbreaking Neural Interface Technology"

Safran DSI to Supply Electric Propulsion Systems for AstroForge’s Upcoming Vestri Asteroid Mission

August 11, 2025

SALT LAKE CITY, Utah, August 11, 2025 – Safran Defense & Space, Inc. (Safran DSI), through its Space Solutions business unit, has been selected by AstroForge to manufacture and deliver  two EPS®X00 electric propulsion systems for the company’s upcoming Vestri asteroid mission, scheduled to launch in early 2026.

AstroForge, a California-based startup pioneering the field of asteroid mining, focuses on extracting valuable resources from asteroids, such as platinum group metals (PGMs) including platinum, palladium, rhodium, and iridium. These materials are rare and in high demand on Earth. Sourcing the resources from space offers the potential for significant supply and … Read More → "Safran DSI to Supply Electric Propulsion Systems for AstroForge’s Upcoming Vestri Asteroid Mission"

Teledyne HiRel Semiconductors Launches eMMC 5.1 Module

August 8, 2025
August 7, 2025

​Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments.​

Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for embedded applications in aerospace, defense, industrial … Read More → "Teledyne HiRel Semiconductors Launches eMMC 5.1 Module"

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