News – Page 61 – EEJournal

industry news archive

Intel and AWS Drive Cloud Innovation Powered by Xeon 6 Processors

Intel and AWS 8th Gen Amazon EC2 instances using Xeon 6 are now available, delivering high performance and faster memory bandwidth in the cloud.

August 20, 2025

What’s New: Intel® Xeon® 6 processors with P-cores are now powering the new Amazon Elastic Compute Cloud (EC2) R8i and R8I-flex instances, available on AWS, delivering the highest performance and fastest memory bandwidth among comparable Intel processors in the cloud.

The new instances reflect years of collaboration between Intel and AWS, bringing advanced silicon innovations and tightly integrated software optimizations to customers seeking scalable, cost-efficient and high-performance cloud infrastructure.

“The launch of the 8th Generation EC2 instances powered by Intel Xeon 6 is … Read More → "Intel and AWS Drive Cloud Innovation Powered by Xeon 6 Processors"

Bourns Introduces Shielded Power Inductor Series with Metal Alloy Powder Core Capable of Handling High Currents with Very Low DCR

The features designed into the automotive grade, AEC-Q200 compliant SRP3220A Series help reduce EMI to enhance performance and reliability in automotive applications

August 20, 2025

RIVERSIDE, Calif., August 20, 2025 – Bourns, Inc., a global manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its SRP3220A Series Shielded Power Inductors. Designed with Bourns’ uniquely-formulated metal alloy powder core, the series can handle high currents up to 11 A without saturating, and supports reliable operation in high-temperature environments. These automotive grade, AEC-Q200 compliant power inductors feature a high heating current rating and shielded construction that minimizes magnetic field radiation. The capabilities delivered with the SRP3220A Series also help enhance performance, thermal stability and meet demanding automotive temperature requirements making Bourns’ … Read More → "Bourns Introduces Shielded Power Inductor Series with Metal Alloy Powder Core Capable of Handling High Currents with Very Low DCR"

Kodiak Taps NXP’s ISO 26262-Compliant Processors and Interfaces to Help Operate Autonomous Trucks

August 20, 2025

NXP’s high-performance S32G3 vehicle network processor in combination with its S32K3 microcontroller and PMIC solutions support Kodiak’s AI-powered autonomous system’s controls for redundant braking, steering, throttle, and more.
NXP’s suite of processors used by Kodiak are compliant with ISO 26262’s highest automotive functional safety level, providing a foundation that supports systems designed to meet the stringent safety requirements set by Kodiak

MOUNTAIN VIEW, Calif. (August 20, 2025) —Read More → "Kodiak Taps NXP’s ISO 26262-Compliant Processors and Interfaces to Help Operate Autonomous Trucks"

Orbital Data Center Launching to ISS to Advance Space Computing

ISS National Lab-sponsored technology demonstration from Axiom Space and Red Hat to expand computing capabilities in space

August 19, 2025

KENNEDY SPACE CENTER (FL), Aug 19, 2025 – A cutting-edge orbital data center is set to launch to the International Space Station (ISS), marking an important step forward in advancing space-based computing. The project, sponsored by the ISS National Laboratory®, will test the system’s ability to provide increased data storage and real-time data processing in space—crucial capabilities for future commercial space stations.

ASRock Industrial Launches Ai InduAgent Powered by PEGAAi for On-Premise AI Inspection and Smart Factory Insights

August 19, 2025

Taipei, Taiwan (Aug 19, 2025) – In high-precision manufacturing environments, accuracy and efficiency are critical. ASRock Industrial, in collaboration with Pegatron, introduces Ai InduAgent, an on-premise AI solution that integrates automated optical inspection (AOI) with a local LLM agent technology to deliver real-time analysis and actionable insights on the factory floor. Designed to support PCB, SMT and mixed model production lines, Ai InduAgent with PEGAAi enables operators to interact with production data using natural language. The solution is deployed on the ASRock Industrial iEPF-10000S Series edge system, powered by Intel® Core Ultra processors and NVIDIA RTX™ 6000 Ada GPUs, delivering … Read More → "ASRock Industrial Launches Ai InduAgent Powered by PEGAAi for On-Premise AI Inspection and Smart Factory Insights"

Molex Introduces AirBorn 3U VPX Power Supply, Extending Innovation of Award-Winning 6U Platform within Compact VITA 62 Form Factor  

Designed for space-constrained environments, the new AirBorn 3U VPX Power Supply delivers efficient, rugged power with advanced EMI filtering for aerospace, defense and advanced technology applications requiring high performance in a compact form.

August 19, 2025

BittWare Launches Early Access Program for 3U VPX Cards Featuring Next-Generation AMD Ryzen Embedded Processors and Versal Adaptive SoCs for Aerospace and Defense Systems

The latest innovation from BittWare brings next-generation 3U VPX cards with AMD Ryzen Embedded Processors and Versal Adaptive SoCs to early adopters. This program accelerates the development of advanced aerospace and defense systems optimized for mission-critical performance and SWaP efficiency.

August 19, 2025

Siemens empowers Europe’s next generation of semiconductor innovators with Open Higher Education Program

August 14, 2025

Siemens accelerates student-led semiconductor innovation across Europe’s leading technical universities through Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton

Siemens Digital Industries Software announced today the Cre8Ventures Open Higher Education Program, an ambitious new initiative developed in collaboration with Arm and the University of Southampton’s School of Electronics and Computer Science (ECS), to foster entrepreneurial curiosity and accelerate student-led semiconductor innovation across Europe’s leading technical universities.

By integrating Siemens’ Cre8Ventures collaborative venturing initiative and its advanced multi-physics Digital Twin Marketplace, industry-leading Arm technology … Read More → "Siemens empowers Europe’s next generation of semiconductor innovators with Open Higher Education Program"

New high voltage programmable resistor modules from Pickering provide a simple solution for applications requiring voltage handling up to 1.2kV

PXI/PXIe simulation module offers a unique combination of high voltage capability, channel flexibility & broad resistance range

August 14, 2025

August 2025, Clacton-on-Sea, UK: Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced a new family of high voltage programmable resistor modules in a compact single-slot PXI and PXIe form factor, model Read More → "New high voltage programmable resistor modules from Pickering provide a simple solution for applications requiring voltage handling up to 1.2kV"

Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA

New Cadence Palladium Dynamic Power Analysis App enables designers of AI/ML chips and systems to create more energy-efficient designs and accelerate time to market

August 14, 2025

SAN JOSE, Calif., Aug. 13, 2025—Cadence (Nasdaq: CDNS) today announced a significant leap forward in the power analysis of pre-silicon designs through its close collaboration with NVIDIA. Leveraging the advanced capabilities of the Cadence^® Palladium^® Z3 Enterprise Emulation Platform, utilizing the new Cadence Dynamic Power Analysis (DPA) App, Cadence and NVIDIA have achieved what was … Read More → "Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA"

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